Untuk Kegunaan UKM sahaja
For UKM use only
Dr. Maria Abu Bakar merupakan pensyarah kanan/felo penyelidik dalam bidang mikroelektronik dan teknologi semikonduktor. Beliau menerima PhD dalam kejuruteraan mikro dan nanoelektronik dan ijazah sarjana dalam sains bahan. Projek penyelidikan PhD beliau memberi tumpuan kepada bahan antarasambungan untuk pempakejan elektronik terutama dari segi kualiti sambungan pateri pada kemasan permukaan yang berbeza. Bidang penyelidikan beliau adalah berkaitan dengan pempakejan semikonduktor elektronik dan bahan terutamanya pada hubungkait antara struktur-sifat-prestasi. Beliau telah berpengalaman selama 10 tahun berkolaborasi dengan pihak industri semikonduktor elektronik di Malaysia. Selain itu, kerjaya beliau sebagai ahli akademik telah membolehkan beliau untuk aktif membimbing pekerja industri dan menggalakkan mereka untuk melanjutkan pengajian peringkat sarjana dan PhD dalam teknologi mikroelektronik dan semikonduktor. Dr. Maria melihat peluang yang baik untuk membentuk masa depan mikroelektronik semikonduktor di Malaysia dengan membentuk kolaborasi penyelidikan antara pihak akademik dan pihak industri elektronik semikonduktor di Malaysia.
Dr. Maria Abu Bakar is a senior lecturer and research fellow in the field of microelectronics and semiconductor technology. She received her PhD in microengineering and nanoelectronics and master’s degree in materials science. Her PhD research project focused on the interconnection material for electronic packaging, especially on the solder joint quality on different surface finishes. Her research interests include semiconductor electronic packaging and materials, especially the structure-properties-performance relationship. She has 10 years’ experience in collaborating with the semiconductor and electronics industries in Malaysia. In addition, her job as an academician has enabled her to actively mentor industrial workers, encouraging them to pursue a master`s or PhD in microelectronics and semiconductor technology. Dr. Maria notices her great opportunities to shape the future of semiconductor microelectronics in Malaysia by establishing good research collaboration between academia and the semiconductor electronics industries in Malaysia.
| MIKRO DAN NANOELEKTRONIK , Doktor Falsafah , UKM , 2017 |
| Sarjana , UKM , 2013 |
| Sarjana Muda dengan Kepujian , UKM , 2007 |
| PURE AND APPLIED SCIENCES - MATERIALS SCIENCE (Electronic Packaging Materials (interconnection materials-wire bonding, solder joint, epoxy mold compound, intermetallic compound))) |
| PURE AND APPLIED SCIENCES - MATERIALS SCIENCE (Mechanical properties, Nanoindentation testing,) |
| PURE AND APPLIED SCIENCES - MATERIALS SCIENCE (Metallograpy, Microstructure, Stereometery Analysis) |
| Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Atiqah A., Azman Jalar, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che Ani. (2024). Effect Of Pvd-coated Wall Aperture Roughness On The Life Span Of Fine-pitch Stencil Printing. - Soldering & Surface Mount Technology. 51-59. |
| Maria Abu Bakar, Azman Jalar, Anuar Alias. (2024). Linear Growth Behaviour Of Intermetallic Compound Layer In Electronic Interconnections. - Science And Technology Of Welding And Joining. 1-9. |
