maria abu bakar, azman jalar, anuar alias. (2024). linear growth behaviour of intermetallic compound layer in electronic interconnections. - science and technology of welding and joining. 1-9.
m. f. mohd razip wee, naif h al-hardan, asad masood, mohammed azmi abdul hamid, azman jalar, naser m ahmed. (2024). field-effect transistor biosensors for rapid pathogen detection. - . 24.
naif h. al-hardan, muhammad azmi abdul hamid, mohd firdaus-raih, azman jalar, ain zafirah kamaruddin, lim kar keng, ensaf mohammed al-khalqi, naser m. ahmed. (2024). titanium dioxide ion-sensitive extended gate field effect transistor (isegfet): selective detection of potassium ions in artificial blood serum. - journal of materials science: materials in electronics. 1-16.
naif h m al-hardan, azman jalar, muhammed azmi abdul hamid, mohd firdaus raih. (2024). field-effect transistor biosensors for rapid pathogen detection. - . 230.
naif h. al-hardan, muhammad azmi abdul hami, azman jalar, naser m. ahmed. (2024). the effect of post-annealing temperatures on rectifying properties of anisotype al/zno/p-si/al heterojunctions. - jurnal fizik malaysia. 10062-10070.
naif h. al-hardan, muhammad azmi abdul hamid, mohd firdaus-raih, azman jalar, ain zafirah kamaruddin, lim kar keng, ensaf mohammed al-khalqi, naser m. ahmed. (2024). titanium dioxide ion-sensitive extended gate field effect transistor (isegfet): selective detection of potassium ions in artificial blood serum. - journal of materials science: materials in electronics. 1-16.
adlil aizat ismail, maria abu bakar, azman jalar, fakhrozi che ani, zol effendi zolkefli, erwan basiron. (2024). undissolved gold in fine-pitch bga solder joint under thermal cycling test. - journal of materials science: materials in electronics. 1-9.
mohamad solehin mohamed sunar, maria abu bakar, atiqah a., azman jalar, muhamed abdul fatah muhamed mukhtar, fakhrozi che ani. (2024). effect of pvd-coated wall aperture roughness on the life span of fine-pitch stencil printing. - soldering & surface mount technology. 51-59.
maria abu bakar, azman jalar, anuar alias. (2024). linear growth behaviour of intermetallic compound layer in electronic interconnections. - science and technology of welding and joining. 1-9.
wang, l., jalar, a. & dan, l. (2023). dynamic precipitation and dynamic recrystallization behaviors of mg-gd-nd-zr magnesium alloy during thermal compression deformation. - journal of materials research and technology. 7634-7648.
maria abu bakar, mohamad solehin mohamed sunar, azman jalar, a atiqah, fakhrozi che ani, ibrahym ahmad, zol effendi zolkefli. (2023). effect of sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications. - sains malaysiana. 3247-3258.
ensaf mohammed. al-khalqi, muhammad azmi abdul hamid, naif h. al-hardan, lim kar keng, azman jalar. (2022). magnesium-doped zno nanorod electrolyte insulator semiconductor (eis) sensor for detecting calcium ions. - journal of materials science: materials in electronics. 1618-1630.
abdul a omar, azman jalar, maria a bakar, khirullah a hamid. (2022). sulfur ingression on encapsulated leadframe of discrete semiconductor package. - ieee transactions on components, packaging and manufacturing technology. 544-550.
mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani. (2022). effect of alloy particle size and stencil aperture shape on solder printing quality. - microelectronics international. 81-90.
fateh amera mohd yusoff, maria abu bakar, azman jalar. (2022). kesan rawatan termomekanik dengan mampatan tunggal terhadap mikrostruktur dan sifat mikromekanik aloi pateri sn-0.7cu. - sains malaysiana. 3775-3784.
maria abu bakar, azman jalar, anuar alias. (2024). linear growth behaviour of intermetallic compound layer in electronic interconnections. - science and technology of welding and joining. 1-9.
naif h. al-hardan, muhammad azmi abdul hamid, mohd firdaus-raih, azman jalar, ain zafirah kamaruddin, lim kar keng, ensaf mohammed al-khalqi, naser m. ahmed. (2024). titanium dioxide ion-sensitive extended gate field effect transistor (isegfet): selective detection of potassium ions in artificial blood serum. - journal of materials science: materials in electronics. 1-16.
adlil aizat ismail, maria abu bakar, azman jalar, fakhrozi che ani, zol effendi zolkefli, erwan basiron. (2024). undissolved gold in fine-pitch bga solder joint under thermal cycling test. - journal of materials science: materials in electronics. 1-9.
nik athirah azzra, atiqah afdzaluddin, azman jalar, ahmad ghadafi ismail, zahra dashtizadeh. (2024). physical and electrical properties of sustainable substrate thermoplastic starch/nanocellulose fibre/stannous oxide. - journal of advanced research in applied sciences and engineering technology. 93-101.
mohamad solehin mohamed sunar, maria abu bakar, atiqah a., azman jalar, muhamed abdul fatah muhamed mukhtar, fakhrozi che ani. (2024). effect of pvd-coated wall aperture roughness on the life span of fine-pitch stencil printing. - soldering & surface mount technology. 51-59.
sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, maria abu bakar, wan nursheila wan jusoh, hassan basher, michael daenen. (2023). effect of ultrasonic process parameter on resistance and plastic deformation of the aluminum ribbon bond on molybdenum layer. - 8th ieee region 10 conference, tencon 2023. 1288-1292.
