xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2023). a new unified creep-plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading. - fatigue & fracture of engineering materials & structures. 1413-1425. |
ibrahim n. amirrah, izzat zulkiflee, m. f. mohd razip wee, asad masood, kim s. siow, antonella motta and mh busra fauzi. (2023). plasma-polymerised antibacterial coating of ovine tendon collagen type i (otc) crosslinked with genipin (gnp) and dehydrothermal-crosslinked (dht) as a cutaneous substitute for wound healing. - materials. 1-26. |
maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail. (2023). development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach. - . . |
doyeop namgoong; kim s. siow; jong hyun lee. (2023). improvement of bondability by addition of carboxylic acid to the sinter bonding paste containing bimodal sized cu particles and rapid bonding in air. - metals and materials international. 457-466. |
asad masood, naeem ahmed, m. f. mohd razip wee, anuttam patra, ebrahim mahmoudi, kim s. siow. (2023). atmospheric pressure plasma polymerisation of d-limonene and its antimicrobial activity. - polymers (mdpi). 1-15. |
xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2023). unveiling the damage evolution of sac305 during fatigue by entropy generation. - international journal of mechanical sciencess. 1-12. |
naeem ahmed; kim s. siow; m. f. mohd razipwee; anuttam patra. (2023). a study to examine the ageing behaviour of cold plasma-treated agricultural seeds. - scientific report. 1-12. |
naeem ahmed, akmal suhaimi , asad masood , ebrahim mahmoudi , kim s. siow, m.f. mohd razip wee. (2023). antimicrobial property of polyethersulfone (pes) membrane by plasma copolymerization of teos and oxazoline for organic dyes filtration. - results in engineering. 1-11. |
asad masood, naeem ahmed, mohd farhanulhakim mohd razip wee, muhammad aniq shazni mohammad haniff, ebrahim mahmoudi, anuttam patra, kim s siow. (2023). pulsed plasma polymerisation of carvone: characterisations and antibacterial properties. - surface innovations. 339-351. |
asad masood, naeem ahmed, fatima shahid, m. f. mohd razip wee, anuttam patra, kim s. siow. (2023). atmospheric pressure plasma polymerization of carvone: a promising approach for antimicrobial coatings. - coatings. 1-22. |
xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2022). constitutive creep and fatigue behavior of sintered ag for finite element simulation of mechanical reliability a critical review. - journal of materials science-materials in electronics. 2293-2309. |
xu long, jiaqi zhu, yutai su, kim s. siow, chuantong chen. (2022). phase-field modelling for crack evolution of pbx under thermo- mechanical loadings. - proceedings of the asme 2022 international mechanical engineering congress and exposition (imece2022). 1-7. |
chua siang tat, siow kim shyong. (2022). perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik. - . 167. |
xu long, tianxiong su, zubin chen, yutai su, kim s. siow. (2022). tunable coefficient of thermal expansion of composite materials for thin-film coatings. - coatings. 1-17. |
naeem a, siow ks, wee mfmr, ho wk, patra a.. (2022). the hydrophilization and subsequent hydrophobic recovery mechanism of cold plasma (cp) treated bambarra groundnuts.. - materials science forum. 161-169. |
naeem ahmed, muhammad shahid, kim s siow, m f mohd razip wee, farah farhanah haron, anuttam patra, shazrul fazry. (2022). germination and growth improvement of papaya utilizing oxygen (o2) plasma treatment. - j physic d appl phys. 1-11. |
naeem ahmed, asad masood, kim s. siow, m. f. mohd razip wee, farah farhanah haron, anuttam patra, nafarizal nayan & chin fhong soon. (2022). effects of oxygen (o2) plasma treatment in promoting the germination and growth of chili. - plasma chem plasma processing. 91-108. |
a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow. (2022). influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints. - international conference on electronic and advanced materials (iceam 2021). 1-6. |
siow kim shyong. (2022). patent landscape of sintered cu and ag as die-attach materials in microelectronics packaging. - 2022 ieee 39th international electronics manufacturing technology conference (iemt). 1-6. |
