azman bin jalar @ jalil;maria binti abu bakar.  (2024).  development of high reliability and high performance of interconnection technology and materials in electronic packaging.  - .  . 

mohamad solehin mohamed sunar, maria abu bakar, atiqah a., azman jalar, muhamed abdul fatah muhamed mukhtar, fakhrozi che ani.  (2024).  effect of pvd-coated wall aperture roughness on the life span of fine-pitch stencil printing.  - soldering & surface mount technology.  51-59. 

atiqah binti mohd afdzaluddin;azman bin jalar @ jalil;maria binti abu bakar;lim kar keng.  (2024).  study on fiber treatment process of oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices.  - .  . 

nik athirah azzra, atiqah afdzaluddin, azman jalar, ahmad ghadafi ismail, zahra dashtizadeh.  (2024).  physical and electrical properties of sustainable substrate thermoplastic starch/nanocellulose fibre/stannous oxide.  - journal of advanced research in applied sciences and engineering technology.  93-101. 

naif h. al-hardan, muhammad azmi abdul hamid, chaker tlili, azman jalar, mohd firdaus raih, naser m. ahmed.  (2024).  measurements and instrumentation for machine vision.  - .  26. 

adlil aizat ismail, maria abu bakar, azman jalar, fakhrozi che ani, zol effendi zolkefli, erwan basiron.  (2024).  undissolved gold in fine-pitch bga solder joint under thermal cycling test.  - journal of materials science: materials in electronics.  1-9. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, zol effendi zolkefli, erwan basiron.  (2023).  thermal management on the solder joints of adjacent ball grid array (bga) rework components using laser soldering.  - green materials and electronic packaging interconnect technology symposium (epits 2022).  103-113. 

wang, l., jalar, a. & dan, l.  (2023).  dynamic precipitation and dynamic recrystallization behaviors of mg-gd-nd-zr magnesium alloy during thermal compression deformation.  - journal of materials research and technology.  7634-7648. 

saraswathy supramaniam, subashini periasamy, muhammad nurhisham, maria abu bakar, azman jalar.  (2023).  measurement of aluminium remnant thickness on copper wire bonding using 3d laser scanning microscope.  - ieee international symposium on the physical and failure analysis of integrated circuits (ipfa).  1-6. 

naif h m al-hardan, muhammad azmi abdul hamid, azman jalar, mohd firdaus-raih.  (2023).  unleashing the potential of gallium oxide: a paradigm shift in optoelectronic applications for image sensing and neuromorphic computing applications.  - materials today physics.  1-24. 

naif h. al-hardan, mohd firdaus-raih, muhammad azmi abdul hamid, azman jalar.  (2023).  real-time viral detection through electrolyte-gated field effect transistors: possibility of rapid covid-19 detection.  - critical reviews in solid state and materials sciences.  194-220. 

n.a. azra, a. atiqah, a. jalar, g. manar, a.b.m. supian, r.a. ilyas.  (2023).  sustainable substrate tin oxide/nanofibril cellulose/thermoplastic starch: dimensional stability and tensile properties.  - journal of materials research and technology.  99-108. 

maria abu bakar, mohamad solehin mohamed sunar, azman jalar, a atiqah, fakhrozi che ani, ibrahym ahmad, zol effendi zolkefli.  (2023).  effect of sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications.  - sains malaysiana.  3247-3258. 

m. deraman, m. a. r. othman, s. a. shamsudin, f. s. omar, h. s. kumar and a. jalar.  (2023).  self-discharge of supercapacitors.  - self-discharge of supercapacitor.  1. 

saraswathy supramaniam, maria abu bakar, a. atiqah, azman jalar, mohd zulhakimi ab. razak.  (2023).  moisture content and early corrosion detection of cu wire bonding in a semiconductor package.  - journal of failure analysis and prevention.  2362-2369. 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2023).  corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process.  - .  . 

maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail.  (2023).  development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach.  - .  . 

sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, maria abu bakar, wan nursheila wan jusoh, hassan basher, michael daenen.  (2023).  effect of ultrasonic process parameter on resistance and plastic deformation of the aluminum ribbon bond on molybdenum layer.  - 8th ieee region 10 conference, tencon 2023.  1288-1292. 

n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

azman jalar, zaidi embong, norinsan kamil othman, najmiddin yaakob, maria abu bakar.  (2023).  proceeding of the 7th international corrosion prevention symposium for research scholars (corsym 2021).  - proceeding of the 7th international corrosion prevention symposium for research scholars (corsym 2021).  1-255. 

linghao wang, azman jalar, longhong dan.  (2023).  effect of nd on microstructure and mechanical properties of mg-7gd-0.5zr alloy.  - journal of alloys and compounds.  1-14. 

maria abu bakar, azman jalar, fakhrozi che ani.  (2023).  pematerian gelombang pin menerusi lubang.  - .  191. 

zhiyong li, azman jalar.  (2023).  study on forming and properties of heat resistant low expansion high silicon aluminum alloy based on genetic algorithm.  - 2023 international conference on mechatronics, iot and industrial informatics (icmiii).  292-296. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2023).  effect of thermomechanical treatment on microstructural and localized micromechanical properties of sn0.7cu solder alloy.  - green materials and electronic packaging interconnect technology symposium (epits 2022).  133-144. 

a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - .  21. 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

f.c. ani, a.a. saad, a. jalar, c.y. khor, m.a. abas, z. bachok.  (2022).  recent progress in lead-free solder technology.  - .  332. 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

mohd arif anuar mohd salleh, mohd sharizal abdul aziz, azman jalar, mohd izrul izwan ramli.  (2022).  recent progress in lead-free solder technology.  - .  332. 

m. s. mohamed sunar, m. abu bakar, a. jalar, f. che ani, m . r. ramli.  (2022).  effect of stencil wall aperture on solder paste release via stencil printing.  - international conference on electronic and advanced materials (iceam 2021) - journal of physics: conference series.  1-6. 

m. f. suhaimi, m. abu bakar, a. jalar, f. che ani, m. r. ramli.  (2022).  thermal cycling effect on the crack formation of solder joint in ball grid array package.  - international conference on electronic and advanced materials (iceam 2021) journal of physics: conference series.  1-5. 

saraswathy supramaniam, maria abu bakar, azman jalar.  (2022).  early corrosion detection of cu-ag wedge bonding in semiconductor package.  - journal of failure analysis and prevention.  2317-2325. 

ensaf mohammed. al-khalqi, muhammad azmi abdul hamid, naif h. al-hardan, lim kar keng, azman jalar.  (2022).  magnesium-doped zno nanorod electrolyte insulator semiconductor (eis) sensor for detecting calcium ions.  - journal of materials science: materials in electronics.  1618-1630. 

ensaf mohammed alkhalqi, muhammad azmi abdul hamid, naif h. alhardan, lim kar keng, azman jalar.  (2022).  magnesium doped zno nanorod electrolyte-insulator-semiconductor (eis) sensor for detecting organic solvents..  - ieee sensors journal.  11783-11790. 

hassan basher ,muhammad nubli zulkifli ,azman jalar , michael daenen.  (2022).  temperature cycling test on ultrasonic aluminum bonds and conductive adhesive of copper indium gallium (di)selenide (cigs) thin-film photovoltaic solar panel.  - ieee journal of photovoltaics.  1418-1427. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  kesan rawatan termomekanik dengan mampatan tunggal terhadap mikrostruktur dan sifat mikromekanik aloi pateri sn-0.7cu.  - sains malaysiana.  3775-3784. 

aiman hakim badarisman, khirullah abdul hamid, hamizan ideris, maria abu bakar, azman jalar.  (2022).  effects of molding temperature on delamination of small outline transistor (sot).  - international conference on electronic and advanced materials (iceam 2021).  1-7. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages.  - international conference on electronic and advanced materials 2021 (iceam 2021).  1-5. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  intermetallic compound thickness of ball grid array solder joints under thermal cycling test using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-4. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, fakhrozi che ani, zol effendi zolkefli.  (2022).  effects of underfill materials on behavior of intermetallic compound thickness of ball grid array solder joints using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-5. 

abdul a. omar, azman jalar, khirullah a.hamid.  (2022).  evolution of discrete semiconductor copper wedge bond in biased temperature humidity chamber.  - jurnal teknologi.  129-135. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  effects of electrolyte towards copper wire metallurgical interconnection in semiconductor.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

maria abu bakar, atiqah mohd afdzaluddin, azman jalar.  (2022).  review on corrosion in electronic packaging trends of collaborative between academia-industry.  - sustainability.  1-33. 

p. vijayakumaran, m. h. m. ramli, m. selvam, k. hamid, a. atiqah, a. jalar, m. a. bakar.  (2022).  reduce wafer remnants through pre-assembly process optimization.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

fateh ameera mohd yusoff, maria abu bakar, azman jalar.  (2022).  effect of 60% thickness reduction of sn-cu solder alloy on localized micromechanical properties via nanoindentation approach.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

maria binti abu bakar;azman bin jalar @ jalil.  (2022).  pencirian mikrostruktur dan sifat mekanik sambungan pateri pic halus dalam pakej elektronik.  - .  . 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  microstructural characterization of copper wire bonding in semiconductor packaging.  - .  . 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  wedge bond corrosion of copper wire bonding.  - .  . 

ahmad ghadafi bin ismail;azman bin jalar @ jalil;abang annuar ehsan;mohd zulhakimi bin ab razak @ mamat.  (2022).  hybrid patterning of organic semiconducting materials using numerical control milling and laser beam.  - .  . 

ahmad ghadafi bin ismail;azman bin jalar @ jalil;abang annuar ehsan;mohd farhanulhakim bin mohd razip wee;mohd zulhakimi bin ab razak @ mamat.  (2022).  enhanced micro-scale computer numerical control milling and laser ablation to pattern organic semiconductors .  - .  . 

a atiqah, fa sabaruddin, n ismail, a jalar, ma bakar, aa hamzah, ra ilyas, m asrofi.  (2022).  industrial applications of nanocellulose and its nanocomposites.  - .  22. 

fateh amera mohd yusoff, azman jalar.  (2022).  influence of thermomechanical processing on micromechanical properties of sn-0.7cu solder alloy via nanoindentation approach.  - jurnal teknologi.  25-31. 

nur farisa nadia mohmad lehan, wan yusmawati wan yusoff, ku zarina ku ahmad, norliza ismail, azuraida amat, nor azlian abdul manaf, mohamad faizal abdullah, azman jalar, irman abdul rahman, emee marina salleh.  (2022).  influence of gamma radiation on eutectic phase area and hardness properties of sac305 solder.  - jurnal teknologi.  113-118. 

