Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Azman Jalar, Mohamad Riduwan Ramli, Fakhrozi Che Ani.  (2022).  Effect of alloy particle size and stencil aperture shape on solder printing quality.  - Microelectronics International.  81-90. 

Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar.  (2022).  Temperature-Induced Thickness Reduction of Micromechanical Properties of Sn-0.7Cu Solder Alloy.  - Materiali in Tehnologije, Materials and Technology.  373-379. 

Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, Erwan Basiron, Fakhrozi Che Ani.  (2022).  Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages.  - IEEE Transactions on Components Packaging and Manufacturing Technology.  1492-1501. 

Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar.  (2022).  Kesan Rawatan Termomekanik dengan Mampatan Tunggal terhadap Mikrostruktur dan Sifat Mikromekanik Aloi Pateri Sn-0.7Cu.  - Sains Malaysiana.  3775-3784. 

Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin, Maria Abu Bakar.  (2021).  Electrical resistivity of Sn 3.0 Ag 0.5Cu solder joint with the incorporation of carbon nanotubes.  - Nanomaterials and Nanotechnology.  1-9. 

Nurul Adlin Mahadzir, Angela Amphawan, Tendai Masunda, P. Susthitha Menon, Azman Jalar, Maria Abu Bakar, Ahmad Ghadafi Ismail.  (2021).  Tapered waveguide design for mode conversion in mode division multiplexing (MDM).  - Optoelectronics and Advanced Materials Rapid Communications.  325-331. 

Syed Mohamad Mardzukey Syed Mohamed Zain, Azman Jalar, Maria Abu Bakar, Fakhrozi Che Ani, Mohamad Riduwan Ramli.  (2021).  Horizontal crack induced vertical crack formation in epoxy mold compound for electronic packaging.  - Journal of Microelectronics, Electronic Components and Materials.  261-266. 

Atiqah Mohd Afdzaluddin, Maria Abu Bakar.  (2020).  Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test.  - Sains Malaysiana.  3029-3036. 

Norliza Ismail, Maria Abu Bakar, Saiful Bahari Bakarudin.  (2020).  Effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach.  - Sains Malaysiana.  3073-3080. 

Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail, Nur Shafiqa Safee, Ahmad Ghadafi Ismail, Najib Saedi Ibrahim.  (2019).  Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/CNT/Cu menggunakan pelekukan nano.  - Sains Malaysiana.  1267-1272. 

Maria Abu Bakar, Azman Jalar, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, Ariffin Ismail, Norliza Ismail, Emee Marina Salleh, Najib Saedi Ibrahim.  (2019).  Kesan gelombang kejutan terhadap sifat mikromekanik sambungan Pateri SAC 0307/ENiG menggunakan pendekatan pelekukan nano.  - Sains Malaysiana.  1273-1279. 

Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, Maria Abu Bakar.  (2019).  Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition.  - Soldering & Surface Mount Technology.  102-108. 

Mohd Adly Rahmat Saat, Rozaidi Rasid, Maria Abu Bakar, Azman Jalar, Emee Marina Salleh.  (2019).  Mechanical properties of PE-PET-PS-PP blends produced by high shear mixing.  - Polimery.  676-679. 

Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim & Mohd Ariffin Ambak.  (2018).  Pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel.  - Sains Malaysiana.  . 

Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim, Mohd Ariffin Ambak.  (2018).  Controlling of intermetallic compound solder interconnection-printed circuit board using nickel coating.  - Sains Malaysiana.  .