jiaqi zhu, yutai su, chen chuantong, kim s. siow, ruitao tang, xu long. (2021). porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling. - 2021 ieee 23rd electronics packaging technology conference (eptc). 317-321. |
siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng. (2021). effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells. - sains malaysiana. 3499-3510. |
yanliang shan, yunhui mei,, meiyu wang, xin li, yanhong tian, gang chen, siow kim shyong. (2021). ratcheting behavior of sintered copper joints for electronic packaging. - ieee transactions on components, packaging and manufacturing technology. 983-989. |
a. suhaimi , e. mahmoudi, k. s. siow, a. w. mohammad, m. f. mohd razip wee. (2021). nitrogen incorporation by plasma polymerization of heptylamine on pes membrane for removal of anionic dye (congo red). - international journal of environmental science and technology. 1443-1452. |
esa sr, omar g, sheikh md fadzullah sh, siow ks, abdul rahim b. (2021). the evolutions of microstructure in pressureless sintered silver die attach material. - international journal of nanoelectronics and materials. 179-194. |
naeem ahmed, kim s. siow, m. f. mohd razip wee. (2021). germination and growth enhancement of bambara groundnut utilizing low-pressure plasma treatment. - imen student colloquim. 1-5. |
siow kim shyong. (2021). mampukah rawatan plasma menyelesaikan masalah krisis keselamatan makanan?. - majalah sains. 1-5. |
km kumar, ks siiow, b. beake. (2021). 3-d finite element modeling of nanoindentation on sn-3.5ag lead-free solder. - 2021 ieee regional symposium on micro and nanoelectronics (rsm). 84-87. |
akmal suhaimi, ebrahim mahmoudi, rhonira latif, kim s. siow, m. hazani m. zaid, abdul wahab mohammad, m.f. mohd razip wee. (2021). superhydrophilic organosilicon plasma modification on pes membrane for organic dyes filtration. - journal of water process engineering. 102-352. |
mohd farhanulhakim bin mohd razip wee;burhanuddin bin yeop majlis;siow kim shyong;ooi poh choon. (2021). metallic-polymer nanocomposite by plasma-based deposition process for two-terminal diode based application. - . . |
chen tiam foo, siow kim shyong. (2021). comparing the mechanical and thermal-electrical properties of sintered copper (cu) and sintered silver (ag) joints. - journal of alloys and compounds. 1-19. |
naeem ahmed , asad masood , kim s. siow , m. f. mohd razipwee , r.z. auliya, w. k. ho. (2021). effect of h2o-based low-pressure plasma (lpp) treatment on the germination of bambara groundnut seeds. - agronomy. 1-16. |
mohd farhanulhakim bin mohd razip wee;muhamad ramdzan bin buyong;siow kim shyong;lee khai ern;mohd ambri bin mohamed. (2021). anti fouling plasma-modified membrane producing potable clean water. - . . |
rabiah al adawiyah ab rahim, muhammad nubli zulkifli, azman jalar, atiqah mohd afdzaluddin, kim siow shyong. (2020). effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts). - sains malaysiana. 3045-3054. |
nur aizat kamarulzaman, khai ern lee, kim shyong siow, mazlin mokhtar. (2020). public benefit and risk perceptions of nanotechnology development: psychological and sociological aspects. - technology in society. 1-9. |
lee khai ern;mazlin mokhtar;mohd. raihan bin taha;mohd talib bin latif;marlia binti mohd hanafiah;goh choo ta;siow kim shyong;lubna alam. (2020). public risk perception and ethical governance of nanotechnology for sustainability in malaysia. - . . |
muhamad ramdzan bin buyong;burhanuddin bin yeop majlis;norazreen binti abd aziz;azrul azlan bin hamzah;siow kim shyong. (2020). tapered dielectrophoresis electrode for anticlogging in biological fluids filtration. - . . |
chia chin hua;nurul izzaty binti hassan;siow kim shyong;mohd ambri bin mohamed;chin siew xian. (2020). production of metallic conducting nanowires for industrial applications. - . . |
siow kim shyong. (2020). consider a spherical patent: ip and patenting in technology business. - materials world. 52. |
kim s. siow, arifah syahirah abdul rahman, pei yuen ng, burhanuddin y. majlis. (2020). sulfur and nitrogen containing plasma polymers reduces bacterial attachment and growth. - materials science and engineering c. 11022-11026. |
mohd syafiq faiz, mahmoud addouche, ahmad rifqi md zain,kim s. siow, amar chaalane, abdelkrim khelif. (2020). experimental demonstration of a multichannel elastic wave filter in a phononic crystal slab. - applied sciences. 1-11. |
