pensyarah universiti
institut kejuruteraan mikro & nanoelektronik (imen)
kimsiow@ukm.edu.my
Teknologi Digital dan Terkehadapan,
Kim S Siow ialah Profesor Madya/ Felo Penyelidik di IMEN (2013-sekarang). Bidang penyelidikan beliau adalah berkaitan dengan modifikasi permukaan plasma, pensinteran logam nanopartikel (perak dan tembaga), dan inovasi paten TRIZ. Beliau juga pernah bekerja sebagai jurutera bahan di Infineon Technologies , ON Semiconductor dan Universiti Kebangsaan Singapura (NUS), di samping mengurus teknologi di pusat pemindahan teknologi A*STAR Singapura.
A/Prof Dr Kim S Siow (LLM) is an Associate Professor/ Senior Research Fellow at IMEN . His multi-disciplinary research interests are related to plasma surface modification, electronics packaging - sintered metal (silver and copper) ,soldering, and TRIZ-patent innovation. In addition, he has worked as materials engineer in Infineon Technologies , ON Semiconductor and National University of Singapore, besides working in technology transfer officer at A*STAR Singapore.
i. ahmed, a. ali, k. s. siow, k. l. lim, h. asghar, z. akhtar, j. iqbal, a. fayyaz, z. a. umar. (2026). thickness-dependent structural evolution of vo2 ( m1) thin films and photodetection in n-vo2/p-si heterojunctions. - journal of materials science: materials in electronics. 1740 - 1740.
nur akmar jamil, muhammad feidhul hakim fatah yasin, kim shyong siow, azrul azlan hamzah, mohd ambri mohamed, abdul halim abdul gafor, lydia kamaruzaman, noraidatulakma abdullah, lee pey yee, syara kassim, azaham abdul rahman, p susthitha menon. (2026). bio-immobilization of plasma-polymerized heptylamine and glutaraldehyde for k-spr glucose biosensing. - ieee sensors journal. 74 - 84.
wei jie wang, raihana bahru, xu long, qiang jia, kim shyong siow. (2026). effect of ceo2 nanoparticles on the microstructure evolution and thermal reliability of pressureless sintered silver joints. - materials characterization. 116478 - 116478.
kim shyong siow, wei jie wang, seong ling yap, leong chuan kwek. (2026). packaging and interconnect reliability constraints in nv-center quantum sensors: a microelectronics integration perspective. - journal of electronic materials. 5760 - 5774.
xinyue wang, wenting liu, letao bian, zhoudong yang, guoqi zhang, jing zhang, kim s. siow, pan liu. (2026). microstructure modeling, prediction, and verification of cu-ag sintered paste for die-attach based on the quartet structure generation set (qsgs) algorithm. - 2026 international conference on electronics packaging and hybrid bonding symposium (icep-hbs 2026). 421 - 422.
i. ahmed, a. ali, k. s. siow, k. l. lim, h. asghar, z. akhtar, j. iqbal, a. fayyaz, z. a. umar. (2026). thickness-dependent structural evolution of vo2 ( m1) thin films and photodetection in n-vo2/p-si heterojunctions. - journal of materials science: materials in electronics. 1740 - 1740.
nur akmar jamil, muhammad feidhul hakim fatah yasin, kim shyong siow, azrul azlan hamzah, mohd ambri mohamed, abdul halim abdul gafor, lydia kamaruzaman, noraidatulakma abdullah, lee pey yee, syara kassim, azaham abdul rahman, p susthitha menon. (2026). bio-immobilization of plasma-polymerized heptylamine and glutaraldehyde for k-spr glucose biosensing. - ieee sensors journal. 74 - 84.
wei jie wang, raihana bahru, xu long, qiang jia, kim shyong siow. (2026). effect of ceo2 nanoparticles on the microstructure evolution and thermal reliability of pressureless sintered silver joints. - materials characterization. 116478 - 116478.
kim shyong siow, wei jie wang, seong ling yap, leong chuan kwek. (2026). packaging and interconnect reliability constraints in nv-center quantum sensors: a microelectronics integration perspective. - journal of electronic materials. 5760 - 5774.
ariena md nor, c. k. ngan, a. g. ismail, s. j. lim, z. y. ter, a. mediani, k. s. siow. (2026). balancing pesticide degradation and pungency preservation in chili using an air-based atmospheric pressure plasma jet. - food and bioprocess technology. 1 - 12.