nik ahmad nizam nik zainuddin, nur yashidar mohamad yasin, nur syazreen ardnan, chee keat gan, mohd fakrul naim muhammad zin, azman jalar.  (2022).  voltage bias enhancement for leakage test on discrete products to detect low contact.  - 39th international electronics manufacturing technology conference (iemt).  1-5. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, john burke, zol effendi zolkefli, erwan basiron.  (2022).  effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.  - scientific reports.  1-12. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  cardinal and ordinal directions approach in investigating arrayed solder joints crack propagation of ball grid array semiconductor packages.  - ieee transactions on components packaging and manufacturing technology.  1492-1501. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

a. atiqah, n. ismail, k.k. lim, a. jalar, m.a. bakar, m.a. maleque, r.a. ilyas, a.b.m. supian.  (2022).  recycling of plastics, metals, and their composites.  - .  15. 

naif h. al-hardan, muhammad azmi abdul hamid, lim kar keng, ensaf mohammed al-khalqi, azman jalar, wee siong chiu.  (2021).  low-cost fabrication of a ph sensor based on writing directly over parchment-type paper with pencil.  - journal of materials science: materials in electronics.  9431-9439. 

syed mohamad mardzukey syed mohamed zain, azman jalar, maria abu bakar, fakhrozi che ani, mohamad riduwan ramli.  (2021).  horizontal crack induced vertical crack formation in epoxy mold compound for electronic packaging.  - journal of microelectronics, electronic components and materials.  261-266. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2021).  hubungan peratus mampatan dalam rawatan termomekanikal ke atas sifat mikromekanikal aloi pateri sn-cu menggunakan pendekatan pelekukan nano.  - jurnal fizik malaysia.  10054-10064. 

ahmad ghadafi bin ismail;azman bin jalar @ jalil;mohd zulhakimi bin ab razak @ mamat;teh chin hoong.  (2021).  thiophene-based organic thin film transistors.  - .  . 

azman bin jalar @ jalil;mohd zulhakimi bin ab razak @ mamat;maria binti abu bakar.  (2021).  mikrostruktur dan sifat superplastik aloi pateri bebas plumbum.  - .  . 

azman bin jalar @ jalil;mohd zulhakimi bin ab razak @ mamat;maria binti abu bakar.  (2021).  penentuan sifat kesuperplastikan bagi bahan aloi pateri hijau.  - .  . 

norliza ismail, azman jalar, atiqah afdzaluddin, maria abu bakar.  (2021).  electrical resistivity of sn 3.0 ag 0.5cu solder joint with the incorporation of carbon nanotubes.  - nanomaterials and nanotechnology.  1-9. 

naif h. al-hardan, muhammad azmi abdul hamid, mohd firdaus-raih, lim kar keng, ensaf mohammed al-khalqi, azman jalar.  (2021).  calcium ion-selective electrode based on the facile synthesis of cuo over cu wires.  - journal of materials science: materials in electronics.  1-12. 

hassan basher , muhammad nubli zulkifli , azman jalar, michael daenen.  (2021).  effect of ultrasonic bonding parameters on the contact resistance and bondability performances of cigs thin film photovoltaic solar panel.  - ieee journal of photovoltaics.  345-353. 

naif h. al-hardan, muhammed azmi abdul hamid, azman jalar, mohd firdaus-raih.  (2021).  aluminium modified zno nanoparticles synthesized through co-precipitation.  - nanotechnology malaysia annual symposium.  1-7. 

noor fadhilah rahmat, wan yusmawati wan yusoff, nor azlian abdul manaf, azman jalar, nur shafiqa safee, azuraida amat, nurazlin ahmad, irman abdul rahman, norliza ismail, najib saedi ibrahim.  (2021).  effect of gamma radiation on micromechanical behavior of snpb solder alloy.  - zulfaqar journal of defence science, engineering & technology.  45-50. 

noor fadhilah rahmat, wan yusmawati wan yusoff, azman jalar, azuraida amat, irman abdul rahman, najib saedi ibrahim.  (2021).  effect of gamma radiation on micromechanical behaviour of sac305 solder.  - 7th international conference on solid state science and technology (icssst 2019).  535-540. 

naif h. al-hardan, muhammed azmi abdul hamid, azman jalarc and mohd firdaus-raihd.  (2021).  morphology studies of zno doped al nanoparticles for potential use in sensing applications.  - 29th scientific conference of microscopy society of malaysia (scmsm2021).  1-6. 

ensaf mohammed. al-khalqi, muhammad azmi abdul hamid, roslinda shamsudin, naif h. al-hardan, lim kar keng, azman jalar.  (2021).  zinc oxide nanorods electrolyte insulator semiconductor sensors for enhanced 2-methoxythanol selectivity.  - ieee sensors journal.  6234-6240. 

hassan basher, muhammad nubli zulkifli, mohd khairil rahmat, muhammad ghazali abdul rahman, azman jalar, michael daenen.  (2021).  bondability of ultrasonic aluminum bonds on the molybdenum (de) selenide and molybdenum of back contact layer of copper indium gallium (de)selenide cigs thin film photovoltaic solar panel.  - solar energy.  516-522. 

nurul adlin mahadzir, angela amphawan, tendai masunda, p. susthitha menon, azman jalar, maria abu bakar, ahmad ghadafi ismail.  (2021).  tapered waveguide design for mode conversion in mode division multiplexing (mdm).  - optoelectronics and advanced materials rapid communications.  325-331. 

joon shyan tan, wai wai lee, a. atiqah, khirullah abdul hamid, azman jalar, maria abu bakar.  (2021).  the effect of electrolytic deflash current on delamination of epoxy mold compound during tin plating process.  - 2021 ieee regional symposium on micro and noelectronics (rsm).  73-75. 

nadia nor ahmad taufiq, khirullah abdul hamid, aiman hakim badarisman, hamizan ideris, azman jalar, maria abu bakar.  (2021).  elucidation of metal etching defects through the experimental design process characterization at encapsulation and electro-deflashing processes.  - 2021 ieee regional symposium on micro and nanoelectronics (rsm).  69-72. 

azman jalar, syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli, maria abu bakar.  (2021).  effect of potting encapsulation on crack formation and propagation in electronic package.  - the international conference on innovative technology, engineering and sciences 2020 (icites 2020).  351-357. 

syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli, azman jalar, maria abu bakar.  (2021).  effect of moisture content on crack formation during reflow soldering of ball grid array (bga) component.  - the international conference on innovative technology, engineering and sciences 2020 (icites 2020).  309-314. 

khirullah abdul hamid, maria abu bakar, azman jalar, aiman hakim badarisman.  (2021).  incorporation of big data in methodology of identifying corrosion factors in the semiconductor package.  - 2021 international conference on electrical, communication, and computer engineering (icecce).  1-4. 

norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - .  121. 

nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail, norliza ismail, maria abu bakar, azman jalar.  (2020).  effect of blast wave on intermetallics formation, hardness and reduced modulus properties of solder joints.  - 30th regional conference of solid state science and technology (solid state phenomena).  31-36. 

azman jalar, maria abu bakar, mohd. zulhakimi ab. razak, norliza ismail.  (2020).  morphological effect on the intermetallic compound layer growth kinetics of metallurgical joining.  - 30th regional conference of solid state science and technology (solid state phenomena).  26-30. 

maria abu bakar, azman jalar, norliza ismail1, ahmad ghadafi ismail, najib saedi ibrahim.  (2020).  solderability of coloured lead free solder composite.  - 30th regional conference of solid state science and technology (solid state phenomena).  15-19. 

m. s. rusdi, m. z. abdullah, m. h. h. ishak, m. s. abdul aziz, m. k. abdullah & p. rethinasamy, a. jalar.  (2020).  three-dimensional cfd simulation of the stencil printing performance of solder paste.  - international journal of advanced manufacturing technology.  3351-3359. 

azman jalar, maria abu bakar, roslina ismail.  (2020).  temperature dependence of elastic-plastic properties of fine-pitch sac 0307 solder joint using nanoindentation approach.  - metallurgical and materials transactions a-physical metallurgy and material.  1221-1228. 

norliza ismail, azman jalar, maria abu bakar, nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail.  (2020).  microstructural evolution and micromechanical properties of sac305/cnt/cu solder joint under blast wave condition.  - soldering & surface mount technology.  47-56. 

a. atiqah, m.n.m ansari, m.s.s. kamal, a. jalar, n.n. afeefah, n. ismail.  (2020).  effect of alumina trihydrate as additive on the mechanical properties of kenaf polyester composite for plastic encapsulated electronic packaging application.  - journal of materials research and technology.  12899-12890. 

a. s ashikin, g. omar, n. tamaldin, s. jasmee, h. a hamid, a. jalar, f. che ani.  (2020).  thermo-mechanical and adhesion performance of silver-filled conductive polymer composite (sfcp) using thermoplastic polyurethane (tpu) substrate.  - international journal of nanoelectronics and materials.  419-430. 

norliza ismail, azman jalar, maria abu bakar, roslina ismail, najib saedi ibrahim.  (2020).  effect of flux functional group for solder paste formulation towards soldering quality of sac305/cnt/cu.  - soldering & surface mount technology.  157-164. 

norliza ismail, azman jalar, wan yusmawati wan yusoff, nur shafiqa safee, ariffin ismail.  (2020).  effect of shock wave on constant load behaviour of pb-free/cnt solder joint.  - sains malaysiana.  3037-3044. 

rabiah al adawiyah ab rahim, muhammad nubli zulkifli, azman jalar, atiqah mohd afdzaluddin, kim siow shyong.  (2020).  effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts).  - sains malaysiana.  3045-3054. 

izhan abdullah, muhammad nubli zulkifli, azman jalar @ jalil, roslina ismail, mohd arrifin ambak.  (2019).  relationship of mechanical and micromechanical properties with microstructural evolution of sn-3.0ag-0.5cu (sac305) solder wire under varied tensile strain rates and temperatures.  - journal of electronic materials.  2826-2839. 

norinsan kamil bin othman;azman bin jalar @ jalil;siti aisyah binti shamsudin.  (2019).  mekanisma kesan migrasi elektrokimia pada sambungan pes aloi pateri terhadap papan litar bercetak (pcb) dan mems dalam simulasi larutan badan(sbf).  - .  1-12. 