| Adlil Aizat Ismail, Maria Abu Bakar, Azman Jalar, Fakhrozi Che Ani, Zol Effendi Zolkefli, Erwan Basiron. (2024). Undissolved Gold In Fine-pitch Bga Solder Joint Under Thermal Cycling Test. - Journal Of Materials Science: Materials In Electronics. 1-9. |
| Maria Abu Bakar, Atiqah Mohd Afdzaluddin, Azman Jalar. (2022). Review On Corrosion In Electronic Packaging Trends Of Collaborative Between Academia-industry. - Sustainability. 1-33. |
| Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, John Burke, Zol Effendi Zolkefli, Erwan Basiron. (2022). Effect Of Heat Shield Locations On Rework-induced Thermal Management In Ball Grid Array Solder Joint. - Scientific Reports. 1-12. |
| N.ismail, A.atiqah, A.jalar, M.a.bakar, R.a.a.rahim, A.g.ismail, A.a.hamzah, L.k.keng. (2022). A Systematic Literature Review: The Effects Of Surface Roughness On The Wettability And Formation Of Intermetallic Compound Layers In Lead-free Solder Joints. - Journal Of Manufacturing Processes. 68-85. |
| Norliza Ismail, Azman Jalar, Maria Abu Bakar, Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, Ariffin Ismail. (2020). Microstructural Evolution And Micromechanical Properties Of Sac305/cnt/cu Solder Joint Under Blast Wave Condition. - Soldering & Surface Mount Technology. 47-56. |
| Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail, Najib Saedi Ibrahim. (2020). Effect Of Flux Functional Group For Solder Paste Formulation Towards Soldering Quality Of Sac305/cnt/cu. - Soldering & Surface Mount Technology. 157-164. |
| Azman Jalar, Maria Abu Bakar, Roslina Ismail. (2020). Temperature Dependence Of Elastic-plastic Properties Of Fine-pitch Sac 0307 Solder Joint Using Nanoindentation Approach. - Metallurgical And Materials Transactions A-physical Metallurgy And Material. 1221-1228. |
| Maria Abu Bakar, Mohamad Solehin Mohamed Sunar, Azman Jalar, A Atiqah, Fakhrozi Che Ani, Ibrahym Ahmad, Zol Effendi Zolkefli. (2023). Effect Of Sn Plating Thickness On Wettability, Solderability, And Electrical Connections Of Electronic Lead Connectors For Surface Mount Technology Applications. - Sains Malaysiana. 3247-3258. |
| Abdul A Omar, Azman Jalar, Maria A Bakar, Khirullah A Hamid. (2022). Sulfur Ingression On Encapsulated Leadframe Of Discrete Semiconductor Package. - Ieee Transactions On Components, Packaging And Manufacturing Technology. 544-550. |
| Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, Erwan Basiron, Fakhrozi Che Ani. (2022). Cardinal And Ordinal Directions Approach In Investigating Arrayed Solder Joints Crack Propagation Of Ball Grid Array Semiconductor Packages. - Ieee Transactions On Components Packaging And Manufacturing Technology. 1492-1501. |
| Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar. (2022). Temperature-induced Thickness Reduction Of Micromechanical Properties Of Sn-0.7cu Solder Alloy. - Materiali In Tehnologije, Materials And Technology. 373-379. |
| Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar. (2022). Kesan Rawatan Termomekanik Dengan Mampatan Tunggal Terhadap Mikrostruktur Dan Sifat Mikromekanik Aloi Pateri Sn-0.7cu. - Sains Malaysiana. 3775-3784. |
| Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Azman Jalar, Mohamad Riduwan Ramli, Fakhrozi Che Ani. (2022). Effect Of Alloy Particle Size And Stencil Aperture Shape On Solder Printing Quality. - Microelectronics International. 81-90. |
