muhamad nur syahiran muhamad yusof, norinsan kamil othman, muhammad hafizuddin roslan, raihana bahru, maria abu bakar, azman jalar.  (2026).  seni bina pempakejan cip kuantum suhu bilik.  - .  222 - 242. 

raihana bahru, a. atiqah, maria abu bakar, abdul rahman mohmad, muhammad aniq shazni mohammad haniff, mohd zulhakimi ab razak, mohd ambri mohamed, azman jalar.  (2026).  systematic literature review on low growth temperature of single layer large area graphene using chemical vapor deposition.  - jurnal kejuruteraan.  3071 - 3092. 

maria abu bakar, azman jalar.  (2026).  perkembangan teknologi memori komputer.  - majalah sains.  . 

bashir temitope balogun, azman bin jalar, maria abu bakar, atiqah mohd afdzaluddin.  (2026).  thermodynamics, diffusion and activation energy of sn-cu solder on copper substrates.  - journal of electronic packaging.  21007 - 21007. 

bashir temitope balogun, azman jalar, maria abu bakar, atiqah mohd afdzaluddin, m.n.s.m. yusof.  (2026).  correlation between surface profile parameters and wetting dynamics of sn-cu solder on modified copper substrates.  - jurnal teknologi.  808 - 818. 

adlil aizat ismail, maria abu bakar, azman jalar, erwan basiron, muhammad nizam ilias.  (2025).  laser rework reliability: impact of heat source on lead-free solder joints in adjacent bga components.  - ieee transactions on components packaging and manufacturing technology.  2663 - 2671. 

maria abu bakar, azman jalar.  (2025).  teknologi pembersihan plasma dalam pembuatan cip semikonduktor.  - majalah sains.  . 

adlil aizat ismail; maria abu bakar; azman jalar; mohd ridzwan yaakub; muhammad iqbal abu latiffi; erwan basiron; muhammad nizam ilias.  (2025).  predictive modeling of imc growth in bga component solder joints using artificial neural networks under rework and temperature cycling conditions.  - 2025 ieee 75th electronic components and technology conference (ectc).  440 - 447. 

ahmad zarif azahar, maria abu bakar, azman jalar.  (2025).  a comparative study of mechanical properties in gold with different purity wire bonding .  - proceedings of the green materials and electronic packaging interconnect technology symposium.  3 - 9. 

adlil aizat ismail, maria abu bakar, azman jalar, mohd ridzwan yaakub, muhammad iqbal abu latiffi, erwan basiron, muhammad nizam ilias.  (2025).  artificial neural networks analysis for predicting gold diffusion in solder joints under various rework and thermal cycling.  - proceedings of the green materials and electronic packaging interconnect technology symposium.  10 - 17. 

maria abu bakar, azman jalar, syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli.  (2025).  epoxy mold compound cracking in bga components: impact of moisture content during assembly.  - proceedings of the green materials and electronic packaging interconnect technology symposium.  38 - 44. 

muhammad nizam ilias, maria abu bakar, azman jalar, adlil aizat ismail, erwan basiron.  (2025).  influence of epoxy molding compounds on crack severity in lead-free solder joints of mirrored nand flash bga packages under thermal cycling conditions.  - proceedings of the green materials and electronic packaging interconnect technology symposium.  45 - 51. 

muhammad firdaus suhaimi, maria abu bakar, azman jalar, adlil aizat ismail, muhammad nizam ilias, mohamad riduwan ramli, fakhrozi che ani, a. atiqah.  (2025).  stereometric analysis of underfilled micro ball grid array solder joints under thermal cycling conditions.  - jurnal kejuruteraan.  1387 - 1396. 

maria abu bakar, azman jalar, muhammad azmi abdul hamid.  (2025).  teknologi transistor: prinsip, pempakejan dan praktis.  - .  . 

maria abu bakar, azman jalar, muhammad azmi abdul hamid.  (2025).  teknologi transistor.  - .  27 - 61. 