m. a.fatah m. mukhtar, a. abas, m. s. haslinda, f. che ani, azman jalar @ jalil, a. a. saad, m. z. abdullah, r. ismail.  (2019).  effect of different s ac based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation.  - journal of applied fluid mechanics.  1683-1696. 

muhammad azmi bin abdul hamid;roslinda binti shamsudin;azman bin jalar @ jalil;siti aisyah binti shamsudin.  (2019).  detection of organic liquids using zinc oxide nanorods based on electrolyte-insulator-semiconductor (eis) sensors..  - .  . 

mohd adly rahmat saat, rozaidi rasid, maria abu bakar, azman jalar, emee marina salleh.  (2019).  mechanical properties of pe-pet-ps-pp blends produced by high shear mixing.  - polimery.  676-679. 

h. mamat, a. tuhaime, azman jalar @ jalil.  (2019).  the study on effect of colour electrolyte reference electrode.  - 2018 ieee conference on open systems (icos).  60-64. 

norliza ismail, azman jalar, maria abu bakar, roslina ismail, nur shafiqa safee, ahmad ghadafi ismail, najib saedi ibrahim.  (2019).  kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian sn-ag-cu/cnt/cu menggunakan pelekukan nano.  - sains malaysiana.  1267-1272. 

rabiah al adawiyah ab rahim, azman jalar, maria abu bakar, siow kim shyong.  (2019).  effect of substrate surface roughness on the growth of intermetallic compound layer lead free solder joint.  - .  1-5. 

muhammad nubli zulkifli, fuaida harun, azman jalar @ jalil.  (2019).  effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds.  - microelectronics international.  62-67. 

wan yusmawati wan yusoff, norliza ismail, nur shafiqa safee, ariffin ismail, azman jalar, maria abu bakar.  (2019).  correlation of microstructural evolution and hardness properties of 99.0sn-0.3ag-0.7cu (sac0307) lead-free solder under blast wave condition.  - soldering & surface mount technology.  102-108. 

izhan abdullah, azman jalar, roslina ismail, maria abu bakar, muhammad nubli zulkifli,emee marina salleh.  (2019).  effect of tensile direction on microstructure evolution of sac305 solder wire.  - asm science journal.  53-59. 

muhammad nubli zulkifli, azman jalar @ jalil, fuaida harun.  (2019).  effect of conventional and granular capillaries usage on the bondability, reliability, and manufacturability of gold wedge bonds.  - ieee transactions on components packaging and manufacturing technology.  763-769. 

hazian mamat, azman jalar, maria abu bakar.  (2019).  characterization on ph-isfet poly bisphenol hydrophobic encapsulation material.  - asm science journal.  65-70. 

maria abu bakar, azman jalar, wan yusmawati wan yusoff, nur shafiqa safee, ariffin ismail, norliza ismail, emee marina salleh, najib saedi ibrahim.  (2019).  kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri sac 0307/enig menggunakan pendekatan pelekukan nano.  - sains malaysiana.  1273-1279. 

norliza ismail, maria abu bakar, azman jalar, muhammad amer hariths jasmin.  (2019).  mechanical properties of sn based lead free solder under different temperature.  - iop conference series: materials science and engineering.  1-5. 

zuraihana bachok, abdullah aziz saad,fakhrozi che ani,azman jalar, mohamad aizat abas.  (2018).  structural assessment of lead free solder joint of miniaturized electronics assembly.  - international journal of integrated engineering.  . 

maria abu bakar, azman jalar.  (2018).  teknologi semikonduktor dan nanoelektronik : perkembangan dan kegunaan.  - .  32. 

maria abu bakar, azman jalar & roslina ismail.  (2018).  kesan kemasan permukaan berbeza terhadap sifat mikromekanik sambungan pateri sac 0307 menggunakan pendekatan pelekukan nano.  - sains malaysiana.  . 

emee marina salleh, zaifol samsu, norinsan kamil othman, azman jalar.  (2018).  kesan suhu celupan ke atas mikrostruktur dan kekerasan salutan aluminium pada keluli karbon.  - sains malaysiana.  . 

norliza ismail, roslina ismail, azman jalar, ghazali omar, emee marina salleh, norinsan kamil, irman abdul rahman.  (2018).  comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability.  - journal of materials science: materials in electronics.  . 

c. sarveswaran, emee marina salleh, a. jalar, z. samsudin, m. yusuf tura ali & n.k. othman.  (2018).  electrochemical migration behaviour on sac305, sac0307 and sac0307-0.03p-0.005ni solder alloy paste using water drop method (wdt) in simulated body fluid (sbf).  - 5th international corrosion prevention symposium for research scholars (corsym 2018).  31-32. 

nor rahafza abdul manap, roslinda shamsudin, mohd norhafsam maghpor, muhammad azmi abdul hamid, azman jalar.  (2018).  adsorption isotherm and kinetic study of gas-solid system of formaldehyde on oil palm mesocarp bio-char: pyrolysis effect.  - journal of environmental chemical engineering.  . 

fakhrozi che ani, azman jalar, abdullah aziz saad, chu yee khor, roslina ismail, zuraihana bachok, mohamad aizat abas, norinsan kamil othman.  (2018).  sac tio2 nano reinforced lead free solder joint characterizations in ultra fine package assembly.  - soldering surface mount technology.  1-13. 

roslina ismail, maria abu bakar, azman jalar.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - .  13. 

maria abu bakar, azman jalar, mohd zulkifly abdullah, najib saedi ibrahim & mohd ariffin ambak.  (2018).  pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel.  - sains malaysiana.  . 

nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail, norliza ismail, emee marina salleh, maria abu bakar & azman jalar.  (2018).  shock wave effect on micromechanics properties of sn-agcu solder (sac 387) via nanoindentation.  - the 3rd international conference on manufacturing, material and metallurgical engineering.  . 

emee marina salleh, norinsan kamil othman & azman jalar.  (2018).  electrochemical migration behaviour of sac305 solder in various concentrations of sodium hydroxide solution.  - sains malaysiana.  . 

f. che ani, a. jalar, r. ismail, z. mustafa, a.a. saad, c.y. khor, n. k. othman, m.y. tura ali, m.a.fatah m.mukhtar, aizat aba.  (2018).  tio2 nanoparticles reinforced lead free 96.5 sn 3.0ag 0.5cu solder paste for ultra fine package assembly in reflow soldering process.  - journal of advanced manufacturing technology.  . 

m.a.fatah m.mukhtar, aizat abas, m.s haslinda, f. che ani, m. z. abdullah, a.jalar & r. ismail.  (2018).  discrete phase model (dpm) study of nano-reinforced lead free solder sn-3.0 ag-0.5 cu (sac305).  - international conference on aerospace and mechanical engineering (aeromech17).  . 

norliza ismail, azman jalar, maria abu bakar, roslina ismail.  (2018).  kesan penambahan tiubnano karbon terhadap pertumbuhan lapisan sebatian antara logam sistem pateri sn-ag-cu/cu akibat penuaan terma.  - sains malaysiana.  . 

maria abu bakar, azman jalar, roslina ismail.  (2018).  penilaian semula pengukuran kuantitatif stereometri terhadap pertumbuhan sebatian antara logam bagi sambungan pateri.  - sains malaysiana.  . 

f. che ani, a. jalar, a. a. saad, c. y. khor, r. ismail, z. bachok, m. a. abas & n. k. othman.  (2018).  the influence of fe2o3 nano-reinforced sac lead-free solder in the ultra-fine electronics assembly.  - the international journal of advanced manufacturing technology.  . 

izhan abdullah, muhammad nubli zulkifli, azman jalar, r. ismail.  (2018).  deformation behavior relationship between tensile and nanoindentation tests of sac305 lead-free solder wire.  - soldering & surface mount technology.  194-202. 

hazian mamat, a tuhaime, azman jalar.  (2018).  the study on effect of colour electrolyte reference electrode.  - ieee conference on open systems, icos 2018.  . 

maria abu bakar, azman jalar, mohd zulkifly abdullah, najib saedi ibrahim, mohd ariffin ambak.  (2018).  controlling of intermetallic compound solder interconnection-printed circuit board using nickel coating.  - sains malaysiana.  . 

maria abu bakar, azman jalar & roslina ismail.  (2018).  kesan pigmen pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri.  - sains malaysiana.  . 

azman jalar, maria abu bakar, roslina ismail, najib saedi ibrahim, mohd ariffin ambak.  (2018).  kesan pigmen pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri sn-3.0ag-0.5cu.  - sains malaysiana.  . 

c. sarveswaran, emee marina salleh, a. jalar, z. samsudin, m. yusuf tura ali, f. che ani, and n. k. othman.  (2017).  investigation of corrosion on sac 305, sac 0307 and sac 0307-0.03 p-0.005 ni solder paste alloys in simulated body fluid (sbf).  - the 1st ukm-isesco-comsats international workshop on nanotechnology for young scientists ,aip conference proceeding.  1-7. 

izhan abdullah, muhammad nubli zulkifli, azman jalar, roslina ismail,.  (2017).  deformation behaviour of sn-3.0 ag-0.5 cu (sac305) solder wire under varied tensile strain rates.  - soldering & surface mount technology.  110-117. 

nor rahafza abdul manap, roslinda shamsudin, mohd norhafsam maghpor, muhammad azmi abdul hamid & azman jalar.  (2017).  sifat kinetik dan isoterma penjerapan formaldehid ke atas komposit serbuk serat kelapa sawit-tio2.  - sains malaysiana.  953-965. 

c. sarveswaran, emee marina salleh, a. jalar, z. samsudin, m. yusuf tura ali, f. che ani and n. k. othman.  (2017).  investigation of corrosion on sac 305, sac 0307 and sac 0307-0.03 p-0.005 ni solder paste alloys in simulated body fluid (sbf).  - american institute of physics (aip) conference proceedings.  . 

nnm fedzir, wyw yusoff, a jalar.  (2017).  effect of substrate pre-soldering temperature on wettability of sac387 lead-free solder.  - journal of fundamental and applied sciences.  154-166. 

naif h. al-hardan, muhammad azmi abdul hamid, azman jalar, roslinda shamsudin and norinsan kamil othman.  (2017).  synthesis of magnesium-doped zno rods via hydrothermal method: a study of the structural and optical properties.  - ecs journal of solid state science and technology.  571-577. 

wilfred paulus, irman abdul rahman, azman jalar, norinsan kamil othman, roslina ismail, wan yusmawati wan yusoff, maria abu bakar.  (2017).  the relationship between xrd peak intensity and mechanical properties of irradiated lead-free solder.  - materials science forum.  423-427. 