| Nurul Adlin Mahadzir, Angela Amphawan, Tendai Masunda, P. Susthitha Menon, Azman Jalar, Maria Abu Bakar, Ahmad Ghadafi Ismail. (2021). Tapered Waveguide Design For Mode Conversion In Mode Division Multiplexing (mdm). - Optoelectronics And Advanced Materials Rapid Communications. 325-331. |
| Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin, Maria Abu Bakar. (2021). Electrical Resistivity Of Sn 3.0 Ag 0.5cu Solder Joint With The Incorporation Of Carbon Nanotubes. - Nanomaterials And Nanotechnology. 1-9. |
| Syed Mohamad Mardzukey Syed Mohamed Zain, Azman Jalar, Maria Abu Bakar, Fakhrozi Che Ani, Mohamad Riduwan Ramli. (2021). Horizontal Crack Induced Vertical Crack Formation In Epoxy Mold Compound For Electronic Packaging. - Journal Of Microelectronics, Electronic Components And Materials. 261-266. |
| Norliza Ismail, Maria Abu Bakar, Saiful Bahari Bakarudin. (2020). Effect Of Temperature On Strain-induced Hardness Of Lead-free Solder Wire Using Nanoindentation Approach. - Sains Malaysiana. 3073-3080. |
| Atiqah Mohd Afdzaluddin, Maria Abu Bakar. (2020). Effect Of Coating Element On Joining Stability Of Sn-0.3ag-0.7cu Solder Joint Due To Aging Test. - Sains Malaysiana. 3029-3036. |
| Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail, Nur Shafiqa Safee, Ahmad Ghadafi Ismail, Najib Saedi Ibrahim. (2019). Kesan Penuaan Sesuhu Terhadap Sifat Mikro Kekerasan Pempaterian Sn-ag-cu/cnt/cu Menggunakan Pelekukan Nano. - Sains Malaysiana. 1267-1272. |
| Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, Maria Abu Bakar. (2019). Correlation Of Microstructural Evolution And Hardness Properties Of 99.0sn-0.3ag-0.7cu (sac0307) Lead-free Solder Under Blast Wave Condition. - Soldering & Surface Mount Technology. 102-108. |
| Maria Abu Bakar, Azman Jalar, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, Ariffin Ismail, Norliza Ismail, Emee Marina Salleh, Najib Saedi Ibrahim. (2019). Kesan Gelombang Kejutan Terhadap Sifat Mikromekanik Sambungan Pateri Sac 0307/enig Menggunakan Pendekatan Pelekukan Nano. - Sains Malaysiana. 1273-1279. |
| Mohd Adly Rahmat Saat, Rozaidi Rasid, Maria Abu Bakar, Azman Jalar, Emee Marina Salleh. (2019). Mechanical Properties Of Pe-pet-ps-pp Blends Produced By High Shear Mixing. - Polimery. 676-679. |
| Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim & Mohd Ariffin Ambak. (2018). Pengawalan Pertumbuhan Sebatian Antara Logam Sambungan Pateri-papan Litar Bercetak Menggunakan Salutan Nikel. - Sains Malaysiana. . |
| Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim, Mohd Ariffin Ambak. (2018). Controlling Of Intermetallic Compound Solder Interconnection-printed Circuit Board Using Nickel Coating. - Sains Malaysiana. . |
| Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Atiqah A., Azman Jalar, Muhamed Abdul Fatah Muhamed Mukhtar, Fakhrozi Che Ani. (2024). Effect Of Pvd-coated Wall Aperture Roughness On The Life Span Of Fine-pitch Stencil Printing. - Soldering & Surface Mount Technology. 51-59. |
| Maria Abu Bakar, Azman Jalar, Anuar Alias. (2024). Linear Growth Behaviour Of Intermetallic Compound Layer In Electronic Interconnections. - Science And Technology Of Welding And Joining. 1-9. |
| Adlil Aizat Ismail, Maria Abu Bakar, Azman Jalar, Fakhrozi Che Ani, Zol Effendi Zolkefli, Erwan Basiron. (2024). Undissolved Gold In Fine-pitch Bga Solder Joint Under Thermal Cycling Test. - Journal Of Materials Science: Materials In Electronics. 1-9. |
