erwan basiron, adlil aizat ismail, azman jalar, maria abu bakar, azman ahmad .  (2025).  board level-component solder joints normalized crack severity index of solid-state drive with different reliability temperature cycle test profiles.  - ieee transactions on device and materials reliability.  473 - 480. 

naif h. al-hardan, muhammad azmi abdul hamid, mohd firdaus-raih, azman jalar, ain zafirah kamaruddin, lim kar keng, ensaf mohammed al-khalqi, naser m. ahmed.  (2024).  titanium dioxide ion-sensitive extended gate field effect transistor (isegfet): selective detection of potassium ions in artificial blood serum.  - journal of materials science: materials in electronics.  1-16. 

maria abu bakar, azman jalar, anuar alias.  (2024).  linear growth behaviour of intermetallic compound layer in electronic interconnections.  - science and technology of welding and joining.  1-9. 

n. a. azzra, a. atiqah, h. fadhlina, a. jalar, m. a. bakar, a. g. ismail, a. b. m. supian.  (2024).  effect of nanofibril cellulose empty fruit bunch-reinforced thermoplastic polyurethane nanocomposites on tensile and dynamic mechanical properties for flexible substrates.  - polymer composites.  1 - 11. 

adlil aizat ismail, maria abu bakar, azman jalar, fakhrozi che ani, zol effendi zolkefli, erwan basiron.  (2024).  undissolved gold in fine-pitch bga solder joint under thermal cycling test.  - journal of materials science: materials in electronics.  1-9. 

alaa omar balkhtb, naif h. al-hardan, muhammad azmi abdul hamid, and azman jalar.  (2025).  structural and spectroscopic properties of hydrothermally synthesized a-gao(oh) structures: impact of annealing temperatures.  - ecs journal of solid state science and technology.  1 - 8. 

li zhiyong, azman jalar, norinsan kamil othman.  (2025).  effect of y2o3 content on microstructure, mechanical properties, and corrosion resistance of wc-co hard alloys prepared by powder metallurgy.  - international journal of electrochemical science.  1 - 7. 

adlil aizat ismail, maria abu bakar, azman jalar, zol effendi zolkefli, erwan basiron, muhammad nizam ilias.  (2024).  laser rework process for efficient lead-free solder joints ball grid array (bga) component rework.  - ieee transactions on components, packaging and manufacturing technology.  735 - 742. 

muhammad nubli zulkifli, izhan abdullah, nurul hanis azhan, azman jalar.  (2024).  micromechanical and microstructure evolution of leaded (snpb) and lead-free (sac305 and sncu) mixed solder joints during isothermal aging.  - journal of adhesion science and technology.  3842 - 3859. 

hassan basher, muhammad nubli zulkifli, azman jalar, michael daenen.  (2024).  effect of ultrasonic bonding and lamination on electrical performance of copper indium gallium (de)selenide cigs thin film photovoltaic solar panel.  - journal of adhesion science and technology.  2477 - 2496. 

alaa omar balkhtb, naif h. al-hardan, muhammad azmi abdul hamid, and azman jalar.  (2025).  structural and spectroscopic properties of hydrothermally synthesized a-gao(oh) structures: impact of annealing temperatures.  - ecs journal of solid state science and technology.  1 - 8. 

erwan basiron, adlil aizat ismail, azman jalar, maria abu bakar, azman ahmad .  (2025).  board level-component solder joints normalized crack severity index of solid-state drive with different reliability temperature cycle test profiles.  - ieee transactions on device and materials reliability.  473 - 480. 

sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, wan nursheila wan jusoh, maria abu bakar, hassan basher, michael daenen.  (2025).  evaluation of nanoindentation load-depth of ultrasonic aluminium bond on molybdenum back contact layer of cigs thin film photovoltaic.  - journal of advanced research in micro and nano engineering.  58 - 65. 

li zhiyong, azman jalar, norinsan kamil othman.  (2025).  effect of y2o3 content on microstructure, mechanical properties, and corrosion resistance of wc-co hard alloys prepared by powder metallurgy.  - international journal of electrochemical science.  1 - 7. 