mamat h. & jalar a..  (2017).  bending and fatigue characterization on ph hydrofobic encapsulation material.  - 2017 ieee conference on open systems (icos).  . 

muhammad nubli zulkifli, azman jalar, shahrum abdullah & nurinsan kamil othman.  (2016).  bondability and strength evaluation of gold ball bond using nanoindentation approach.  - key engineering materials.  132-141. 

wan yusmawati wan yusmawati, azman jalar, norinsan kamil othman & irman abdul rahman.  (2016).  nanoindentation study on heat treated gold wire bonding.  - materials science forum.  31-35. 

bakar m.a., jalar a., daud a.r., ismail r., lah n.a.c., ibrahim n.s..  (2016).  nanoindentation approach on investigating micromechanical properties of joining from green solder materials.  - sains malaysiana.  1275-1279. 

che ani f., jalar a., ismail r., othman n.k., khor c.y., samsudin z., abdullah m.z., azmi a..  (2016).  backward compatibility solder joint formation at high peak reflow temperature for aerospace applications.  - arabian journal for science and engineering.  1813-1823. 

abdul aziz m.s., abdullah m.z., khor c.y., jalar a., che ani f., yan n., cheok c..  (2016).  finite volume-based simulation of the wave soldering process: influence of the conveyor angle on pin-through-hole capillary flow.  - numerical heat transfer; part a: applications.  295-310. 

ismail n., ismail r., nik ubaidillah n.k.a., jalar a., zain n.m..  (2016).  surface roughness and wettability of sac/cnt lead free solder.  - materials science forum.  73-75. 

ismail r., harun f., jalar a., abdullah s..  (2016).  ultrasonic vibration in leadframe for the bondability for au wedge bond.  - materials science forum.  83-86. 

ismail n., ismail r., abd aziz n.i., jalar a..  (2016).  wettability of cnt-doped solder under isothermal aging.  - materials science forum.  76-78. 

bakar m.a., jalar a., ismail r., daud a.r..  (2016).  directional growth behaviour of intermetallic compound of sn3.0ag0.5cu/imsn subjected to thermal cycling.  - materials science forum.  36-39. 

ismail r., harun f., jalar a., abdullah s..  (2016).  mechanical interlocking on leadframe surface for bondability of au wedge bond.  - materials science forum.  79-82. 

bakar m.a., jalar a., ismail r., daud a.r..  (2016).  nanoindentation of sn3.0ag0.5cu/enig solder joint after high temperature storage.  - materials science forum.  40-43. 

tarumaraja, k.a., menon, p.s. , said, f.a. , jamil, n.a., ehsan, a.a., shaari, s., majlis, b.y., jalar, a..  (2016).  fdtd numerical analysis of spr sensing using graphene-based photonic crystal.  - 2th ieee international conference on semiconductor electronics, icse 2016.  79-81. 

arash dehzangi, farhad larki and sawal hamid md ali, sabar derita hutagalung, md shabiul islam, mohd nizar hamidon, susthitha menon and azman jalar, jumiah hassan, burhanuddin yeop majlis..  (2016).  study of the side gate junctionless transistor in accumulation region..  - microelectronics international.  61-67. 

said, f.a., menon, p.s. , nawi, m.n., md zain, a.r., jalar, a., majlis, b.y..  (2016).  copper-graphene spr-based biosensor for urea detection.  - 12th ieee international conference on semiconductor electronics, icse 2016.  264-267. 

norinsan kamil othman, koh yunn teng, azman jalar, fakhrozi che ani and zamri samsudin.  (2016).  electrochemical migration behaviours of low silver content solder alloy sac 0307 on printed circuit boards (pcbs) in nacl solution.  - materials science forum.  3-12. 

nor rahafza abdul manap, roslinda shamsudin, mohd norhafsam maghpor, muhammad azmi abdul hamid, azman jalar.  (2016).  effect of palm oil fiber-tio2 ratio in the composite on the reduction of btx and formaldehyde in the air.  - malaysian journal of analytical sciences.  324-328. 

l.y. ang, n.k. othman, a. jalar, i. ismail.  (2016).  the effect of magnetic field on corrosion inhibitor of copper in 0.5 m hcl solution.  - procedia chemistry.  222-227. 

naif h al hardan, muhammad azmi abdul hamid, naser m ahmed, azman jalar, roslinda shamsudin, norinsan kamil othman, lim kar keng, wee siong chiu and hamzah n. al rawi.  (2016).  high sensitivity ph sensor based on porous silicon (psi) extended gate field effect transistor.  - sensors.  1-12. 

ismail r., omar g., jalar a., majlis b.y..  (2015).  the influence of pd-doped au wire bonding on haz microstructure and looping profile in micro-electromechanical systems (mems) packaging.  - journal of electronic materials.  2507-2513. 

farhad larki, alam abedini, md. shabiul islam, sahbudin shaari, sawal hamid md ali, p. susthitha menon, azman jalar, elias saion, jahariah sampe, burhanuddin yeap majlis..  (2015).  structural phase transformations in radiolytically synthesized al cu bimetallic nanoparticles..  - journal of materials science.  4348-4356. 

azman bin jalar @ jalil, norinsan kamil bin othman, siow kim shyong, syarif junaidi bin sjarifuddin djalil.  (2015).  pencirian wayar aloi pateri bebas plumbum (pb).  - .  . 

nurjuliana juhari, p susthitha menon, abang annuar ehsan, sahbudin shaari, azman jalar and burhanuddin yeop majlis.  (2015).  performance on optical properties of awg based on soi demultiplexer and receiver sensitivity in cwdm system.  - ieee 2015 international conference on computer, communication, and control technology.  157-161. 

muhammad m.m., jalar a., shamsudin r., isa m.c..  (2015).  evaluation of the suitability of fly ash powder for atmospheric plasma spray.  - defence s and t technical bulletin.  1-8. 

ks siow, tf chen, yw chan, a jalar, rm vemal, st chua dan f husna.  (2015).  characterization of silicone gel properties for high power igbt modules and mems.  - 2015 ieee conference on sustainable utilization and development in engineering and technology (csudet).  23-27. 

lin yuen ang, norinsan kamil othman, azman jalar, imayadi ismail.  (2015).  the effect of magnetic field on corrosion inhibitor of copper in 0.5 m hcl solution.  - american-eurasian journal of sustainable agriculture.  222-227. 

muzakkar m.z., ahmad s., yarmo m.a., jalar a., bijarimi m..  (2015).  shear strength of single lap joint aluminium-thermoplastic natural rubber (al-tpnr) laminated composite.  - springer series in materials science.  159-171. 

st chua, ks siow, a. jalar.  (2015).  effect of sintering atmosphere on the shear properties of pressureless sintered silver joint.  - 36th ieee international electronics manufacturing technology conference.  1-6. 

m z muzakkar, s.ahmad, m a yarmo, a jalar, m bijarimi, ratna.  (2015).  increasing the polarity of the aluminum surface and tpenr matrix with the addition 3-gps and pe-g-mah as a coupling agent to improve the lap shear strength of al-tpenr laminated composit.  - asian journal of applied sciences.  642-651. 

m s abdul aziz, m z abdullah, c y khor, a jalar, m a bakar, w y w yusoff, f che ani, nobe yan, m zhou & c cheok.  (2015).  effects of pcb thickness on adjustable fountain wave soldering.  - sadhana.  2197-2220. 

m. s. abdul aziz, m. z. abdullah, c. y. khor, a. jalar, f. che ani.  (2015).  finite volume-based simulation of the wave soldering process: influence of the conveyor angle on pin-through-hole capillary flow.  - numerical heat transfer, part a: applications.  295-310. 

ang lingyuen, norinsan kamil othman, azman jalar, ismayadi ismail.  (2015).  the effect of magnetic field on corrosion inhibitor of copper in 0.5 m nacl solution.  - american-eurasian journal of sustainable agriculture.  35-38. 

f che ani, a jalar, r ismail, nk othman, mz abdullah, ms abdul aziz, cy khor, m abu bakar.  (2015).  reflow optimization process: thermal stress using numerical analysis and intermetallic spallation in backwards compatibility solder joints.  - arabian journal for science and engineering.  1669-1679. 

fuaida harun, roslina ismail, azman jalar, shahrum abdullah.  (2015).  effect of wire diameter and hook location on second bond failure modes.  - microelectronics international.  32-36. 

roslina ismail, fuaida harun, muhammad nubli zulkifli, azman jalar, maria abu bakar, and shahrum abdullah.  (2015).  bondability of second copper wire bonds on silver and nickel palladium gold silver metallization.  - ieee transactions on components, packaging and manufacturing technology.  1541-1545. 

naif h. al hardan, muhammad azmi abdul hamid naser m. ahmed, azman jalar, roslinda shamsudin, norinsan kamil othman, lim kar keng and sabah m. mohammed.  (2015).  a study on the uv photoresponse of hydrothermally grown zinc oxide nanorods with different aspect ratios.  - ieee sensors journal.  6811-6818. 

solhan yahya , norinsan kamil othman , abdul razak daud , azman jalar , roslina ismail.  (2015).  the influence of temperature on the inhibition of carbon steel corrosion in acidic lignin.  - anti-corrosion methods and materials.  301-306. 

farhad larki, arash dehzangi, sawal hamid md. ali, azman jalar, md. shabiul islam, mohd nizar hamidon, burhanuddin yeop majlis..  (2014).  effect of geometric parameters on the performance of p-type junctionless lateral gate transistors..  - plos one.  9(4): 1-9. 

foo s.p., siow k.s., a. jalar.  (2014).  synthesizing snagcu nanoparticles by electrodeposition of reverse microemulsion electrolyte.  - 2014 ieee international conference on semiconductor electronics (icse 2014).  513-516. 

farhad larki, arash dehzangi, sawal hamid md ali, azman jalar, md. shabiul islam, burhanuddin y. majlis, mohd nizar hamidon..  (2014).  dependency of electrical characteristics on nano gap variation in pinch off lateral gate transistors.  - 2014 ieee international conference on semiconductor electronics (icse 2014).  170-173. 

a. dehzangi, f. larki, b. y. majlis, m.f. md. r. wee, md. s. islam, s.h. md. ali and a. jalar..  (2014).  charge carrier mobility in lateral gatessi nanowire junction-less transistor..  - 2nd usa international conference on surfaces, coatings and nanostructured materials. nanosmart,.  . 