| Saraswathy Supramaniam, Maria Abu Bakar, A. Atiqah, Azman Jalar, Mohd Zulhakimi Ab. Razak. (2023). Moisture Content And Early Corrosion Detection Of Cu Wire Bonding In A Semiconductor Package. - Journal Of Failure Analysis And Prevention. 2362-2369. |
| Maria Abu Bakar, Mohamad Solehin Mohamed Sunar, Azman Jalar, A Atiqah, Fakhrozi Che Ani, Ibrahym Ahmad, Zol Effendi Zolkefli. (2023). Effect Of Sn Plating Thickness On Wettability, Solderability, And Electrical Connections Of Electronic Lead Connectors For Surface Mount Technology Applications. - Sains Malaysiana. 3247-3258. |
| N. A. Azra, A. Atiqah, H. Fadhlina, M. A. Bakar, A. Jalar, R. A. Ilyas, J. Naveen, F. A. Sabaruddin, K. K. Lim, M. Asrofi. (2023). Oil-palm Based Nanocellulose Reinforced Thermoplastic Polyurethane For Plastic Encapsulation Of Biomedical Sensor Devices: Water Absorption, Thickness Swelling And Density Properties. - Applied Science And Engineering Progress. 1-9. |
| Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, Erwan Basiron, Fakhrozi Che Ani. (2022). Cardinal And Ordinal Directions Approach In Investigating Arrayed Solder Joints Crack Propagation Of Ball Grid Array Semiconductor Packages. - Ieee Transactions On Components Packaging And Manufacturing Technology. 1492-1501. |
| Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, John Burke, Zol Effendi Zolkefli, Erwan Basiron. (2022). Effect Of Heat Shield Locations On Rework-induced Thermal Management In Ball Grid Array Solder Joint. - Scientific Reports. 1-12. |
| Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Zol Effendi Zolkefli. (2022). Thermal-induced Damage On Solder Joints Of High-density Adjacent Ball Grid Array Components During The Rework Process. - Jurnal Teknologi. 1-8. |
| Ahmad Syazili Md Din, Maria Abu Bakar, Fakhrozi Che Ani, Mohamad Riduwan, Muhamed Abdul Fatah Muhamed Mukhtar. (2022). Kesan Kadar Suapan Dan Salutan Bit Pemotong Dan Terhadap Kekemasan Proses Pemotongan Pcb. - Jurnal Teknologi. 119-126. |
| Maria Abu Bakar, Atiqah Mohd Afdzaluddin, Azman Jalar. (2022). Review On Corrosion In Electronic Packaging Trends Of Collaborative Between Academia-industry. - Sustainability. 1-33. |
| N.ismail, A.atiqah, A.jalar, M.a.bakar, R.a.a.rahim, A.g.ismail, A.a.hamzah, L.k.keng. (2022). A Systematic Literature Review: The Effects Of Surface Roughness On The Wettability And Formation Of Intermetallic Compound Layers In Lead-free Solder Joints. - Journal Of Manufacturing Processes. 68-85. |
| Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar. (2022). Kesan Rawatan Termomekanik Dengan Mampatan Tunggal Terhadap Mikrostruktur Dan Sifat Mikromekanik Aloi Pateri Sn-0.7cu. - Sains Malaysiana. 3775-3784. |
| Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Azman Jalar, Mohamad Riduwan Ramli, Fakhrozi Che Ani. (2022). Effect Of Alloy Particle Size And Stencil Aperture Shape On Solder Printing Quality. - Microelectronics International. 81-90. |
| Abdul A Omar, Azman Jalar, Maria A Bakar, Khirullah A Hamid. (2022). Sulfur Ingression On Encapsulated Leadframe Of Discrete Semiconductor Package. - Ieee Transactions On Components, Packaging And Manufacturing Technology. 544-550. |
| Saraswathy Supramaniam, Maria Abu Bakar, Azman Jalar. (2022). Early Corrosion Detection Of Cu-ag Wedge Bonding In Semiconductor Package. - Journal Of Failure Analysis And Prevention. 2317-2325. |
| Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar. (2022). Temperature-induced Thickness Reduction Of Micromechanical Properties Of Sn-0.7cu Solder Alloy. - Materiali In Tehnologije, Materials And Technology. 373-379. |
| Syed Mohamad Mardzukey Syed Mohamed Zain, Azman Jalar, Maria Abu Bakar, Fakhrozi Che Ani, Mohamad Riduwan Ramli. (2021). Horizontal Crack Induced Vertical Crack Formation In Epoxy Mold Compound For Electronic Packaging. - Journal Of Microelectronics, Electronic Components And Materials. 261-266. |
| Nurul Adlin Mahadzir, Angela Amphawan, Tendai Masunda, P. Susthitha Menon, Azman Jalar, Maria Abu Bakar, Ahmad Ghadafi Ismail. (2021). Tapered Waveguide Design For Mode Conversion In Mode Division Multiplexing (mdm). - Optoelectronics And Advanced Materials Rapid Communications. 325-331. |
| Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin, Maria Abu Bakar. (2021). Electrical Resistivity Of Sn 3.0 Ag 0.5cu Solder Joint With The Incorporation Of Carbon Nanotubes. - Nanomaterials And Nanotechnology. 1-9. |
| Norliza Ismail, Maria Abu Bakar, Saiful Bahari Bakarudin. (2020). Effect Of Temperature On Strain-induced Hardness Of Lead-free Solder Wire Using Nanoindentation Approach. - Sains Malaysiana. 3073-3080. |
| Atiqah Mohd Afdzaluddin, Maria Abu Bakar. (2020). Effect Of Coating Element On Joining Stability Of Sn-0.3ag-0.7cu Solder Joint Due To Aging Test. - Sains Malaysiana. 3029-3036. |
| Azman Jalar, Maria Abu Bakar, Roslina Ismail. (2020). Temperature Dependence Of Elastic-plastic Properties Of Fine-pitch Sac 0307 Solder Joint Using Nanoindentation Approach. - Metallurgical And Materials Transactions A-physical Metallurgy And Material. 1221-1228. |
| Norliza Ismail, Azman Jalar, Maria Abu Bakar, Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, Ariffin Ismail. (2020). Microstructural Evolution And Micromechanical Properties Of Sac305/cnt/cu Solder Joint Under Blast Wave Condition. - Soldering & Surface Mount Technology. 47-56. |
| Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail, Najib Saedi Ibrahim. (2020). Effect Of Flux Functional Group For Solder Paste Formulation Towards Soldering Quality Of Sac305/cnt/cu. - Soldering & Surface Mount Technology. 157-164. |
| Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, Maria Abu Bakar. (2019). Correlation Of Microstructural Evolution And Hardness Properties Of 99.0sn-0.3ag-0.7cu (sac0307) Lead-free Solder Under Blast Wave Condition. - Soldering & Surface Mount Technology. 102-108. |
| Mohd Adly Rahmat Saat, Rozaidi Rasid, Maria Abu Bakar, Azman Jalar, Emee Marina Salleh. (2019). Mechanical Properties Of Pe-pet-ps-pp Blends Produced By High Shear Mixing. - Polimery. 676-679. |
| Izhan Abdullah, Azman Jalar, Roslina Ismail, Maria Abu Bakar, Muhammad Nubli Zulkifli,emee Marina Salleh. (2019). Effect Of Tensile Direction On Microstructure Evolution Of Sac305 Solder Wire. - Asm Science Journal. 53-59. |
| Maria Abu Bakar, Azman Jalar, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, Ariffin Ismail, Norliza Ismail, Emee Marina Salleh, Najib Saedi Ibrahim. (2019). Kesan Gelombang Kejutan Terhadap Sifat Mikromekanik Sambungan Pateri Sac 0307/enig Menggunakan Pendekatan Pelekukan Nano. - Sains Malaysiana. 1273-1279. |