nur aizat kamarulzaman, khai ern lee, kim shyong siow. (2020). concepts and approaches for sustainability management. - . 21. |
a. suhaimi, e. mahmoudi, k.s. siow, m.f. mohd razip wee. (2020). surface modification of polyamide ultrafiltration membrane by plasma polymerisation of acrylic acid. - sains malaysiana. 3097-3104. |
mohd syafiq faiz, kim s. siow, mf mohd razip wee, muhammad musoddiq jaafar, burhanuddin yeop majlis, ahmad rifqi md. zain. (2020). theoretical demonstration of elastic wave guiding in a pillar-based phononic crystal slab. - international journal of nanoelectronics and materials. 83-90. |
siow k.s., chua s.t.. (2020). thermal ageing studies of sintered micron-silver (ag) joint as a lead-free bonding material. - metals and materials international. 1404-1414. |
s. r. esa, g. omar, s. h. sheikh md fadzullah, k. s siow, b. abdul rahim, b. cosut. (2020). diffusion mechanism of silver particles in polymer binder for die attach interconnect technology. - international journal of nanoelectronics and materials. 461-472. |
siow kim shyong. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 279. |
siow kim shyong. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 15. |
kim s.siow, leanne britcher, sunil kumar, hans j.griesser. (2019). qcm-d and xps study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups. - colloids and surfaces b: biointerfaces. . |
siow kim shyong, vemal raja manikam, chua siang tat. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 40. |
nur aizat kamarulzaman, khai ern lee, kim shyong siow, mazlin mokhtar. (2019). psychological and sociological perspectives for good governance of sustainable nanotechnology development in malaysia. - journal of nanoparticle research. 1-21. |
yunhui mei, wang z, siow kim shyong. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 26. |
rabiah al adawiyah ab rahim, azman jalar, maria abu bakar, siow kim shyong. (2019). effect of substrate surface roughness on the growth of intermetallic compound layer lead free solder joint. - . 1-5. |
meyghani b, awang m, emamian s, plank b, christoph h, siow ks,. (2019). stress analysis of nano porous material using computed tomography images. - materialwissenschaft und werkstofftechnik. . |
siow, k.s., chua, s.t., beake, b.d., zuruzi, a.s.. (2019). influence of sintering environment on silver sintered on copper substrate. - journal of materials science: electronic materials. . |
muhammad izzuddin abd samad, muhamad ramdzan buyong, shyong siow kim, burhanuddin yeop majlis. (2019). dielectrophoresis velocities response on tapered electrode profile: simulation and experimental. - microelectronics international. 45-53. |
b. meyghani, m. awang, p. bokam, b. plank, c. heinzl, k. s. siow. (2019). finite element modeling of nano porous sintered silver material using computed tomography images. - material science and engineering technology. 533-538. |
siow ks, chua st. (2019). thermal cycling of sintered silver (ag) joint as die-attach material. - jom. 3066-3075. |
siow kim shyong. (2019). bahan pelekat cip bersuhu tinggi dalam pempakejan mikroelektronik. - majalah sains. . |
chen tiam foo, chan yuen wah, siow kim shyong. (2018). keserasian biologi daripada modifikasi plasma. - . 102. |
siow ks, chua st & zuruzi as. (2018). interfacial tem analysis of sintered silver in air and n2-5%h2 gases environment. - 38th international electronics manufacturing technology conference. . |
siow kim shyong, chen tiam foo, yong zhen xin. (2018). triz trends of engineering system evolution of silver sinter-ing tools used to produce power module in hybrids and electric vehicles. - international journal of engineering & technology. . |
mohd amir zulkefli, mohd ambri mohamed, kim s. siow, burhanuddin yeop majlis. (2018). peranti suis sistem nanoelektromekanik (nems) berunsurkan grafin dan tiub nano karbon (cnt). - sains malaysiana. 619-633. |
yijing xie, yanjie wang, yunhui mei, haining xie, kun zhang, shuangtao feng, kim s siow, xin li, guo-quan lu,. (2018). rapid sintering of nano-ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging. - journal of materials processing technology. 644-649. |