azman jalar, ee may lim, maria abu bakar, adlil aizat ismail, fakhrozi che ani, choo par tan.  (2025).  enhancing ball grid array (bga) component on printed circuit board (pcb) solder joint integrity with antimony element.  - journal of failure analysis and prevention.  813 - 827. 

muhammad nizam ilias, maria abu bakar, azman jalar, adlil aizat ismail, erwan basiron.  (2025).  influence of epoxy molding compounds on crack severity in lead-free solder joints of mirrored nand flash bga packages under thermal cycling conditions.  - proceedings of the green materials and electronic packaging interconnect technology symposium.  45 - 51. 

maria abu bakar, azman jalar, syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli.  (2025).  epoxy mold compound cracking in bga components: impact of moisture content during assembly.  - proceedings of the green materials and electronic packaging interconnect technology symposium.  38 - 44. 

adlil aizat ismail, maria abu bakar, azman jalar, mohd ridzwan yaakub, muhammad iqbal abu latiffi, erwan basiron, muhammad nizam ilias.  (2025).  artificial neural networks analysis for predicting gold diffusion in solder joints under various rework and thermal cycling.  - proceedings of the green materials and electronic packaging interconnect technology symposium.  10 - 17. 

ahmad zarif azahar, maria abu bakar, azman jalar.  (2025).  a comparative study of mechanical properties in gold with different purity wire bonding .  - proceedings of the green materials and electronic packaging interconnect technology symposium.  3 - 9. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2023).  effect of thermomechanical treatment on microstructural and localized micromechanical properties of sn0.7cu solder alloy.  - green materials and electronic packaging interconnect technology symposium (epits 2022).  133-144. 

azman jalar, maria abu bakar, atiqah mohd afdzaluddin, abdul aziz omar.  (2025).  preliminary microgap formation on leadframe mold compound interface of encapsulated electronic components subjected to flood colloidal nanoparticles.  - .  273 - 286. 

maria abu bakar, azman jalar, muhammad azmi abdul hamid.  (2025).  teknologi transistor.  - .  27 - 61. 

raihana bahru, azman jalar, norinsan kamil othman.  (2025).  ujian kebolehharapan pakej transistor.  - .  232 - 264. 

a. atiqah, s. m. sapuan, r. a. ilyas, z. m. a. ainun, k. z. hazrati.  (2024).  sustainable substrate based biocomposites for electronic applications: a review.  - .  93 - 111. 

m. f. mohd razip wee, naif h al-hardan, asad masood, mohammed azmi abdul hamid, azman jalar, naser m ahmed.  (2024).  the physics and operating principle of field-effect transistor based biosensors.  - detection science.  3-27. 

roslan abd shukor, mohd firdaus mohd raih, muhammad yahaya, azman jalar.  (2025).  50 tahun meneroka alam: jabatan fizik universiti kebangsaan malaysia 1970-2020.  - .  . 

maria abu bakar, azman jalar, muhammad azmi abdul hamid.  (2025).  teknologi transistor: prinsip, pempakejan dan praktis.  - .  . 

maria abu bakar, azman jalar, muhammad azmi abdul hamid.  (2025).  teknologi transistor.  - .  27 - 61. 

raihana bahru, azman jalar, norinsan kamil othman.  (2025).  ujian kebolehharapan pakej transistor.  - .  232 - 264. 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2023).  corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process.  - .  . 

azman bin jalar @ jalil;maria binti abu bakar.  (2024).  development of high reliability and high performance of interconnection technology and materials in electronic packaging.  - .  . 

atiqah binti mohd afdzaluddin;azman bin jalar @ jalil;maria binti abu bakar;lim kar keng.  (2024).  study on fiber treatment process of oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices.  - .  . 

maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail.  (2023).  development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach.  - .  . 

m. deraman, m. a. r. othman, s. a. shamsudin, f. s. omar, h. s. kumar and a. jalar.  (2023).  self-discharge of supercapacitors.  - self-discharge of supercapacitor.  1. 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2023).  corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process.  - .  .