maria abu bakar, wan yusmawati wan yusoff.  (2025).  pempakejan transistor.  - .  132 - 168. 

muhammad nizam ilias, maria abu bakar, azman jalar, adlil aizat ismail, erwan basiron, sai song low.  (2025).  crack severity analysis in predicting solder joint reliability for mirrored flip chip ball grid array packages.  - journal of failure analysis and prevention.  1946 - 1959. 

azman jalar, ee may lim, maria abu bakar, adlil aizat ismail, fakhrozi che ani, choo par tan.  (2025).  enhancing ball grid array (bga) component on printed circuit board (pcb) solder joint integrity with antimony element.  - journal of failure analysis and prevention.  813 - 827. 

sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, wan nursheila wan jusoh, maria abu bakar, hassan basher, michael daenen.  (2025).  evaluation of nanoindentation load-depth of ultrasonic aluminium bond on molybdenum back contact layer of cigs thin film photovoltaic.  - journal of advanced research in micro and nano engineering.  58 - 65. 

azman jalar, maria abu bakar, atiqah mohd afdzaluddin, abdul aziz omar.  (2025).  preliminary microgap formation on leadframe mold compound interface of encapsulated electronic components subjected to flood colloidal nanoparticles.  - .  273 - 286. 

nor rashikin abd khalid, muhammad khalil abdullah, maria abu bakar, syed mohamad mardzukey syed mohamed zain, mohamad riduwan ramli.  (2025).  thermal characteristics dependency of epoxy underfill on crosslinker molecular structures and hardener concentration in electronic packaging.  - journal of electronic packaging.  1 - 8. 

erwan basiron, adlil aizat ismail, azman jalar, maria abu bakar, azman ahmad .  (2025).  board level-component solder joints normalized crack severity index of solid-state drive with different reliability temperature cycle test profiles.  - ieee transactions on device and materials reliability.  473 - 480. 

adlil aizat ismail, maria abu bakar, azman jalar, fakhrozi che ani, zol effendi zolkefli, erwan basiron.  (2024).  undissolved gold in fine-pitch bga solder joint under thermal cycling test.  - journal of materials science: materials in electronics.  1-9. 

maria abu bakar, azman jalar, anuar alias.  (2024).  linear growth behaviour of intermetallic compound layer in electronic interconnections.  - science and technology of welding and joining.  1-9. 

mohamad solehin mohamed sunar, maria abu bakar, atiqah a., azman jalar, muhamed abdul fatah muhamed mukhtar, fakhrozi che ani.  (2024).  effect of pvd-coated wall aperture roughness on the life span of fine-pitch stencil printing.  - soldering & surface mount technology.  51-59. 

atiqah binti mohd afdzaluddin;azman bin jalar @ jalil;maria binti abu bakar;lim kar keng.  (2024).  study on fiber treatment process of oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices.  - .  . 

azman bin jalar @ jalil;maria binti abu bakar.  (2024).  development of high reliability and high performance of interconnection technology and materials in electronic packaging.  - .  . 

n. a. azzra, a. atiqah, h. fadhlina, a. jalar, m. a. bakar, a. g. ismail, a. b. m. supian.  (2024).  effect of nanofibril cellulose empty fruit bunch-reinforced thermoplastic polyurethane nanocomposites on tensile and dynamic mechanical properties for flexible substrates.  - polymer composites.  1 - 11. 

linghao wang, azman jalar, maria abu bakar, longhong dan.  (2024).  effect of deformation temperature on the dynamic recrystallization mechanism and dynamic precipitation behavior of mg-gd-nd-zr alloy.  - journal of alloys and compounds.  1 - 13. 

syafiqah afiq rosli, azman jalar, maria abu bakar.  (2024).  quantification of corrosion on cu wire bonding on ag-plated lead frame in hcl for automotive electronic application.  - international journal of automotive and mechanical engineering (ijame).  11596 - 11605. 