muhammad izzuddin abd samad, farahdiana wan yunus, muhamad ramdzan buyong, kim shyong siow, azrul azlan hamzah & burhanuddin yeop majlis. (2018). voltage characterization on dielectrophoretic force respond to hematologic cell manipulation. - 2018 ieee international conference on semiconductor electronics (icse2018). . |
muhammad khairulanwar abdul rahim, muhamad ramdzan buyong, nur mas ayu jamaludin, azrul azlan hamzah, kim shyong siow, burhanuddin yeop majlis. (2018). characterization of permittivity and conductivity for eskape pathogens detection. - 2018 ieee international conference on semiconductor electronics (icse2018). . |
kim s. siow, leanne britcher, sunil kumar, hans j griesser. (2018). xps study of sulfur and phosphorus compounds with different oxidation states. - sains malaysiana. . |
mohd amir zulkefli, mohd ambri mohamed, kim s. siow, burhanuddin yeop majlis, jothiramalingam kulothungan, manoharan muruganathan, hiroshi mizuta. (2018). stress analysis of perforated graphene nano-electro-mechanical (nem) contact switches by 3d finite element simulation. - microsystem technologies. 1179-1187. |
kim s. siow. (2018). low pressure plasma modifications for the generation of hydrophobic coatings for biomaterials applications. - plasma processes and polymers. . |
arifah rahman, m. farhanulhakim mohd razip wee, siow kim shyong. (2018). teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan. - . 15. |
arifah syahirah abdul rahman , kim s siow, pei yuen ng & burhanuddin yeop majlis. (2018). sulfur and nitrogen-containing plasma polymerised surfaces promotes osteogenic differentiation in wharton-jelly mesenchymal stem cell. - . . |
nur aizat kamarulzaman, khai ern lee, kim shyong siow. (2018). public perception of nanotechnology for good governance: a conceptual framework for psychological and sociological approaches. - journal of food, agriculture and environment. . |
serbini noorul zatul, kim s. siow, abu samah zuruzi. (2017). fiber treatment and loading affect mechanical properties of bamboo/cement composite. - international journal of advances in agricultural and environmental engineering. 19-22. |
sp lim, b pan, h zhang, w ng, b. wu, ks siow, s sabne, m. tsuriya. (2017). high-temperature pb-free die attach material project phase 1: survey result. - international conference on electronic packaging, yamagata japan. 51-56. |
mohd amir zulkefli, mohd ambri mohamed, kim s. siow, burhanuddin yeop majlis, jothiramalingam kulothungan, manoharan muruganathan, hiroshi mizuta. (2017). stress analysis of perforated graphene nanoelectromechanical (nem) contact switches using 3d finite element simulation for mechanical reliability improvement. - international conference on nanoscience and nanotechnology 2017 (nano-scitech 2017). . |
siow ks. (2017). pengelupasan grafit untuk mengkomersilkan teknologi grafin. - sains malaysiana. 1047-1059. |
kim siow. (2017). pengelupasan grafit untuk mengkomersilkan teknologi grafin. - sains malaysiana. 1047-1059. |
nur aizat kamarulzaman, khai ern lee & kim shyong siow. (2017). a conceptual framework explaining public perception of nanotechnology towards sustainable development. - international conference on environmental research and technology (icert 2017). 22-27. |
mohd amir zulkefli, mohd ambri mohamed, k. s. siow, burhanuddin yeop majlis, jothiramalingam kulothungan, manoharan murugunathan, hiroshi mizuta. (2017). three-dimensional finite element method simulation of perforated graphene nano-electro-mechanical (nem) switches. - micromachines. 1-16. |
d wang, yh mei, h xie, k zhang, ks siow, x li, gq lu,. (2017). roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material. - materials letters. 1-4. |
kim s siow, leanne britcher, sunil kumar, hans griesser. (2017). plasma polymers containing sulfur and their co-polymers with 1,7-octadiene: chemical and structural analysis. - plasma processes and polymers. 16000-16004. |
tiam foo chen, kim shyong siow, pei yuen ng, burhanuddin yeop majlis. (2017). enhancing the biocompatibility of the polyurethane methacrylate and off-stoichiometry thiol-ene polymers by argon and nitrogenplasma treatment. - materials science and engineering c. 613-621. |
tf chen, k s siow, py ng, mh nai, ct lim and by majlis. (2016). ageing properties of polyurethane methacrylate and off-stoichiometry thiol-ene polymers after nitrogen and argon plasma treatment. - journal of applied polymer science. 1-12. |