| Hazian Mamat, Azman Jalar, Maria Abu Bakar. (2019). Characterization On Ph-isfet Poly Bisphenol Hydrophobic Encapsulation Material. - Asm Science Journal. 65-70. |
| Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail, Nur Shafiqa Safee, Ahmad Ghadafi Ismail, Najib Saedi Ibrahim. (2019). Kesan Penuaan Sesuhu Terhadap Sifat Mikro Kekerasan Pempaterian Sn-ag-cu/cnt/cu Menggunakan Pelekukan Nano. - Sains Malaysiana. 1267-1272. |
| Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim & Mohd Ariffin Ambak. (2018). Pengawalan Pertumbuhan Sebatian Antara Logam Sambungan Pateri-papan Litar Bercetak Menggunakan Salutan Nikel. - Sains Malaysiana. . |
| Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim, Mohd Ariffin Ambak. (2018). Controlling Of Intermetallic Compound Solder Interconnection-printed Circuit Board Using Nickel Coating. - Sains Malaysiana. . |
| Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, Zol Effendi Zolkefli, Erwan Basiron. (2023). Thermal Management On The Solder Joints Of Adjacent Ball Grid Array (bga) Rework Components Using Laser Soldering. - Green Materials And Electronic Packaging Interconnect Technology Symposium (epits 2022). 103-113. |
| Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar. (2023). Effect Of Thermomechanical Treatment On Microstructural And Localized Micromechanical Properties Of Sn0.7cu Solder Alloy. - Green Materials And Electronic Packaging Interconnect Technology Symposium (epits 2022). 133-144. |
| Sabarina Abdul Hamid, Muhammad Nubli Zulkifli, Azman Jalar, Maria Abu Bakar, Wan Nursheila Wan Jusoh, Hassan Basher, Michael Daenen. (2023). Effect Of Ultrasonic Process Parameter On Resistance And Plastic Deformation Of The Aluminum Ribbon Bond On Molybdenum Layer. - 8th Ieee Region 10 Conference, Tencon 2023. 1288-1292. |
| Khirullah Abdul Hamid, Aiman Hakim Badarisman, Azman Jalar, Maria Abu Bakar. (2022). Investigation Of Integrated Factors In The Occurrence Of Copper Wire Bonding Corrosion Of Semiconductor Packages. - International Conference On Electronic And Advanced Materials 2021 (iceam 2021). 1-5. |
| Aiman Hakim Badarisman, Khirullah Abdul Hamid, Hamizan Ideris, Maria Abu Bakar, Azman Jalar. (2022). Effects Of Molding Temperature On Delamination Of Small Outline Transistor (sot). - International Conference On Electronic And Advanced Materials (iceam 2021). 1-7. |
| Fateh Ameera Mohd Yusoff, Maria Abu Bakar, Azman Jalar. (2022). Effect Of 60% Thickness Reduction Of Sn-cu Solder Alloy On Localized Micromechanical Properties Via Nanoindentation Approach. - International Conference On Electronic And Advanced Materials (iceam 2021). 1-5. |
| P. Vijayakumaran, M. H. M. Ramli, M. Selvam, K. Hamid, A. Atiqah, A. Jalar, M. A. Bakar. (2022). Reduce Wafer Remnants Through Pre-assembly Process Optimization. - International Conference On Electronic And Advanced Materials (iceam 2021). 1-5. |
| Khirullah Abdul Hamid, Aiman Hakim Badarisman, Azman Jalar, Maria Abu Bakar. (2022). Effects Of Electrolyte Towards Copper Wire Metallurgical Interconnection In Semiconductor. - International Conference On Electronic And Advanced Materials (iceam 2021). 1-6. |
| Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, Fakhrozi Che Ani, Zol Effendi Zolkefli. (2022). Effects Of Underfill Materials On Behavior Of Intermetallic Compound Thickness Of Ball Grid Array Solder Joints Using Anova. - 2022 Ieee 39th International Electronics Manufacturing Technology Conference (iemt). 1-5. |