sazan a. k. mohammed; abdul h. a. rahman; maria a. bakar; mohd z. a razak.  (2024).  an efficient intersection over union algorithm with angle orientation for an improved 3d object detection.  - 2024 ieee international conference on artificial intelligence in engineering and technology (iicaiet).  312 - 316. 

sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, wan nursheila wan jusoh, maria abu bakar, hassan basher, michael daenen.  (2024).  ultrasonic al bond on mo back-contact layer of cigs solar panel characterization using infinite focus microscope (ifm) and micro-ohmmeter.  - ieee transactions on components, packaging and manufacturing technology.  1123 - 1133. 

adlil aizat ismail, maria abu bakar, azman jalar, zol effendi zolkefli, erwan basiron, muhammad nizam ilias.  (2024).  laser rework process for efficient lead-free solder joints ball grid array (bga) component rework.  - ieee transactions on components, packaging and manufacturing technology.  735 - 742. 

ahmad zarif azahar, maria abu bakar, azman jalar, fakhrozi che ani.  (2024).  effect of die deflection during au wire bonding process on bonding quality in overhang semiconductor package.  - journal of materials engineering and performance.  5836 - 5845. 

sazan ali kamal mohammed, mohd zulhakimi ab razak, abdul hadi abd rahman, maria abu bakar.  (2024).  an efficient intersection over union algorithm for 3d object detection.  - ieee access.  169768 - 169786. 

maria abu bakar, mohamad solehin mohamed sunar, azman jalar, a atiqah, fakhrozi che ani, ibrahym ahmad, zol effendi zolkefli.  (2023).  effect of sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications.  - sains malaysiana.  3247-3258. 

n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

azman jalar, zaidi embong, norinsan kamil othman, najmiddin yaakob, maria abu bakar.  (2023).  proceeding of the 7th international corrosion prevention symposium for research scholars (corsym 2021).  - proceeding of the 7th international corrosion prevention symposium for research scholars (corsym 2021).  1-255. 

maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail.  (2023).  development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach.  - .  . 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, zol effendi zolkefli, erwan basiron.  (2023).  thermal management on the solder joints of adjacent ball grid array (bga) rework components using laser soldering.  - green materials and electronic packaging interconnect technology symposium (epits 2022).  103-113. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2023).  effect of thermomechanical treatment on microstructural and localized micromechanical properties of sn0.7cu solder alloy.  - green materials and electronic packaging interconnect technology symposium (epits 2022).  133-144. 

saraswathy supramaniam, subashini periasamy, muhammad nurhisham, maria abu bakar, azman jalar.  (2023).  measurement of aluminium remnant thickness on copper wire bonding using 3d laser scanning microscope.  - ieee international symposium on the physical and failure analysis of integrated circuits (ipfa).  1-6. 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2023).  corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process.  - .  . 

saraswathy supramaniam, maria abu bakar, a. atiqah, azman jalar, mohd zulhakimi ab. razak.  (2023).  moisture content and early corrosion detection of cu wire bonding in a semiconductor package.  - journal of failure analysis and prevention.  2362-2369. 

maria abu bakar, azman jalar, fakhrozi che ani.  (2023).  pematerian gelombang pin menerusi lubang.  - .  191. 

sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, maria abu bakar, wan nursheila wan jusoh, hassan basher, michael daenen.  (2023).  effect of ultrasonic process parameter on resistance and plastic deformation of the aluminum ribbon bond on molybdenum layer.  - 8th ieee region 10 conference, tencon 2023.  1288-1292. 

a. atiqah, n. ismail, k.k. lim, a. jalar, m.a. bakar, m.a. maleque, r.a. ilyas, a.b.m. supian.  (2022).  properties of recycled metal matrix composites.  - .  93-107. 

