muhammad nizam ilias, maria abu bakar, azman jalar, adlil aizat ismail, erwan basiron, sai song low.  (2025).  crack severity analysis in predicting solder joint reliability for mirrored flip chip ball grid array packages.  - journal of failure analysis and prevention.  1946 - 1959. 

azman jalar, ee may lim, maria abu bakar, adlil aizat ismail, fakhrozi che ani, choo par tan.  (2025).  enhancing ball grid array (bga) component on printed circuit board (pcb) solder joint integrity with antimony element.  - journal of failure analysis and prevention.  813 - 827. 

sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, wan nursheila wan jusoh, maria abu bakar, hassan basher, michael daenen.  (2025).  evaluation of nanoindentation load-depth of ultrasonic aluminium bond on molybdenum back contact layer of cigs thin film photovoltaic.  - journal of advanced research in micro and nano engineering.  58 - 65. 

nor rashikin abd khalid, muhammad khalil abdullah, maria abu bakar, syed mohamad mardzukey syed mohamed zain, mohamad riduwan ramli.  (2025).  thermal characteristics dependency of epoxy underfill on crosslinker molecular structures and hardener concentration in electronic packaging.  - journal of electronic packaging.  1 - 8. 

erwan basiron, adlil aizat ismail, azman jalar, maria abu bakar, azman ahmad .  (2025).  board level-component solder joints normalized crack severity index of solid-state drive with different reliability temperature cycle test profiles.  - ieee transactions on device and materials reliability.  473 - 480. 

ahmad zarif azahar, maria abu bakar, azman jalar, fakhrozi che ani.  (2024).  effect of die deflection during au wire bonding process on bonding quality in overhang semiconductor package.  - journal of materials engineering and performance.  5836 - 5845. 

adlil aizat ismail, maria abu bakar, azman jalar, fakhrozi che ani, zol effendi zolkefli, erwan basiron.  (2024).  undissolved gold in fine-pitch bga solder joint under thermal cycling test.  - journal of materials science: materials in electronics.  1-9. 

maria abu bakar, azman jalar, anuar alias.  (2024).  linear growth behaviour of intermetallic compound layer in electronic interconnections.  - science and technology of welding and joining.  1-9. 

mohamad solehin mohamed sunar, maria abu bakar, atiqah a., azman jalar, muhamed abdul fatah muhamed mukhtar, fakhrozi che ani.  (2024).  effect of pvd-coated wall aperture roughness on the life span of fine-pitch stencil printing.  - soldering & surface mount technology.  51-59. 

n. a. azzra, a. atiqah, h. fadhlina, a. jalar, m. a. bakar, a. g. ismail, a. b. m. supian.  (2024).  effect of nanofibril cellulose empty fruit bunch-reinforced thermoplastic polyurethane nanocomposites on tensile and dynamic mechanical properties for flexible substrates.  - polymer composites.  1 - 11. 

linghao wang, azman jalar, maria abu bakar, longhong dan.  (2024).  effect of deformation temperature on the dynamic recrystallization mechanism and dynamic precipitation behavior of mg-gd-nd-zr alloy.  - journal of alloys and compounds.  1 - 13. 

syafiqah afiq rosli, azman jalar, maria abu bakar.  (2024).  quantification of corrosion on cu wire bonding on ag-plated lead frame in hcl for automotive electronic application.  - international journal of automotive and mechanical engineering (ijame).  11596 - 11605. 

sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, wan nursheila wan jusoh, maria abu bakar, hassan basher, michael daenen.  (2024).  ultrasonic al bond on mo back-contact layer of cigs solar panel characterization using infinite focus microscope (ifm) and micro-ohmmeter.  - ieee transactions on components, packaging and manufacturing technology.  1123 - 1133. 

adlil aizat ismail, maria abu bakar, azman jalar, zol effendi zolkefli, erwan basiron, muhammad nizam ilias.  (2024).  laser rework process for efficient lead-free solder joints ball grid array (bga) component rework.  - ieee transactions on components, packaging and manufacturing technology.  735 - 742. 

sazan ali kamal mohammed, mohd zulhakimi ab razak, abdul hadi abd rahman, maria abu bakar.  (2024).  an efficient intersection over union algorithm for 3d object detection.  - ieee access.  169768 - 169786. 

n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

saraswathy supramaniam, maria abu bakar, a. atiqah, azman jalar, mohd zulhakimi ab. razak.  (2023).  moisture content and early corrosion detection of cu wire bonding in a semiconductor package.  - journal of failure analysis and prevention.  2362-2369. 

maria abu bakar, mohamad solehin mohamed sunar, azman jalar, a atiqah, fakhrozi che ani, ibrahym ahmad, zol effendi zolkefli.  (2023).  effect of sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications.  - sains malaysiana.  3247-3258. 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  cardinal and ordinal directions approach in investigating arrayed solder joints crack propagation of ball grid array semiconductor packages.  - ieee transactions on components packaging and manufacturing technology.  1492-1501. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, john burke, zol effendi zolkefli, erwan basiron.  (2022).  effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.  - scientific reports.  1-12. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, zol effendi zolkefli.  (2022).  thermal-induced damage on solder joints of high-density adjacent ball grid array components during the rework process.  - jurnal teknologi.  1-8. 