| M. F. Suhaimi, M. Abu Bakar, A. Jalar, F. Che Ani, M. R. Ramli. (2022). Thermal Cycling Effect On The Crack Formation Of Solder Joint In Ball Grid Array Package. - International Conference On Electronic And Advanced Materials (iceam 2021) Journal Of Physics: Conference Series. 1-5. |
| Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, Erwan Basiron, Fakhrozi Che Ani. (2022). Intermetallic Compound Thickness Of Ball Grid Array Solder Joints Under Thermal Cycling Test Using Anova. - 2022 Ieee 39th International Electronics Manufacturing Technology Conference (iemt). 1-4. |
| M. S. Mohamed Sunar, M. Abu Bakar, A. Jalar, F. Che Ani, M . R. Ramli. (2022). Effect Of Stencil Wall Aperture On Solder Paste Release Via Stencil Printing. - International Conference On Electronic And Advanced Materials (iceam 2021) - Journal Of Physics: Conference Series. 1-6. |
| Khirullah Abdul Hamid, Maria Abu Bakar, Azman Jalar, Aiman Hakim Badarisman. (2021). Incorporation Of Big Data In Methodology Of Identifying Corrosion Factors In The Semiconductor Package. - 2021 International Conference On Electrical, Communication, And Computer Engineering (icecce). 1-4. |
| Syed Mohamad Mardzukey Syed Mohamed Zain, Fakhrozi Che Ani, Mohamad Riduwan Ramli, Azman Jalar, Maria Abu Bakar. (2021). Effect Of Moisture Content On Crack Formation During Reflow Soldering Of Ball Grid Array (bga) Component. - The International Conference On Innovative Technology, Engineering And Sciences 2020 (icites 2020). 309-314. |
| Azman Jalar, Syed Mohamad Mardzukey Syed Mohamed Zain, Fakhrozi Che Ani, Mohamad Riduwan Ramli, Maria Abu Bakar. (2021). Effect Of Potting Encapsulation On Crack Formation And Propagation In Electronic Package. - The International Conference On Innovative Technology, Engineering And Sciences 2020 (icites 2020). 351-357. |
| Joon Shyan Tan, Wai Wai Lee, A. Atiqah, Khirullah Abdul Hamid, Azman Jalar, Maria Abu Bakar. (2021). The Effect Of Electrolytic Deflash Current On Delamination Of Epoxy Mold Compound During Tin Plating Process. - 2021 Ieee Regional Symposium On Micro And Noelectronics (rsm). 73-75. |
| Nadia Nor Ahmad Taufiq, Khirullah Abdul Hamid, Aiman Hakim Badarisman, Hamizan Ideris, Azman Jalar, Maria Abu Bakar. (2021). Elucidation Of Metal Etching Defects Through The Experimental Design Process Characterization At Encapsulation And Electro-deflashing Processes. - 2021 Ieee Regional Symposium On Micro And Nanoelectronics (rsm). 69-72. |
| Maria Abu Bakar, Azman Jalar, Norliza Ismail1, Ahmad Ghadafi Ismail, Najib Saedi Ibrahim. (2020). Solderability Of Coloured Lead Free Solder Composite. - 30th Regional Conference Of Solid State Science And Technology (solid State Phenomena). 15-19. |
| Azman Jalar, Maria Abu Bakar, Mohd. Zulhakimi Ab. Razak, Norliza Ismail. (2020). Morphological Effect On The Intermetallic Compound Layer Growth Kinetics Of Metallurgical Joining. - 30th Regional Conference Of Solid State Science And Technology (solid State Phenomena). 26-30. |
| Nur Shafiqa Safee, Wan Yusmawati Wan Yusoff, Ariffin Ismail, Norliza Ismail, Maria Abu Bakar, Azman Jalar. (2020). Effect Of Blast Wave On Intermetallics Formation, Hardness And Reduced Modulus Properties Of Solder Joints. - 30th Regional Conference Of Solid State Science And Technology (solid State Phenomena). 31-36. |