fateh ameera mohd yusoff, maria abu bakar, azman jalar.  (2022).  effect of 60% thickness reduction of sn-cu solder alloy on localized micromechanical properties via nanoindentation approach.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

p. vijayakumaran, m. h. m. ramli, m. selvam, k. hamid, a. atiqah, a. jalar, m. a. bakar.  (2022).  reduce wafer remnants through pre-assembly process optimization.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  effects of electrolyte towards copper wire metallurgical interconnection in semiconductor.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages.  - international conference on electronic and advanced materials 2021 (iceam 2021).  1-5. 

aiman hakim badarisman, khirullah abdul hamid, hamizan ideris, maria abu bakar, azman jalar.  (2022).  effects of molding temperature on delamination of small outline transistor (sot).  - international conference on electronic and advanced materials (iceam 2021).  1-7. 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  microstructural characterization of copper wire bonding in semiconductor packaging.  - .  . 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  wedge bond corrosion of copper wire bonding.  - .  . 

m. f. suhaimi, m. abu bakar, a. jalar, f. che ani, m. r. ramli.  (2022).  thermal cycling effect on the crack formation of solder joint in ball grid array package.  - international conference on electronic and advanced materials (iceam 2021) journal of physics: conference series.  1-5. 

m. s. mohamed sunar, m. abu bakar, a. jalar, f. che ani, m . r. ramli.  (2022).  effect of stencil wall aperture on solder paste release via stencil printing.  - international conference on electronic and advanced materials (iceam 2021) - journal of physics: conference series.  1-6. 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  significance of intermetallic compound (imc) layer to the reliability of a solder joint, methods of imc layer thickness measurements.  - .  239-263. 

n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  flux modification for wettability and reliability improvement in solder joints.  - .  195-216. 

a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  advancement of printed circuit board (pcb) surface finishes in controlling the intermetallic compound (imc) growth in solder joints.  - .  217-238. 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

maria binti abu bakar;azman bin jalar @ jalil.  (2022).  pencirian mikrostruktur dan sifat mekanik sambungan pateri pic halus dalam pakej elektronik.  - .  . 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  cardinal and ordinal directions approach in investigating arrayed solder joints crack propagation of ball grid array semiconductor packages.  - ieee transactions on components packaging and manufacturing technology.  1492-1501. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, john burke, zol effendi zolkefli, erwan basiron.  (2022).  effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.  - scientific reports.  1-12. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, zol effendi zolkefli.  (2022).  thermal-induced damage on solder joints of high-density adjacent ball grid array components during the rework process.  - jurnal teknologi.  1-8. 

ahmad syazili md din, maria abu bakar, fakhrozi che ani, mohamad riduwan, muhamed abdul fatah muhamed mukhtar.  (2022).  kesan kadar suapan dan salutan bit pemotong dan terhadap kekemasan proses pemotongan pcb.  - jurnal teknologi.  119-126. 

saraswathy supramaniam, maria abu bakar, azman jalar.  (2022).  early corrosion detection of cu-ag wedge bonding in semiconductor package.  - journal of failure analysis and prevention.  2317-2325. 

maria abu bakar, atiqah mohd afdzaluddin, azman jalar.  (2022).  review on corrosion in electronic packaging trends of collaborative between academia-industry.  - sustainability.  1-33. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, fakhrozi che ani, zol effendi zolkefli.  (2022).  effects of underfill materials on behavior of intermetallic compound thickness of ball grid array solder joints using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-5. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  intermetallic compound thickness of ball grid array solder joints under thermal cycling test using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-4. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  kesan rawatan termomekanik dengan mampatan tunggal terhadap mikrostruktur dan sifat mikromekanik aloi pateri sn-0.7cu.  - sains malaysiana.  3775-3784. 

a atiqah, fa sabaruddin, n ismail, a jalar, ma bakar, aa hamzah, ra ilyas, m asrofi.  (2022).  nanocellulose composites for electronic applications.  - .  481-502. 