wuzhu yan, yuchang guo, zhen li, xifeng chen, shujing liang, jun liu, tang gu, kim s. siow, xu long . (2025). study of the microstructures and fatigue–creep properties of a laser-directed energy deposition epitaxial ni-based superalloy. - journal of materials engineering and performance. 13771 - 13782.
asad masood, naeem ahmed, mohd farhanulhakim mohd razip wee, muhammad aniq shazni mohammad haniff, ebrahim mahmoudi, anuttam patra, kim s siow. (2023). pulsed plasma polymerisation of carvone: characterisations and antibacterial properties. - surface innovations. 339-351.
xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2022). constitutive creep and fatigue behavior of sintered ag for finite element simulation of mechanical reliability a critical review. - journal of materials science-materials in electronics. 2293-2309.
siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng. (2021). effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells. - sains malaysiana. 3499-3510.
yanliang shan, yunhui mei,, meiyu wang, xin li, yanhong tian, gang chen, siow kim shyong. (2021). ratcheting behavior of sintered copper joints for electronic packaging. - ieee transactions on components, packaging and manufacturing technology. 983-989.
i. ahmed, a. ali, k. s. siow, k. l. lim, h. asghar, z. akhtar, j. iqbal, a. fayyaz, z. a. umar. (2026). thickness-dependent structural evolution of vo2 ( m1) thin films and photodetection in n-vo2/p-si heterojunctions. - journal of materials science: materials in electronics. 1740 - 1740.
nur akmar jamil, muhammad feidhul hakim fatah yasin, kim shyong siow, azrul azlan hamzah, mohd ambri mohamed, abdul halim abdul gafor, lydia kamaruzaman, noraidatulakma abdullah, lee pey yee, syara kassim, azaham abdul rahman, p susthitha menon. (2026). bio-immobilization of plasma-polymerized heptylamine and glutaraldehyde for k-spr glucose biosensing. - ieee sensors journal. 74 - 84.
wei jie wang, raihana bahru, xu long, qiang jia, kim shyong siow. (2026). effect of ceo2 nanoparticles on the microstructure evolution and thermal reliability of pressureless sintered silver joints. - materials characterization. 116478 - 116478.
kim shyong siow, wei jie wang, seong ling yap, leong chuan kwek. (2026). packaging and interconnect reliability constraints in nv-center quantum sensors: a microelectronics integration perspective. - journal of electronic materials. 5760 - 5774.
ariena md nor, c. k. ngan, a. g. ismail, s. j. lim, z. y. ter, a. mediani, k. s. siow. (2026). balancing pesticide degradation and pungency preservation in chili using an air-based atmospheric pressure plasma jet. - food and bioprocess technology. 1 - 12.
xinyue wang, wenting liu, letao bian, zhoudong yang, guoqi zhang, jing zhang, kim s. siow, pan liu. (2026). microstructure modeling, prediction, and verification of cu-ag sintered paste for die-attach based on the quartet structure generation set (qsgs) algorithm. - 2026 international conference on electronics packaging and hybrid bonding symposium (icep-hbs 2026). 421 - 422.
letao bian, xinyue wang, jing zhang, jianhao wang, guoqi zhang, kim s siow, pan liu. (2026). interfacial corrosion behavior analysis of sintered silver and sintered copper joints for power electronics packaging. - 2026 international conference on electronics packaging and hybrid bonding symposium (icep-hbs). 423 - 424.
ariena h, ks siow, ag ismail, ngan chai keong, sj lim, a. mediani. (2025). development and diagnostic evaluation of an atmospheric pressure plasma jet (appj) system for smart agricultural decontamination. - 2025 ieee regional symposium on micro and nanoelectronics (rsm). 36 - 40.
wang wj, siow ks. (2025). enhancing electrochemical migration resistance of sintered silver by ceria additives for die attachment applications. - 2025 ieee 27th electronics packaging technology conference (eptc). 1 - 4.
kim s siow, weijie wang, raihana bahru, xu long, hing wah lee. (2024). exploring the patent landscape of sintered metal technologies: an analysis using llm-based ai patent search. - proc 2024 ieee/chmt(cpmt) international electronics manufacturing technology symposium. 1 - 4.
kim s. siow, chua siang tat, jong-hyun lee. (2024). logam tersinter dalam pempakejan sistem mikroelektromekanik . - . 159 - 180.