a. dehzangi, f. larki, m.g. naseri, m. navasery, b. y. majlis, j. hassan, e. saion, m.f. md. r. wee, md. s. islam, s.h. md. ali and a. jalar..  (2014).  fabrication and simulation of single crystal p-type si nanowire using soi technology..  - 2nd usa international conference on surfaces, coatings and nanostructured materials. nanosmart, rice university, houston, usa..  . 

farhad larki, arash dehzangi, sawal hamid md. ali, azman jalar, md. shabiul islam, mohd nizar hamidon, burhanuddin yeop majlis.  (2014).  effect of geometric parameters on the performance of p-type junctionless lateral gate transistors.  - plos one.  1-9. 

yahya s., othman n.k., daud a.r., jalar a..  (2014).  effect of scan rate on corrosion inhibition of carbon steel in the presence of rice straw extract - potentiodynamic studies.  - sains malaysiana.  1083 - 1087. 

azman bin jalar @ jalil, roslinda binti shamsudin, muhammad azmi bin abdul hamid, abdul razak bin daud, norinsan kamil bin othman, shahrum bin abdullah, irman bin abdul rahman.  (2014).  antara sambungan nano aloi pateri-substrat untuk pempakejan nano.  - .  . 

azman jalar , wan yusmawati wan yusoff, norinsan kamil othman, irman abdul rahman.  (2014).  effects of thermal cycling on the mechanical properties of gold wire bonding.  - international conference on semiconductor electronics, icse 2014.  . 

mohd moesli muhammad, mahdi che isa, azman jalar, roslinda shamsudin, syed rosli sayd bakar, mohd subhi din yati, nik hassanuddin nik yussof & hasril naim.  (2014).  study on the effects of atmospheric plasma spray (aps) process parameters on porosities of fly ash deposited coatings.  - defence s&t technical bulletin / science & technology research institute for defence (stride).  73-80. 

solhan yahya, norinsan kamil othman, abd razak daud, azman jalar.  (2014).  effect of scan rate on corrosion inhibition of carbon steel in the presence of rice straw extract-potentiodynamic studies.  - sains malaysiana.  1083-1087. 

l. y. ang, n. k. othman, a. jalar, and i. ismail.  (2014).  the effect of magnetic field on copper in various corrosive medium.  - aip conference proceedings - the 2014 ukm fst postgraduate colloquium.  26-29. 

azman bin jalar @ jalil.  (2014).  pencirian sifat fizik nanopartikel aloi pateri berasaskan timah.  - .  . 

mohd. zaidi bin omar, azman bin jalar @ jalil, sallehuddin bin mohamed haris, mohd. zaki bin nuawi, shahrum bin abdullah.  (2014).  development of suspension system for heavy vehicles.  - .  . 

wan yusmawati wan yusoff, roslina ismail, azman jalar, norinsan kamil othman, irman abdul rahman.  (2014).  microstructural evolution and micromechanical properties of gamma-irradiated au ball bonds.  - material characterization.  129-135. 

chua st, siow ks, jalar a.  (2014).  effect of sintering atmosphere on the shear properties of pressureless sintered silver joint.  - 36th international electronics manufacturing technology conference,.  . 

n.h. al-hardan, azman jalar, m.a. abdul hamid, lim kar keng, r shamsudin, b.y. majlis.  (2014).  the room-temperature sensing performance of zno nanorods for 2-methoxyethanol solvent.  - sensors and actuators b: chemical.  223-228. 

n. mohamad, a. jalar & n.k. othman.  (2014).  surface morphology study on aluminum alloy after treated with silicate-based corrosion inhibitor from paddy residue.  - sains malaysiana.  935-940. 

m.s. abdul aziz, m.z. abdullah, c.y. khor, a. jalar, f. che ani.  (2014).  cfd modeling of pin shape effects on capillary flow during wave soldering.  - international journal of heat and mass transfer.  400-410. 

siew peng foo, wan yusmawati wan yusoff & azman jalar.  (2014).  dimensional and structural stability of gamma irradiated stacked die quad flat no leads (qfn).  - sains malaysiana.  827-832. 

rashita abd rashid, roslinda shamsudin, muhammad azmi abdul hamid, azman jalar.  (2014).  low temperature production of wollastonite from limestone and silica sand through solid-state reaction.  - journal of asian ceramic societies.  77-81. 

nurul atikah sharif, azaman jalar, muhamad izhar sahri, norinsan kamil othman.  (2014).  effect of high temperature corrosion on austenitic stainless steel grade 304 in co2 gas at 700ºc.  - sains malaysiana.  1069-1075. 

n.h al hardan, azman jalar, m.a. abdul hamid, lim kar keng, n.m. ahmed, r. shamsudin.  (2014).  a wide -band uv photodiode based on n-zno/p-si heterojunctions.  - sensors and actuators a:physical.  61-66. 

rabiahtul zulkafli, norinsan kamil othman*, irman abdul rahman, azman jalar.  (2014).  effect of rice straw extract and alkali lignin on the corrosion inhibition of carbon steel.  - the malaysian journal of analytical sciences.  204-211. 

rashita abd rashid, roslinda shamsudin, muhammad azmi abdul hamid, azman jalar.  (2014).  in-vitro bioactivity of wollastonite materials derived from limestone and silica sand.  - ceramics international.  40:6847-6853. 

azman jalar, nur azida che lah, norinsan kamil othman, roslinda shamsudin, abdul razak daud, and syed roslee sayd bakar.  (2014).  characterization of oxide growth on surface of al-mg-si welded joint.  - advances in materials science and engineering.  1-10. 

m.m. muhammada, m.c. isa, r. shamsudin, a. jalar.  (2014).  plasma spray deposition of fly ash onto mild steel substrates using a fractional factorial design approach.  - ceramics international.  13635-13642. 

m. s. abdul aziz, m. z. abdullah, c. y. khor, a. jalar, m. a. bakar, w. y. w. yusoff, f. che ani, n. yan, m. zhou, c. cheok.  (2014).  implications of adjustable fountain wave in pin through hole soldering process.  - arabian journal for science and engineering.  9101-911. 

m. m. muhammad, a. jalar, r. shamsudin and m. c. isa.  (2014).  effect of plasma spray parameters on porosity of fly ash deposited coatings.  - aip conference proceeding - the 2014 ukm fst postgraduate colloquium.  116-121. 

nurul atikah shariff, norinsan kamil othman, azman jalar, muhammad azmi abdul hamid dan irman abdul rahman.  (2013).  high temperature corrosion of welded ferritic stainless steel in flowing co2 gas.  - 2012 national physics conference, perfik 2012; bukit tinggi, pahang; malaysia aip conference proceedings - 2012 national physics conference.  351-355. 

s. yahya, n.k. othman*, a.r. daud & a. jalar.  (2013).  surface morphology studies of low carbon steel treated in aqueous lignin.  - sains malaysiana.  42(12):1793-1798. 

denni asra awizar, norinsan kamil othman, azman jalar, abdul razak daud, i. abdul rahman1 dan n. h. al-hardan.  (2013).  nanosilicate extraction from rice husk ash as green corrosion inhibitor.  - international journal of electrochemical science.  8(2):1759-1769. 

zulkifli, m.n., jalar, a., abdullah, s., rahman, i.a., othman, n.k..  (2013).  effect of applied load in the nanoindentation of gold ball bonds.  - journal of electronic materials.  42(6):1063-1072. 

mohd nazri idris, abdul razak daud, norinsan kamil othman, azman jalar.  (2013).  corrosion control by benzyl triethylammonium chloride: effects of temperature and its concentration.  - international journal of engineering & technology.  13(3):47-51. 

muhammad yusri zulkafli, norinsan kamil othman, azwan mat lazim, azman jalar.  (2013).  effect of carboxylic acid from palm kernel oil for corrosion prevention.  - international journal of basic & applied sciences.  13(3):29-32. 

n.h.al hardan, m.a.abdul hamid, azman jalar, lim karkeng, r.shamsudin and b.y. majlis.  (2013).  bi-structure zno prepared via cathodic electrodeposition method.  - international journal of electrochemical science.  8: 2430-2439. 

n.h al hardan, azman jalar, m.a. abdul hamid, lim kar keng and r. shamsudin.  (2013).  structural and optical properties of a bi structured zno film prepared via electrodeposition.  - international journal of electrochemical science.  8:6767-6774. 

m.a bakar, m.a.a hamid, a. jalar and r. shamsudin.  (2013).  morphology and optical prpoperties of zinc oxide films grown on metal coated glass substrates by aqueous chemical growth..  - journal of physics:conference series.  431:012004. 

wan yusmawati wan yusoff, azman jalar, norinsan kamil othman dan irman abdul rahman.  (2013).  gamma-irradiation effect on material properties behaviour of semiconductor package.  - 2012 national physics conference, perfik 2012; bukit tinggi, pahang; malaysia-(aip conference proceedings).  300-305. 

hamisah ismail, roslinda shamsudin, muhammad azmi abdul hamid dan azman jalar.  (2013).  synthesis and characterisation of nano wollastonite from rice husk ash and limestone..  - materials science forum, transtech publication switzerland.  . 

nurul atikah shariff, norinsan kamil othman and azman jalar.  (2013).  oxidation behaviour of ferritic stainless steel grade crofer 22 apu at 700 °c in flowing ar-75%co2-12%h2o.  - aip conference proceedings -ukm fst postgraduate colloquium.  . 

kar keng lim, muhammad azmi abdul hamid, roslinda shamsudin, azman jalar dan n.h. al hardan.  (2013).  synthesis and characterization of grape-like sno2 structures grown by a thermal evaporation method.  - materials science forum, trans tech publications, switzerland.  . 

rabiahtul zulkafli, norinsan kamil othman, and azman jalar.  (2013).  influence of temperature on corrosion inhibition for carbon steel by rice straw extract in hcl solution: synergistic effect of cationic surfactant.  - aip conference proceedings -ukm fst postgraduate colloquium.  . 

denni asra awizar, norinsan kamil othman, abdul razak daud, azman jalar and rabiahtul zulkafli.  (2013).  the performance of nanosilicate from rice husk ash as green corrosion inhibitor for carbon steel in 0.5m hcl.  - materials science forum / trans tech publications, switzerland.  . 

zulkifli, muhammad nubli; jalar, azman; abdullah, shahrum; rahman, irman abdul; hamid, muhammad azmi abdul.  (2013).  strength distribution of au ball bond using nanoindentation approach.  - materials science and engineering a.  577:189-196. 