azman bin jalar @ jalil;mohd zulhakimi bin ab razak @ mamat;maria binti abu bakar.  (2021).  penentuan sifat kesuperplastikan bagi bahan aloi pateri hijau.  - .  . 

azman bin jalar @ jalil;mohd zulhakimi bin ab razak @ mamat;maria binti abu bakar.  (2021).  mikrostruktur dan sifat superplastik aloi pateri bebas plumbum.  - .  . 

norliza ismail, azman jalar, atiqah afdzaluddin, maria abu bakar.  (2021).  electrical resistivity of sn 3.0 ag 0.5cu solder joint with the incorporation of carbon nanotubes.  - nanomaterials and nanotechnology.  1-9. 

nurul adlin mahadzir, angela amphawan, tendai masunda, p. susthitha menon, azman jalar, maria abu bakar, ahmad ghadafi ismail.  (2021).  tapered waveguide design for mode conversion in mode division multiplexing (mdm).  - optoelectronics and advanced materials rapid communications.  325-331. 

joon shyan tan, wai wai lee, a. atiqah, khirullah abdul hamid, azman jalar, maria abu bakar.  (2021).  the effect of electrolytic deflash current on delamination of epoxy mold compound during tin plating process.  - 2021 ieee regional symposium on micro and noelectronics (rsm).  73-75. 

nadia nor ahmad taufiq, khirullah abdul hamid, aiman hakim badarisman, hamizan ideris, azman jalar, maria abu bakar.  (2021).  elucidation of metal etching defects through the experimental design process characterization at encapsulation and electro-deflashing processes.  - 2021 ieee regional symposium on micro and nanoelectronics (rsm).  69-72. 

azman jalar, syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli, maria abu bakar.  (2021).  effect of potting encapsulation on crack formation and propagation in electronic package.  - the international conference on innovative technology, engineering and sciences 2020 (icites 2020).  351-357. 

syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli, azman jalar, maria abu bakar.  (2021).  effect of moisture content on crack formation during reflow soldering of ball grid array (bga) component.  - the international conference on innovative technology, engineering and sciences 2020 (icites 2020).  309-314. 

khirullah abdul hamid, maria abu bakar, azman jalar, aiman hakim badarisman.  (2021).  incorporation of big data in methodology of identifying corrosion factors in the semiconductor package.  - 2021 international conference on electrical, communication, and computer engineering (icecce).  1-4. 

norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - .  121. 

syed mohamad mardzukey syed mohamed zain, azman jalar, maria abu bakar, fakhrozi che ani, mohamad riduwan ramli.  (2021).  horizontal crack induced vertical crack formation in epoxy mold compound for electronic packaging.  - journal of microelectronics, electronic components and materials.  261-266. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2021).  hubungan peratus mampatan dalam rawatan termomekanikal ke atas sifat mikromekanikal aloi pateri sn-cu menggunakan pendekatan pelekukan nano.  - jurnal fizik malaysia.  10054-10064. 

atiqah mohd afdzaluddin, maria abu bakar.  (2020).  effect of coating element on joining stability of sn-0.3ag-0.7cu solder joint due to aging test.  - sains malaysiana.  3029-3036. 

norliza ismail, maria abu bakar, saiful bahari bakarudin.  (2020).  effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach.  - sains malaysiana.  3073-3080. 

maria abu bakar, azman jalar, norliza ismail1, ahmad ghadafi ismail, najib saedi ibrahim.  (2020).  solderability of coloured lead free solder composite.  - 30th regional conference of solid state science and technology (solid state phenomena).  15-19. 

azman jalar, maria abu bakar, mohd. zulhakimi ab. razak, norliza ismail.  (2020).  morphological effect on the intermetallic compound layer growth kinetics of metallurgical joining.  - 30th regional conference of solid state science and technology (solid state phenomena).  26-30. 

nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail, norliza ismail, maria abu bakar, azman jalar.  (2020).  effect of blast wave on intermetallics formation, hardness and reduced modulus properties of solder joints.  - 30th regional conference of solid state science and technology (solid state phenomena).  31-36. 