nur aizat kamarulzaman, khai ern lee, kim shyong siow. (2020). understanding public benefit and risk perceptions through psychological and sociological aspects for sustainable nanotechnology development in malaysia. - . 2-22.
siow kim shyong. (2019). doctrine of equivalents and sintered silver (ag) paste as bonding materials. - . 165-180.
siow kim shyong, vemal raja manikam, chua siang tat. (2019). process control of sintered ag joint in production for die attach applications. - . 67-106.
yunhui mei, wang z, siow kim shyong. (2019). reliabilty and failure mechanism of sintered silver as die attach joint. - . 125-150.
k s siow. (2026). inovasi tanpa pengetahuan paten adalah kesilapan mahal. - https://www.freemalaysiatoday.com/category/bahasa/pandangan/2026/01/21/inovasi-tanpa-pengetahuan-paten-adalah-kesilapan-mahal. .
siow kim shyong. (2025). carian paten untuk permohonan dana: lebih daripada sekadar formaliti?. - rencana bulanan pkaukm : siri 05/2025. .
siow kim shyong. (2025). bila siti mustika bertemu newton. - free malaysia today. .
kim siow. (2025). satukan pakar lonjak industri pempakejan mikroelektronik. - free malaysia today. .
burhanuddin yeop majlis, rhonira latif. (2024). bahan dimensi rendah dan peranti mems: perkembangan dan kegunaan. - . .
k s siow. (2026). inovasi tanpa pengetahuan paten adalah kesilapan mahal. - https://www.freemalaysiatoday.com/category/bahasa/pandangan/2026/01/21/inovasi-tanpa-pengetahuan-paten-adalah-kesilapan-mahal. .
siow kim shyong. (2025). carian paten untuk permohonan dana: lebih daripada sekadar formaliti?. - rencana bulanan pkaukm : siri 05/2025. .
siow kim shyong. (2025). bila siti mustika bertemu newton. - free malaysia today. .
kim siow. (2025). satukan pakar lonjak industri pempakejan mikroelektronik. - free malaysia today. .
p susthitha menon, mohd ambri mohamed, siow kim shyong, lee pey yee, azrul azlan hamzah, abdul halim bin abdul ghafor, lydia kamaruzaman, noraidatulakma abdullah, ilmi munirah, siti nasuha, nur akmar jamil, muhammad feidhul hakim. (2025). translational research on kretschmann-based surface plasmon resonance biosensing of ckd and ncd. - pemantauan akhir geran translasi ukm 2025. .
| Geran / Grant | Kolaborator / Collaborator | Status |
|---|---|---|
| MICROSTRUCTURAL BEHAVIOR OF HYBRID FILLER RGO/H-BN IN POLYEURETHANE-BASED THERMAL INTERFACE MATERIALS FOR GRAPHIC PROCESSING UNIT CHIPLET PACKAGING | veilfrost technology sdn bhd | 37% (2025-12-01 sehingga 2027-11-30) |
| COPPER-GRAPHENE INTERPOSER AS BALLISTIC THERMAL COOLING MECHANISM FOR DIE HEAT SPREADER AND HIGHLY CONDUCTIVE ELECTRICAL INTERCONNECT FOR WIDE BAND GAP (WBNG) AND ULTRA-WIDE BAND GAP (UWBNG) APPLICATION | infineon technologies sdn bhd | 87.1% (2024-12-01 sehingga 2026-11-30) |
| SOLDER JOINT WITH IMC DISTRIBUTION IN SOLDER MATRIX | infineon technologies sdn bhd | 67.1% (2025-05-15 sehingga 2027-04-15) |
MATERIALS SCIENCE :PURE AND APPLIED SCIENCES
Nanotechnology Biomaterials Plasma Treatment/Polymerization
Pengalaman / Experience : tahun/years(s)
POLICIES AND LAW :ARTS AND APPLIED ARTS
patent law
Pengalaman / Experience : 3 tahun/years(s)
MATERIALS SCIENCE :PURE AND APPLIED SCIENCES
soldering and sintering (\"low\" temperature metallic bonding for high temperature application in power module and EV)
Pengalaman / Experience : 10 tahun/years(s)
MATERIALS SCIENCE :PURE AND APPLIED SCIENCES
plasma modification
Pengalaman / Experience : 13 tahun/years(s)