chan yw, siow ks, ng py, u gires, burhanuddin ym. (2016). plasma polymerized carvone as an antibacterial and biocompatible coating. - materials science and engineering c. 861-871. |
st chua, ks siow. (2016). microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (dbc) and copper substrates aged at 300 c. - journal of alloys and compounds. 486-498. |
kim s siow, y t lin. (2016). identifying the development state of sintered silver (ag) as a bonding material in the microelectronic packaging via a patent landscape study. - journal of electronic packaging. 1-13. |
razip wee, m.f.m, addouche m., siow, k.s., md zain, a.r., elayouch, a., chollet, f., khelif, a.. (2016). guiding and confinement of interface acoustic waves in solid-fluid pillar-based phononic crystals. - aip advances. 121-703. |
siow ks, mérigeault e.,. (2016). patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging. - 2016 ieee 37th international electronics manufacturing technology (iemt) & 18th electronics materials and packaging (emap) conference,. 77619-77625. |
mohd amir zulkefli, mohd ambri mohamed, kim s siow, burhanuddin yeop majlis. (2016). optimization of beam length and air gap of suspended graphene nems switch for low pull-in voltage application. - ieee-icse2016 proc. 2016, kuala lumpur, malaysia. 29-32. |
m.f. mohd razip wee, kim s. siow, ahmad rifqi md zain,mahmoud addouche,abdelkrim khelif. (2016). solid-fluid interaction in a pillar-based phononic crystal. - ieee-icse2016 proc. 2016, kuala lumpur, malaysia. 47-49. |
siow kim shyong. (2016). health and environmental safety of nano-materials: polymer nano-composites and other materials containing nanoparticles. - materials world (iom3 publication). 24. |
wee m.f.m.r., siow k.s., zain a.r.m., addouche m., khelif a.. (2016). solid-fluid interaction in a pillar-based phononic crystal. - ieee international conference on semiconductor electronics, proceedings, icse. 47-49. |
ks siow, tf chen, yw chan, a jalar, rm vemal, st chua dan f husna. (2015). characterization of silicone gel properties for high power igbt modules and mems. - 2015 ieee conference on sustainable utilization and development in engineering and technology (csudet). 23-27. |
yw chan, tf chen, ks siow, by majlis, ts yeoh. (2015). triz technique to produce stable plasma modified surfaces with high density of reactive chemical functionalities. - 2015 ieee conference on sustainable utilization and development in engineering and technology (csudet). 11-16. |
st chua, ks siow, a. jalar. (2015). effect of sintering atmosphere on the shear properties of pressureless sintered silver joint. - 36th ieee international electronics manufacturing technology conference. 1-6. |
kim s siow, sunil kumar and hans griesser. (2015). low pressure plasma methods for generating non reactive hydrophilic and hydrogel like bio interface coatings a review. - plasma processes and polymers. 8. |
azman bin jalar @ jalil, norinsan kamil bin othman, siow kim shyong, syarif junaidi bin sjarifuddin djalil. (2015). pencirian wayar aloi pateri bebas plumbum (pb). - . . |
abu samah zuruzi, kim s siow. (2015). electrical conductivity of porous silver made from silver nanoparticles. - electronic materials letter. 315-321. |
foo s.p., siow k.s., a. jalar. (2014). synthesizing snagcu nanoparticles by electrodeposition of reverse microemulsion electrolyte. - 2014 ieee international conference on semiconductor electronics (icse 2014). 513-516. |
ks siow. (2014). setting up an intellectual properties intermediary services: dmaic way. - international conference on industrial engineering and engineering management, sunway resort, kuala lumpur, 9-12th dec 2014. . |
kim s siow,. (2014). deposition and xps and ftir analysis of plasma polymer coatings containing phosphorus. - plasma processes and polymers. 11(2):133-141. |
chua st, siow ks, jalar a. (2014). effect of sintering atmosphere on the shear properties of pressureless sintered silver joint. - 36th international electronics manufacturing technology conference,. . |
kim s siow. (2014). are sintered silver joints ready for use as interconnect material in microelectronic packaging?. - journal of electronic materials. 43(4):947-961. |