ahmad syazili md din, maria abu bakar, fakhrozi che ani, mohamad riduwan, muhamed abdul fatah muhamed mukhtar.  (2022).  kesan kadar suapan dan salutan bit pemotong dan terhadap kekemasan proses pemotongan pcb.  - jurnal teknologi.  119-126. 

saraswathy supramaniam, maria abu bakar, azman jalar.  (2022).  early corrosion detection of cu-ag wedge bonding in semiconductor package.  - journal of failure analysis and prevention.  2317-2325. 

maria abu bakar, atiqah mohd afdzaluddin, azman jalar.  (2022).  review on corrosion in electronic packaging trends of collaborative between academia-industry.  - sustainability.  1-33. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  kesan rawatan termomekanik dengan mampatan tunggal terhadap mikrostruktur dan sifat mikromekanik aloi pateri sn-0.7cu.  - sains malaysiana.  3775-3784. 

norliza ismail, azman jalar, atiqah afdzaluddin, maria abu bakar.  (2021).  electrical resistivity of sn 3.0 ag 0.5cu solder joint with the incorporation of carbon nanotubes.  - nanomaterials and nanotechnology.  1-9. 

nurul adlin mahadzir, angela amphawan, tendai masunda, p. susthitha menon, azman jalar, maria abu bakar, ahmad ghadafi ismail.  (2021).  tapered waveguide design for mode conversion in mode division multiplexing (mdm).  - optoelectronics and advanced materials rapid communications.  325-331. 

syed mohamad mardzukey syed mohamed zain, azman jalar, maria abu bakar, fakhrozi che ani, mohamad riduwan ramli.  (2021).  horizontal crack induced vertical crack formation in epoxy mold compound for electronic packaging.  - journal of microelectronics, electronic components and materials.  261-266. 

atiqah mohd afdzaluddin, maria abu bakar.  (2020).  effect of coating element on joining stability of sn-0.3ag-0.7cu solder joint due to aging test.  - sains malaysiana.  3029-3036. 

norliza ismail, maria abu bakar, saiful bahari bakarudin.  (2020).  effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach.  - sains malaysiana.  3073-3080. 

azman jalar, maria abu bakar, roslina ismail.  (2020).  temperature dependence of elastic-plastic properties of fine-pitch sac 0307 solder joint using nanoindentation approach.  - metallurgical and materials transactions a-physical metallurgy and material.  1221-1228. 

norliza ismail, azman jalar, maria abu bakar, nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail.  (2020).  microstructural evolution and micromechanical properties of sac305/cnt/cu solder joint under blast wave condition.  - soldering & surface mount technology.  47-56. 

norliza ismail, azman jalar, maria abu bakar, roslina ismail, najib saedi ibrahim.  (2020).  effect of flux functional group for solder paste formulation towards soldering quality of sac305/cnt/cu.  - soldering & surface mount technology.  157-164. 

norliza ismail, azman jalar, maria abu bakar, roslina ismail, nur shafiqa safee, ahmad ghadafi ismail, najib saedi ibrahim.  (2019).  kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian sn-ag-cu/cnt/cu menggunakan pelekukan nano.  - sains malaysiana.  1267-1272. 

maria abu bakar, azman jalar, wan yusmawati wan yusoff, nur shafiqa safee, ariffin ismail, norliza ismail, emee marina salleh, najib saedi ibrahim.  (2019).  kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri sac 0307/enig menggunakan pendekatan pelekukan nano.  - sains malaysiana.  1273-1279. 

wan yusmawati wan yusoff, norliza ismail, nur shafiqa safee, ariffin ismail, azman jalar, maria abu bakar.  (2019).  correlation of microstructural evolution and hardness properties of 99.0sn-0.3ag-0.7cu (sac0307) lead-free solder under blast wave condition.  - soldering & surface mount technology.  102-108. 

mohd adly rahmat saat, rozaidi rasid, maria abu bakar, azman jalar, emee marina salleh.  (2019).  mechanical properties of pe-pet-ps-pp blends produced by high shear mixing.  - polimery.  676-679. 

izhan abdullah, azman jalar, roslina ismail, maria abu bakar, muhammad nubli zulkifli,emee marina salleh.  (2019).  effect of tensile direction on microstructure evolution of sac305 solder wire.  - asm science journal.  53-59. 

hazian mamat, azman jalar, maria abu bakar.  (2019).  characterization on ph-isfet poly bisphenol hydrophobic encapsulation material.  - asm science journal.  65-70. 

maria abu bakar, azman jalar, mohd zulkifly abdullah, najib saedi ibrahim & mohd ariffin ambak.  (2018).  pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel.  - sains malaysiana.  . 

maria abu bakar, azman jalar, mohd zulkifly abdullah, najib saedi ibrahim, mohd ariffin ambak.  (2018).  controlling of intermetallic compound solder interconnection-printed circuit board using nickel coating.  - sains malaysiana.  .