zhiyong li, azman jalar. (2023). study on forming and properties of heat resistant low expansion high silicon aluminum alloy based on genetic algorithm. - 2023 international conference on mechatronics, iot and industrial informatics (icmiii). 292-296.
fateh amera mohd yusoff, maria abu bakar, azman jalar. (2023). effect of thermomechanical treatment on microstructural and localized micromechanical properties of sn0.7cu solder alloy. - green materials and electronic packaging interconnect technology symposium (epits 2022). 133-144.
adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, zol effendi zolkefli, erwan basiron. (2023). thermal management on the solder joints of adjacent ball grid array (bga) rework components using laser soldering. - green materials and electronic packaging interconnect technology symposium (epits 2022). 103-113.
adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani. (2022). intermetallic compound thickness of ball grid array solder joints under thermal cycling test using anova. - 2022 ieee 39th international electronics manufacturing technology conference (iemt). 1-4.
m. f. mohd razip wee, naif h al-hardan, asad masood, mohammed azmi abdul hamid, azman jalar, naser m ahmed. (2024). field-effect transistor biosensors for rapid pathogen detection. - . 24.
naif h m al-hardan, azman jalar, muhammed azmi abdul hamid, mohd firdaus raih. (2024). field-effect transistor biosensors for rapid pathogen detection. - . 230.
maria abu bakar, azman jalar, fakhrozi che ani. (2023). pematerian gelombang pin menerusi lubang. - . 191.
m.a. bakar, a. jalar, a. atiqah, n. ismail. (2022). recent progress in lead-free solder technology. - . 332.
a atiqah, fa sabaruddin, n ismail, a jalar, ma bakar, aa hamzah, ra ilyas, m asrofi. (2022). industrial applications of nanocellulose and its nanocomposites. - . 22.
m. f. mohd razip wee, naif h al-hardan, asad masood, mohammed azmi abdul hamid, azman jalar, naser m ahmed. (2024). field-effect transistor biosensors for rapid pathogen detection. - . 24.
naif h. al-hardan, muhammad azmi abdul hamid, chaker tlili, azman jalar, mohd firdaus raih, naser m. ahmed. (2024). measurements and instrumentation for machine vision. - . 26.
a atiqah, a. jalar, m.a. bakar, n. ismail. (2022). recent progress in lead-free solder technology. - . 332.
a atiqah, fa sabaruddin, n ismail, a jalar, ma bakar, aa hamzah, ra ilyas, m asrofi. (2022). industrial applications of nanocellulose and its nanocomposites. - . 22.
m.a. bakar, a. jalar, a. atiqah, n. ismail. (2022). recent progress in lead-free solder technology. - . 332.
naif h m al-hardan, azman jalar, muhammed azmi abdul hamid, mohd firdaus raih. (2024). field-effect transistor biosensors for rapid pathogen detection. - . 230.
maria abu bakar, azman jalar, fakhrozi che ani. (2023). pematerian gelombang pin menerusi lubang. - . 191.
mohd arif anuar mohd salleh, mohd sharizal abdul aziz, azman jalar, mohd izrul izwan ramli. (2022). recent progress in lead-free solder technology. - . 332.
norliza ismail, azman jalar, maria abu bakar. (2021). pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub. - . 121.
atiqah binti mohd afdzaluddin;azman bin jalar @ jalil;maria binti abu bakar;lim kar keng. (2024). study on fiber treatment process of oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices. - . .
azman bin jalar @ jalil;maria binti abu bakar. (2024). development of high reliability and high performance of interconnection technology and materials in electronic packaging. - . .
maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail. (2023). development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach. - . .
m. deraman, m. a. r. othman, s. a. shamsudin, f. s. omar, h. s. kumar and a. jalar. (2023). self-discharge of supercapacitors. - self-discharge of supercapacitor. 1.
azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar. (2023). corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process. - . .
Geran / Grant | Kolaborator / Collaborator | Status |
---|---|---|
CHARACTERIZATION OF STRUCTURE-PROPERTIES-PERFORMANCE FOR SEMICONDUCTOR PACKAGING AND ASSEMBLY | sandisk storage malaysia sdn bhd | 35.3% (2023-12-01 sehingga 2026-11-30) |
FABRIKASI DAN PENCIRIAN KONDUKTOR BERASASKAN KARBON TERAKTIF DENGAN SUBSTRAT KANJI UNTUK EDIBEL ELEKTRONIK | aiszzy electronics enterprise | 89.1% (2022-10-01 sehingga 2025-03-31) |
KESAN KEHADIRAN GAS KARBON DIOKSIDA (CO2) TERHADAP KAKISAN KELULI KARBON DALAM PERSEKITARAN GEOTERMA. | geothermal resources sdn bhd (grsb) | 71.6% (2024-07-01 sehingga 2025-03-01) |
IMPROVEMENT OF SOLDER JOINT STRENGTH VIA GROOVING FOR FINE-PITCH INTERCONNECTION IN MULTI-CHIP MODULE PACKAGE | vcam international sdn bhd | 7% (2024-11-01 sehingga 2026-10-31) |
MEKANISME TINGKAH LAKU KAKISAN TERPENGARUH MIKROBIOLOGI TERHADAP KELULI KARBON DALAM PERSEKITARAN MARIN | dnv malaysia sdn bhd | 7% (2024-11-01 sehingga 2026-10-31) |