hazian mamat, azrul azlan hamzah, azman jalar, jumril yunas, nurfirdaus a. rahim.  (2013).  a comsol model to analyse the structural mechanical problem in an electrostatically controlled prestressed micro-mirror.  - world applied sciences journal.  26(7): 950-956. 

s. yahya, n. k. othman, a. r. daud, and a. jalar.  (2013).  the inhibition of carbon steel corrosion by lignin in hcl and h2 so4.  - aip conference proceedings-ukm fst postgraduate colloquium.  . 

n. mohamad, n. k. othman, and a. jalar.  (2013).  investigation of sio2 :na2o ratio as a corrosion inhibitor for metal alloys.  - aip conference proceedings -ukm fst postgraduate colloquium.  . 

arash dehzangi,farhad larki, burhanuddin y. majlis, m.n. hamidon,p. susthitha menon, azman jalar, md. shabiul isla.  (2013).  numerical investigation of channel width variation in junctionless transistors performance.  - 2013 ieee regional symposium on micro and nano electronics, rsm 2013; langkawi; malaysia.  101-104. 

mz muzakkar, s ahmad, ma yarmo, a jalar, m bijarimi.  (2013).  shear strength of single lap joint aluminium-thermoplastic natural rubber (al-tpnr) laminated composite.  - journal of physics: conference series.  1-6. 

m. y. zulkafli, n. k. othman, a. m. lazim and a. jalar.  (2013).  inhibitive effects of palm kernel oil on carbon steel corrosion by alkaline solution.  - aip conference proceedings -ukm fst postgraduate colloquium.  . 

azman jalar, wan yusmawati wan yusoff, norinsan kamil othman, shahrum abdullah and irman abdul rahman.  (2012).  gamma irradiation effect on load-deflection curve of semiconductor package.  - advanced materials research.  . 

n.k. othman, n. mohamad, a. jalar.  (2012).  eco-green corrosion inhibitor from rice husk ash for carbon steel.  - international welding/joining conference-korea 2012.  . 

muhammad azmi abdul hamid, maria abu bakar, azman jalar, roslinda shamsudin.  (2012).  substrate dependence of the properties of mgo films produced using an aqueous chemical growth method.  - current nanoscience.  8(1):50-54. 

muhammd nubli zulkifli, azman jalar, shahrum abdullah, roslinda shamsudin and rozli zulkifli.  (2012).  hardness variation of ball bond wire bonding.  - advanced materials research.  . 

ahmad mulia hafizayatullah amiruddina, roslinda shamsudin, azman jalar and muhammad azmi abdul hamidd.  (2012).  single layer brushite coating onto stainless steel substrate using dipcoating technique..  - advanced materials research.  . 

siti nuurul fatimah hasim, muhammad azmi abdul hamid, roslinda shamsudin, shahidan radiman & azman jalar.  (2012).  surface morphology of metal oxide sno2 under different concentrations of oxygen by thermal evaporation method.  - 26th regional conference on solid state science and technology, rcssst 2011;seremban, negeri sembilan (advanced materials research).  . 

i. ahmad, a. jalar, z. kornain & u. hashim.  (2012).  effect of reflow profile (rsp vs rtp) on sn/ag/cu solder joint strength in electronic packaging.  - journal of engineering technology.  2(1):41-46. 

s. yahya, n. k. othman, a. jalar.  (2012).  developing organic corrosion inhibitor from biomass waste of rice straw for metal industries.  - international welding/joining conference-korea 2012.  . 

muhammad azmi abdul hamid, maria abu bakar, azman jalar, roslinda shamsudin and ibrahim ahmad.  (2012).  morphology and optical properties of nickel oxide nanostructure from aqueous solution.  - advanced materials research.  . 

muhammad nubli zulkifli, shahrum abdullah, norinsan kamil othman, azman jalar.  (2012).  some thoughts on bondability and strength of gold wire bonding.  - gold bulletin.  45:115-125. 

norinsan kamil othman, solhan yahya, nadzirah mohamad, abdul razak daud, azman jalar.  (2012).  eco-green corrosion inhibitor from paddy waste for carbon steel.  - seminar ur-ukm ke-7 2012.  . 

s. nurul atikah, n.k. othman and a. jalar.  (2012).  high temperature corrosion of fe-30cr in flowing co2 gas.  - 26th regional conference on solid state science and technolog,seremban(yadvanced materials research).  . 

a. jalar, f.a.m. nasir, m.a.a. hamid & z. kornain.  (2012).  stereometry of voids in solder interconnect of electronic packaging.  - journal of engineering technology.  2(1):28-35. 

wan yusmawati wan yusoff, azman jalar, norinsan kamil othman, irman abdul rahman.  (2011).  effect of gamma-irradiation towards stress-strain curve of single die qfn package.  - 2011 international conference on frontier of nanoscience and technology, icfnst 2011; kunming.  . 

c. l. nur azida, a. jalar, n. k. othman, n. m. rashdi, md. z. ibel.  (2011).  effect of different filler metals towards welding of aa6061 al alloy by x-ray ct-scan.  - source: advances in superalloys, pts 1 and 2 book series: advanced materials research.  . 

zainudin kornain, azman jalar, rozaidi rasid and shahrum abdullah.  (2011).  the study of underfill epoxy hardness in reducing curing process time for flip chip packaging.  - 8th international conference on fracture and strength of solids 2010, feofs2010; kuala lumpur (key engineering materials).  . 

fayyadh nakhaie ahmad refngah, shahrum abdullah, azman jalar, l.b. chua.  (2011).  microstructural behaviour study and fea-based fatigue simulation on parabolic leaf spring.  - 8th international conference on fracture and strength of solids 2010, feofs2010; kuala lumpur(key engineering materials).  . 

aendraa azhar abdul aziz, muhammad faizol ahmad ibrahim, azman jalar, junaidi syarif, shahrum abdullah, nasrizal mohd rashdi, zainudin kornain.  (2011).  effect of different fillers on microstructure and tensile properties of welded aa6061-t6.  - key engineering materials.  . 

maria abu bakar, muhammad azmi abdul hamid, azman jalar and roslinda shamsudin.  (2011).  synthesis of porous mgo into sheet-like structure via solution routes.  - 2011 international conference on frontier of nanoscience and technology, icfnst 2011; kunming.  . 

f. harun, azman jalar, shahrum abdullah, mohd faridz mod yunoh.  (2011).  effect of hook location for ultra fine pitch wirebonding pull testing method.  - source: fracture and strength of solids vii, pts 1 and 2 book series: key engineering materials.  . 

m.f. m. yunoh, s. abdullah, a. jalar, l. abdullah and m.f. abdullah.  (2011).  durability assessment of quad flat no-lead package using signal analysis.  - source: fracture and strength of solids vii, pts 1 and 2 book series: key engineering materials.  . 

m. z. abdul wahab, h. mamat, a. jalar.  (2011).  temperature coefficient of resistance (tcr) measurement method to evaluate metal process of cmos technology.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research).  . 

c.l. nur azida, a. jalar, n.k. othman, a.r. daud.  (2011).  oxidation effect on welded aa6061 al alloy using er4043 filler metal.  - journal of applied mechanics and materials.  66-68:46-49. 

i. abdullah, a. jalar, s. abdullah, m. f. rosle and m.f. mod yunoh.  (2011).  stress distribution effect on a stacked-die qfn package manufacturing processes.  - 8th international conference on fracture and strength of solids 2010, feofs2010 (key engineering materials); kuala lumpur.  . 

h. budiman, m. z. omar, a. jalar and j. syarif.  (2011).  investigation on cooling slope and conventional stir cast a356/al2o3 metal matrix composites.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research).  . 

hazian mamat, nur firdaus a rahim, mohd zahrin a wahab, prof dr. azman jalar.  (2011).  research on effect of high energy implant to resist thickness.  - advanced materials research - icfmm2011 chongqing, china.  . 

n. e. salehudin, a. jalar and a. r. daud.  (2011).  quantitative stereology for roughness morphology of aluminum alloy.  - advanced materials research - international conference on advances in materials and processing technologies, ampt 2009.  . 

m. f. ahmad ibrahim, s.r.s.bakar, a. jalar, n. k. othman,
j. sharif, a. r. daud and n. m. rashdi.  (2011).  effect of porosity on tensile behaviour of welded aa6061-t6 aluminium alloy.  - 2011 international conference on mechanical materials and manufacturing engineering, icmmme 2011 (applied mechanics and materials); nanchang.  . 

a. jalar, z.kornain, r.rasid, s.abdullah, n.k. othman.  (2011).  the effect of underfill fillet geometry to die edge stress for flip chip packaging.  - international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen; 6 november 2010 through 8 november 2010 (advanced materials research).  . 

n. k. othman, n. othman and a. jalar.  (2011).  corrosion behavior of fe-cr alloys in ar-10%o2 atmosphere.  - 8th international conference on fracture and strength of solids 2010, feofs2010; kuala lumpur(key engineering materials).  . 

n. a. che lah, m. f. ahmad ibrahim, a. jalar, j. sharif, n. k. othman and n. m. rashdi.  (2011).  the effect of filler er4043 and er5356 on porosity distribution of welded aa6061 aluminium alloy.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research).  . 

che lah nur azida, azman jalar, norinsan kamil othman, abdul razak daud.  (2011).  oxidation effect of welded aa6061 al alloy using er5356 filler metal.  - 2011 international conference on mechanical materials and manufacturing engineering, icmmme 2011 (applied mechanics and materials); nanchang.  . 

koh aik khoon, r. abd-shukor, abdul razak daud, sahrim hj ahmad, azman jalal@jalil, supian samat, baharudin yatim, ibrahim abu talib.  (2011).  the growth of public universities in malaysia.  - college student journal.  45(2):238-241. 

wan yusmawati wan yusoff, azman jalar, norinsan kamil othman, irman abdul rahman.  (2011).  effect of gamma-irradiation towards stress-strain curve of single die qfn package.  - materials science forum.  694:620-624. 

n. k. othman, s. r. s. bakar, a. jalar, j. syarif and m. y. ahmad.  (2011).  the effect of filler metals on mechanical properties of 6 mm aa 6061-t6 welded joints.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research).  . 

lim, v; amin, n; foong, cs; ahmad, i; zaharim, a; rasid, r; jalar, a.  (2011).  effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader[kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan.  - sains malaysiana.  40(2):181-190. 

aziz, a.a.a., ibrahim, m.f.a., jalar, a., junaidi, s., abdullah, s., rashdi, n., kornain, z..  (2011).  effects of different fillers on microstructure and tensile properties of welded aa6061-t6.  - 8th international conference on fracture and strength of solids 2010, feofs2010 (key engineering materials); kuala lumpur.  . 

