fateh ameera mohd yusoff, maria abu bakar, azman jalar.  (2022).  effect of 60% thickness reduction of sn-cu solder alloy on localized micromechanical properties via nanoindentation approach.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

p. vijayakumaran, m. h. m. ramli, m. selvam, k. hamid, a. atiqah, a. jalar, m. a. bakar.  (2022).  reduce wafer remnants through pre-assembly process optimization.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  effects of electrolyte towards copper wire metallurgical interconnection in semiconductor.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, fakhrozi che ani, zol effendi zolkefli.  (2022).  effects of underfill materials on behavior of intermetallic compound thickness of ball grid array solder joints using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-5. 

m. f. suhaimi, m. abu bakar, a. jalar, f. che ani, m. r. ramli.  (2022).  thermal cycling effect on the crack formation of solder joint in ball grid array package.  - international conference on electronic and advanced materials (iceam 2021) journal of physics: conference series.  1-5. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  intermetallic compound thickness of ball grid array solder joints under thermal cycling test using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-4. 

m. s. mohamed sunar, m. abu bakar, a. jalar, f. che ani, m . r. ramli.  (2022).  effect of stencil wall aperture on solder paste release via stencil printing.  - international conference on electronic and advanced materials (iceam 2021) - journal of physics: conference series.  1-6. 

khirullah abdul hamid, maria abu bakar, azman jalar, aiman hakim badarisman.  (2021).  incorporation of big data in methodology of identifying corrosion factors in the semiconductor package.  - 2021 international conference on electrical, communication, and computer engineering (icecce).  1-4. 

syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli, azman jalar, maria abu bakar.  (2021).  effect of moisture content on crack formation during reflow soldering of ball grid array (bga) component.  - the international conference on innovative technology, engineering and sciences 2020 (icites 2020).  309-314. 

azman jalar, syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli, maria abu bakar.  (2021).  effect of potting encapsulation on crack formation and propagation in electronic package.  - the international conference on innovative technology, engineering and sciences 2020 (icites 2020).  351-357. 

joon shyan tan, wai wai lee, a. atiqah, khirullah abdul hamid, azman jalar, maria abu bakar.  (2021).  the effect of electrolytic deflash current on delamination of epoxy mold compound during tin plating process.  - 2021 ieee regional symposium on micro and noelectronics (rsm).  73-75. 

nadia nor ahmad taufiq, khirullah abdul hamid, aiman hakim badarisman, hamizan ideris, azman jalar, maria abu bakar.  (2021).  elucidation of metal etching defects through the experimental design process characterization at encapsulation and electro-deflashing processes.  - 2021 ieee regional symposium on micro and nanoelectronics (rsm).  69-72. 

maria abu bakar, azman jalar, norliza ismail1, ahmad ghadafi ismail, najib saedi ibrahim.  (2020).  solderability of coloured lead free solder composite.  - 30th regional conference of solid state science and technology (solid state phenomena).  15-19. 

azman jalar, maria abu bakar, mohd. zulhakimi ab. razak, norliza ismail.  (2020).  morphological effect on the intermetallic compound layer growth kinetics of metallurgical joining.  - 30th regional conference of solid state science and technology (solid state phenomena).  26-30. 

nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail, norliza ismail, maria abu bakar, azman jalar.  (2020).  effect of blast wave on intermetallics formation, hardness and reduced modulus properties of solder joints.  - 30th regional conference of solid state science and technology (solid state phenomena).  31-36. 

norliza ismail, maria abu bakar, azman jalar, muhammad amer hariths jasmin.  (2019).  mechanical properties of sn based lead free solder under different temperature.  - iop conference series: materials science and engineering.  1-5.