azman jalar, maria abu bakar, roslina ismail.  (2020).  temperature dependence of elastic-plastic properties of fine-pitch sac 0307 solder joint using nanoindentation approach.  - metallurgical and materials transactions a-physical metallurgy and material.  1221-1228. 

norliza ismail, azman jalar, maria abu bakar, nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail.  (2020).  microstructural evolution and micromechanical properties of sac305/cnt/cu solder joint under blast wave condition.  - soldering & surface mount technology.  47-56. 

norliza ismail, azman jalar, maria abu bakar, roslina ismail, najib saedi ibrahim.  (2020).  effect of flux functional group for solder paste formulation towards soldering quality of sac305/cnt/cu.  - soldering & surface mount technology.  157-164. 

norliza ismail, azman jalar, maria abu bakar, roslina ismail, nur shafiqa safee, ahmad ghadafi ismail, najib saedi ibrahim.  (2019).  kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian sn-ag-cu/cnt/cu menggunakan pelekukan nano.  - sains malaysiana.  1267-1272. 

maria abu bakar, azman jalar, wan yusmawati wan yusoff, nur shafiqa safee, ariffin ismail, norliza ismail, emee marina salleh, najib saedi ibrahim.  (2019).  kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri sac 0307/enig menggunakan pendekatan pelekukan nano.  - sains malaysiana.  1273-1279. 

wan yusmawati wan yusoff, norliza ismail, nur shafiqa safee, ariffin ismail, azman jalar, maria abu bakar.  (2019).  correlation of microstructural evolution and hardness properties of 99.0sn-0.3ag-0.7cu (sac0307) lead-free solder under blast wave condition.  - soldering & surface mount technology.  102-108. 

rabiah al adawiyah ab rahim, azman jalar, maria abu bakar, siow kim shyong.  (2019).  effect of substrate surface roughness on the growth of intermetallic compound layer lead free solder joint.  - .  1-5. 

mohd adly rahmat saat, rozaidi rasid, maria abu bakar, azman jalar, emee marina salleh.  (2019).  mechanical properties of pe-pet-ps-pp blends produced by high shear mixing.  - polimery.  676-679. 

izhan abdullah, azman jalar, roslina ismail, maria abu bakar, muhammad nubli zulkifli,emee marina salleh.  (2019).  effect of tensile direction on microstructure evolution of sac305 solder wire.  - asm science journal.  53-59. 

hazian mamat, azman jalar, maria abu bakar.  (2019).  characterization on ph-isfet poly bisphenol hydrophobic encapsulation material.  - asm science journal.  65-70. 

norliza ismail, maria abu bakar, azman jalar, muhammad amer hariths jasmin.  (2019).  mechanical properties of sn based lead free solder under different temperature.  - iop conference series: materials science and engineering.  1-5. 

nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail, norliza ismail, emee marina salleh, maria abu bakar & azman jalar.  (2018).  shock wave effect on micromechanics properties of sn-agcu solder (sac 387) via nanoindentation.  - the 3rd international conference on manufacturing, material and metallurgical engineering.  . 

maria abu bakar, azman jalar, mohd zulkifly abdullah, najib saedi ibrahim & mohd ariffin ambak.  (2018).  pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel.  - sains malaysiana.  . 

maria abu bakar, azman jalar.  (2018).  pematerian dan kemasan permukaan papan litar bercetak.  - .  98-129. 

roslina ismail, maria abu bakar, azman jalar.  (2018).  ujian alternatif untuk sifat mikromekanik sambungan dalam pakej elektronik.  - .  130-143. 

maria abu bakar, azman jalar, mohd zulkifly abdullah, najib saedi ibrahim, mohd ariffin ambak.  (2018).  controlling of intermetallic compound solder interconnection-printed circuit board using nickel coating.  - sains malaysiana.  .