kornain, z., jalar, a., rasid, r., foong, c.s., wong, t.l..  (2011).  estimation of curing profile`s parameters for flip chip packaging using dsc and tga.  - 2011 international conference on materials, mechatronics and automation, icmma 2011 (key engineering materials); melbourne, vic.  . 

jalar a., zulkifli m.n., othman n.k., abdullah s..  (2011).  the re-evaluation of mechanical properties of wire bonding.  - 2011 international symposium on advanced packaging materials, apm 2011;xiamen.  . 

s. abdullah, m.f.m. yunoh, a. jalar and m.f. abdullah.  (2011).  hardness test on an epoxy mold compounds of a quad flat no lead package using the depth sensing nanoindentation.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research).  . 

s. abdullah, m. n. zulkifli, and a. jalar.  (2011).  nanoindentation approach for evaluation of process parameters effect on the strength of bonded au ball bonds.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research).  . 

n. saud and a. jalar.  (2011).  sn-rich phase coarsening in sn-ag-cu solder joint during moderate current stressing.  - advanced materials research (international conference on advances in materials and processing technologies, ampt 2009).  . 

a. jalar, m. n. zulkifli and s. abdullah.  (2011).  nanoindentation test for the strength distribution analysis of bonded au ball bonds.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research).  . 

n. k. othman, m. n. zulkifli, a. jalar, and s. abdullah.  (2011).  nanoindentation test for the stiffness distribution analysis of bonded au ball bonds.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research).  . 

victor lim, nowshad amin, c.s. foong, ibrahim ahmad, azami zaharim, rozaidi rasid & azman jalar.  (2011).  kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan.  - sains malaysiana.  40(2):181-190. 

u. mokhtar, r. rasid, s. ahmad and a. jalar.  (2010).  effects of rubber-modified on thermal and mechanical properties of epoxy mold compound.  - solid state science and technology.  18(1):27-35. 

m.f.m yunoh, s. abdullah, a. jalar, m. f. rosle and s.a. radzi.  (2010).  micromechanical studies of 4n gold wire for fine pitch wirebonding.  - journal of science and technology.  2(1):121-134. 

zainudin kornain, azman jalar and rozaidi rasid.  (2010).  the investigation of die back edge cracking in flip chip ceramic ball grid array package (fc-cbga).  - journal of science and technology.  2(1):135-147. 

z. kornain, a. jalar, r. rashid , s. abdullah, b. lee.  (2010).  comparative study of phenolic-based and amine-based underfill materials in flip chip plastic ball grid array package.  - journal of electronic packaging, transactions of the asme.  132(4):1012-1017. 

mohd zahrin a. wahab, azman jalar, shahrum abdullah, hazian mamat.  (2010).  characterization of 0.5µm bicmos gate oxide using time dependent dielectric breakdown test.  - advanced materials research.  . 

zainudin kornain, azman jalar, rozaidi razid, ang ye cheah, muhammad faizol ahmad ibrahim, aendraa azhar abdul aziz.  (2010).  characterization of clean flux for chip attachment in flip chip packaging.  - world engineering congress 2010 (wec2010) - conference on advanced processes and materials, kuching, sarawak..  . 

muhammad faizol ahmad ibrahim, aendraa azhar abdul aziz, azman jalar, syarif junaidi
kornain, zainudin, mohd nasrizal rashdi and muhamad nubli zulkifli.  (2010).  the effect of filler al-5%si a_d al-5%mg on porosity distribution of aa6061 aluminium alloy joints.  - world engineering congress 2010 (wec2010)- conference on advanced processes and materials, kuching, sarawak.  . 

shahrum abdullah, mohd faridz mod yunoh and azman jalar.  (2010).  three-point bending test behaviour of a qfn semiconductor package.  - advanced materials research.  . 

h. budiman, m. z. omar, a. jalar.  (2010).  effect of slope length to the sphericity of a356 aluminium alloy.  - international review of mechanical engineering (i.re.m.e.).  4(7):840-845. 

md. shabiul islam, m.s. bhuyan, sawal h. m. ali, masuri othman and azman jalar..  (2010).  fpga implementation of a traffic controller using fuzzy expert system.  - international: the 4th imen-lipi joint seminar on electronic devices, mems and nanotechnology..  . 

azman jalar, saidatul azura radzi and muhammad azmi abd hamid.  (2010).  effect of ca content on mechanical properties of 4n gold wire for quad flat nolead (qfn) stacked die package.  - advanced materials research.  . 

m. f. m. yunoh, s. abdullah and a. jalar.  (2010).  mechanical properties of qfn semiconductor package using flexural test.  - world applied sciences journal.  9:40-42. 

saud, n., jalar, a..  (2010).  sn-rich phase coarsening during isothermal annealing for as-soldered sn-ag-cu solder.  - journal of materials science: materials in electronics.  21(10):1083-1089. 

ibrahim ahmad, nurul hidayah mohamad nor, huda abdullah,
fuaida harun and azman jalar.  (2010).  characterization of granular type capillary to wire bond yield for ultra-fine pitch large quad flat package of semiconductor packaging.  - international journal of electrical & computer sciences.  10(6):8-18. 

abdullah, s; ariffin, ak; nizwan, cke; abdullah, mf; jalar, a; yunoh, mfm.  (2010).  failure analysis of a semiconductor packaging leadframe using the signal processing approach.  - international journal of modern physics b.  24(1-2):175-172. 

z. kornain, a. jalar, n. amin, r. rasid and c.s. foong.  (2010).  comparative study of different underfill material on flip chip ceramic ball grid array based on accelerated thermal cycling.  - american journal of engineering and applied sciences.  3(1):83-89. 

zainudin kornain, azman jalar, rozaidi rasid and shahrum abdullah.  (2010).  an optimization of two-steps curing profile to eliminate voids formation in underfill epoxy for hi-cte flip chip packaging.  - advanced materials research.  . 

n. k othman, a. jalar, n. othman and d. j. young.  (2010).  effects of lanthanum on fe-25cr alloys under cyclic oxidation.  - advanced materials research.  . 

bakar m.a., hamid m.a.a., jalar a..  (2010).  growth behaviour of zno on si (100) and platinum coated glass substrate from aqueous solution.  - advanced materials research.  . 

m. a. bakara, m. a. a. hamid & a. jalar.  (2010).  growth behaviour of zno on si (100) and platinum coated glass substrate from aqueous solution.  - advanced materials research.  . 

norliza ismail, muhammad azmi abdul hamid & azman jalar.  (2009).  microstructural characterization of au-in thin film deposited by electron beam evaporation.  - sains malaysiana.  38(1):91-94. 

budiman h., omar m.z., jalar a., jaharah a.g..  (2009).  effect of water cooling on the production of al-si thixotropic feedstock by cooling slope casting.  - european journal of scientific research.  32(2):158-166. 

hasim, snf; hamid, maa; shamsudin, r; jalar, a.  (2009).  synthesis of mgo nano-cubes on si (001) by thermal evaporation.  - nanoscience and nanotechnology.  . 

fatimah hasim s.n., abdul hamid m.a., shamsudin r., jalar a..  (2009).  synthesis and characterization of zno thin films by thermal evaporation.  - journal of physics and chemistry of solids.  70(12):1501-1504. 

saud n., jalar a..  (2009).  sn-rich phase coarsening during isothermal annealing for as-soldered sn-ag-cu solder.  - journal of materials science: materials in electronics.  21(10):1083-1089. 

norhidayah mohd arof, noor hasmin mokhtar, asri din, azman jalar, jasmina qamaruzzaman.  (2009).  surface roughness of a nanofill composite resin after finishing and polishing.  - proceeding and abstract book : 7th dental students` colloquium "dental research and education - a life-long quest".  . 

h. budiman, m. z. omar1, a. jalar, j. syarif, m. j. ghazali and s. abdullah.  (2009).  production of feedstock material for semi-solid material processing by coolign slope casting process.  - international journal of mechanical and materials engineering (ijmme).  4(2):74-78. 

koh aik khoon, abdul razak daud, supian samat, r.abd-shukor, azman jalar @ jalil.  (2009).  popular science writing: communicating science to peers and public.  - reading improvement.  46(3):143-146. 

f. n. ahmad refngah, s. abdullah, a. jalar and l. b. chua.  (2009).  fatigue life evaluation of two types of steel leaf springs.  - international journal of mechanical and materials engineering (ijmme).  4(2):34-38. 

m.f. rosle, i. abdullah, s. abdullah, m.a.a. hamid, a.r. daud and a. jalar.  (2009).  effect of manufacturing stresses to die attach film performance in quad flatpack no-lead stacked die packages.  - american journal of engineering and applied sciences.  2(1):17-24. 

koh aik khoon, azman jalar@jalil, r. abd-shukor, baharudin yatim, ibrahim abu talib, abdul razak daud, supian samat.  (2009).  book on einstein - ollectors delight.  - college student journal.  43(1):129-131. 

m.f. m. yunoh, s. abdullah and a. jalar.  (2009).  flexural test properties of qfn semiconductor package in elevated temperature.  - proc of nanotech malaysia 2009 conference, kuala lumpur.  . 

s. a. radzi, a. jalar & m. a. a. hamid.  (2009).  effects of bonding parameter on ball bonding process for quad flat nolead (qfn) stacked die package.  - proc of nanotech malaysia 2009 conference, kuala lumpur.  . 

m. n. zulkifli. a. jalar & m. f. rosle..  (2009).  characterization of aual intermetallic morphology for au ball bonds.  - proc of nanotech malaysia 2009 conference, kuala lumpur.  . 

i. abdullah, i. ahmad, m. z. m. talib, b. bais & a. jalar.  (2009).  warpage effect on stacked-die qfn package using finite element model.  - proc of nanotech malaysia 2009 conference, kuala lumpur.  . 

victor lim, nowshad amin, ibrahim ahmad and azman jalar.  (2009).  a study on electroless nickel plating coating hardness and modulus of fcbga heat spreader using nano- indentation method.  - proc of nanotech malaysia 2009 conference, kuala lumpur.  . 

m. a. bakar, m. a. a. hamid & a. jalar.  (2009).  effect of substrate coating on the morphology of zinc oxide prepared by aqueous chemical growth.  - nanotech malaysia 2009 conference.  . 

zainudin kornain, azman jalar, rozaidi rasid and fong chee seng.  (2009).  effect of curing profile to eliminate the voids / black dots formation in underfill epoxy for hi-cte flip chip packaging.  - world academy of science, engineering and technology.  59:416-421. 

s.a. radzi and a. jalar.  (2009).  effect of electrica flame off (efo) current and firing time on free air ball (fab) for copper wire bonding.  - jurnal elektronika dan telekomunikasi.  9(2):170-173. 

a. jalar, i. abdullah, v. lim and s. a. radzi.  (2009).  effect of die attach film (daf) materials on quad flat nolead (qfn) stacked-die package after reliability process.  - jurnal elektronika dan telekomunikasi.  9(2):163-169. 

mj ghazali, mz omar & a jalar.  (2009).  sains dan teknologi alam melayu.  - .  384. 

karen m.c. wong, a.r. daud, and azman jalar.  (2009).  microhardness and tensile properties of a 6xxx alloy through minor additions of zr.  - journal of materials engineering and performance.  18(1):62-65. 

abdullah s., abdullah m.f., ariffin a.k., jalar a..  (2009).  thermal-mechanical analysis of a different leadframe thickness of semiconductor package under the reflow process.  - american journal of applied sciences.  6(4):616-625. 

abdullah s., yunoh m.f.m., kamarudin h., jalar a..  (2009).  role of strain rate on the micromechanical characterization properties of 4n gold micro wire: micro tensile and nanoindentation.  - european journal of scientific research.  28(1):33-43. 

s. abdullah, m. f. abdullah, a. k. ariffin, a. jalar.  (2009).  effect of leadframe oxidation on the reliability of a quad flat no-lead package.  - journal of electronic packaging (transaction of the asme).  131(3):0310021-0310027. 

s. abdullah, s.m. yusof, a. jalar, m.f. abdullah, z.a. aziz & r. daud.  (2008).  step cut for dicing laminated wafer in a qfn package.  - solid state science and technology.  16(2):198-206. 

abdullah, s; refngah, fna; jalar, a; chua, lb; ariffin, ak; zaharim, z.  (2008).  fea-based durability assessment: a case study using a parabolic leaf spring.  - proceedings of the 7th wseas international conference on system science and simulation in engineering (icossse `08) - recent advances in systems science and simulation in engineering.  . 

a. jalar, s. a. radzi and m.a.a. hamid.  (2008).  effects of usg current and bonding load on bonding formation in qfn stacked die package.  - journal of solid state science and technology.  17(2):65-71. 

roslinda shamsudin, zainuddin sajuri, syarif junaidi syarifuddin djalil, mariyam jameelah ghazali, muhammad azmi abdul hamid, fathul karim sahrani, mohd zaidi omar, shahrum abdullah, azman jalar.  (2008).  the proceeding of malaysian metallurgical conference 2008.  - the proceeding of malaysian metallurgical conference 2008.  . 

a.jalar. f.m.nasir, m.a.a hamid,n.c. had and n. ismail.  (2008).  stereometry of voids in solder interconnect between pcb and packaging.  - solid state science and technology.  16(2):1-7. 

norainiza saud & azman jalar.  (2008).  sn-rich phase coarsening during isothermal annealing on sn-ag-cu solder.  - malaysian metallurgical conference 2008.  . 

a. jalar & s. h. a. razak.  (2008).  challenge in free air balls formation of copper during thermosonic wire bonding process.  - journal of solid state science and technology.  16(2):39-45. 

ahmad shuhud irfani zakaria, fairuz abdul rahman, siti ruhaini abdul rahman, azman jalar and mariati abdul rahman..  (2008).  erosive effects of local lime and pineapple juices on enamel..  - 7th scientific meeting of iadr malaysian section and 9th annual general meeting..  . 

karen wong mee chu, abdul razak daud & azman jalar.  (2008).  pengaruh unsur zirkonium terhadap sifat mekanik aloi tempaan al-1.2si-0.5mg-0.25fe.  - sains malaysiana.  37(2):189-193. 

koh aik khoon, azman jalal@jalil, abdul razak daud, roslan abd. shukor, supian samat, ibrahim abu talib, mazlan othman and baharudin yatim.  (2008).  changes are afoot in physics introductory texts of today.  - college student journal.  42(2):542-544. 

s. abdullah, z. endut, i. ahmad, a. jalar and s. m. yusof.  (2008).  dicing laminated wafer for qfn 3d stacked die packaging..  - advanced materials research.  31:202-205. 

a. jalar, s. h.a. razak and m. a. a. hamid.  (2008).  effects of power and force during wire bonding process on wire pull strength for qfn stacked die.  - journal of solid state science and technology.  16(2):8-14. 

s. abdullah, m.f.mod yunoh, a. jalar & h.kamarudin.  (2008).  effects of strain rates on the characterization of 99.99% gold wire: a case study in micro tensile testing.  - proceedings of the 1st wseas international conference on materials science (materials`08).  . 

a. jalar and s. a. radzi.  (2008).  some aspects on free air ball (fab) formation copper wire bonding.  - journal of solid state science and technology.  16(2):118-122. 

a. jalar and m. f. rosle.  (2008).  effect of ultrasonic energy and force on intermetallic growth patterns for 2n gold wire.  - journal of solid state science and technology.  16(2):157-162. 

a. jalar, m. f. rosle and m. a. a. hamid.  (2008).  effects of thermal aging on intermetallic compounds and voids formation in aual wire bonding.  - journal of solid state science and technology.  16(2):240-246. 

a. jalar, m. f. rosle & m. a. a. hamid.  (2008).  effects of parameter match on bondability and reliability in thermosonic gold bonding.  - journal of solid state science and technology.  16(2):180-188. 

abdullah, s; aziz, za; ahmad, i; jalar, a; abdullah, mf.  (2008).  wire sweep issue in a newly developed quad flat no-lead (qfn) semiconductor package.  - new aspects of microelectronics, nanoelectronics, optoelectronics.  . 

jalar, a; rosle, mf; hamid, maa.  (2008).  effect of die bonding condition for die attach film performance in 3d qfn stacked die.  - new aspects of microelectronics, nanoelectronics, optoelectronics.  . 

a. jalar, h. kamarudin, s. abdullah and mf mod yunoh.  (2008).  computers and simulation in modern science, volume ii.  - .  Vol II, 20-26. 

a. jalar, m. f. rosle, m. a. a. hamid.  (2008).  die attach film performance in 3d gfn stacked die.  - wseas transaction on applied and theoretical menchanics.  3(3):104-113. 

m.k. md arshad, a. jalar, i. ahmad and g. omar.  (2007).  the characterization of al bond pad surface treatment in electroless nickel immersion gold (enig) deposition.  - american journal of applied sciences.  4(3):133-141. 

eu poh leng, min ding, joah rayos, ibrahim ahmad, azman jalar and cui cheng qiang.  (2007).  the effect of ni thickness on mechanical strength of pb-free bga spheres on selectively plated ni/au finish.  - proceedings of ieee international electronics manufacturing technology symposium on advanced packaging materials,san jose, cs usa.  . 

a. jalar, b.y. majlis, i.ahmad and e.p leng.  (2007).  mechanical properties of sn3.5ag and sn3.8ago0.7cu solder balls for bga package.  - international journal of engineering and technology.  4(2):221-227. 

eu poh leng, min ding, wayne lindsay, sheila chopin, ibrahim ahmad and azman jalar.  (2007).  pb-free bga solder joint reliability improvement with sn3.5ag solder alloy on ni/au finish.  - proceedings of ieee international electronics manufacturing technology symposium on advanced packaging materials, san jose, cs usa.  . 

a. jalar, b. y. majlis, i. ahmad, e. p. leng.  (2007).  mehanical properties of sn3.5ag and sn3.8ag0.7cu solder balls for bga package.  - proceeding of 2nd international engineering convention, jeddah, saudi arabia.  221-227. 

i. ahmad, a. jalar, b. y. majlis, r. wagiran.  (2007).  reliability of sac405 & sac387 as lead-free solder ball material for ball grid array packages.  - proceeding of 2nd international engineering convention, jeddah, saudi arabia.  4(1):122-123. 

i.ahmad, a. jalar, b.y. majlis and r. wagiran.  (2007).  reliability of sac405 and sac387 as lead-free solder ball material for ball grid array packages.  - international journal of engineering and technology.  4(1):123-133. 

m.k. md arshad, a. jalar, i. ahmad.  (2007).  characterization of parasitic residual deposition on passivation layer in electroless niskel immersion gold process.  - microelectronic reliability.  47: 1120-1126. 

ibrahim ahmad, b. y. majlis, a. jalar, eu poh leng.  (2007).  optimization of nickel thickness on substrate for tbga using sac387 solder material.  - proceedings of ieee international electronics manufacturing technology symposium on advanced packaging materials, san jose, cs usa.  . 

eu poh leng, ming ding, wayne lindsay, sheila chopin, ibrahim ahmad, azman jalar.  (2007).  pb-free bga solder joint reability improvement with sn3.5ag solder alloy on ni/au finish.  - the effect of nickel thickness on mechanical strenght of pb-free bga spheres on selectively plated ni/au finish.  . 

s. abdullah, s. mohd yusof, i. ahmad, a. jalar and r. daud.  (2007).  dicing die attach film for 3d stacked die qfn packages.  - proceedings of the 32nd international electronics manufacturing technology symposium (iemt 2007), 3-5 october, 2007, california usa..  . 

mohd khairudin md arshad, ibrahim ahmad, azman jalar & ghazali omar.  (2006).  the surface characteristics of under bump metallurgy (ubm) in electroless nickel immersion gold (enig) deposition.  - microelectronic reliability.  46 (2006):367-379. 

hoh huey jiun, ibrahim ahmad, azman jalar, ghazali omar.  (2006).  effect of water thinning methods towards fracture strength and topography of silicon die.  - microelectronics reliability.  46(2006):836-845. 

hoh huey jiun, ibrahim ahmad, azman jalar and ghazali omar.  (2006).  effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping.  - ieee transactions on electronic packaging manufacturing.  29(1):17-24. 

m.k.md arshad, i. ahmad, a. jalar, g. omar and u. hashim.  (2006).  the effects of multiple zincation process on aluminium bond surface for electroless nickel gold deposition.  - journal of electronic packaging.  128:248-250. 

azman jalar, muhammad azmi abdul hamid, roslinda shamsudin dan abdul razak daud.  (2001).  sifat kesuperplastikan aloi aluminium komersial.  - prosiding persidangan kebangsaan penyelidikan dan pembangunan institusi pengajian tinggi awam 2001 penerbit ukm bangi.  .