| Norliza Ismail, Maria Abu Bakar, Azman Jalar, Muhammad Amer Hariths Jasmin. (2019). Mechanical Properties Of Sn Based Lead Free Solder Under Different Temperature. - Iop Conference Series: Materials Science And Engineering. 1-5. |
| Maria Abu Bakar, Azman Jalar, Fakhrozi Che Ani. (2023). Pematerian Gelombang Pin Menerusi Lubang. - . 191. |
| N. Ismail, A. Jalar, M.a. Bakar, A. Atiqah. (2022). Recent Progress In Lead-free Solder Technology. - . 21. |
| M.a. Bakar, A. Jalar, A. Atiqah, N. Ismail. (2022). Recent Progress In Lead-free Solder Technology. - . 332. |
| A Atiqah, Fa Sabaruddin, N Ismail, A Jalar, Ma Bakar, Aa Hamzah, Ra Ilyas, M Asrofi. (2022). Industrial Applications Of Nanocellulose And Its Nanocomposites. - . 22. |
| A Atiqah, A. Jalar, M.a. Bakar, N. Ismail. (2022). Recent Progress In Lead-free Solder Technology. - . 332. |
| Norliza Ismail, Azman Jalar, Maria Abu Bakar. (2021). Pematerian Bahan Pateri Bebas Plumbum Berpengisi Karbon Nanotiub. - . 121. |
| Maria Abu Bakar, Azman Jalar. (2018). Teknologi Semikonduktor Dan Nanoelektronik : Perkembangan Dan Kegunaan. - . 32. |
| Roslina Ismail, Maria Abu Bakar, Azman Jalar. (2018). Teknologi Semikonduktor Dan Nanoelektronik: Perkembangan Dan Kegunaan. - . 13. |
| A. Atiqah, N. Ismail, K.k. Lim, A. Jalar, M.a. Bakar, M.a. Maleque, R.a. Ilyas, A.b.m. Supian. (2022). Recycling Of Plastics, Metals, And Their Composites. - . 15. |
| A Atiqah, Fa Sabaruddin, N Ismail, A Jalar, Ma Bakar, Aa Hamzah, Ra Ilyas, M Asrofi. (2022). Industrial Applications Of Nanocellulose And Its Nanocomposites. - . 22. |
| A Atiqah, A. Jalar, M.a. Bakar, N. Ismail. (2022). Recent Progress In Lead-free Solder Technology. - . 332. |
| N. Ismail, A. Jalar, M.a. Bakar, A. Atiqah. (2022). Recent Progress In Lead-free Solder Technology. - . 21. |
| M.a. Bakar, A. Jalar, A. Atiqah, N. Ismail. (2022). Recent Progress In Lead-free Solder Technology. - . 332. |
| Roslina Ismail, Maria Abu Bakar, Azman Jalar. (2018). Teknologi Semikonduktor Dan Nanoelektronik: Perkembangan Dan Kegunaan. - . 13. |
| Maria Abu Bakar, Azman Jalar. (2018). Teknologi Semikonduktor Dan Nanoelektronik : Perkembangan Dan Kegunaan. - . 32. |
| Maria Abu Bakar, Azman Jalar, Fakhrozi Che Ani. (2023). Pematerian Gelombang Pin Menerusi Lubang. - . 191. |
| Norliza Ismail, Azman Jalar, Maria Abu Bakar. (2021). Pematerian Bahan Pateri Bebas Plumbum Berpengisi Karbon Nanotiub. - . 121. |
| Azman Bin Jalar @ Jalil;maria Binti Abu Bakar. (2024). Development Of High Reliability And High Performance Of Interconnection Technology And Materials In Electronic Packaging. - . . |
| Atiqah Binti Mohd Afdzaluddin;azman Bin Jalar @ Jalil;maria Binti Abu Bakar;lim Kar Keng. (2024). Study On Fiber Treatment Process Of Oil-palm Based Nanocellulose Reinforced Thermoplastic Polyurethane For Plastic Encapsulation Of Biomedical Sensor Devices. - . . |
| Azman Bin Jalar @ Jalil;norinsan Kamil Bin Othman;maria Binti Abu Bakar. (2023). Corrosion Prevention Mechanism For Automotive Semiconductor Devices Packaging Via De-sulphuring Process. - . . |
| Maria Binti Abu Bakar;azman Bin Jalar @ Jalil;siow Kim Shyong;ahmad Ghadafi Bin Ismail. (2023). Development Of High Ductility Metallurgical Interconnection In Sn-based Lead-free Solder Joint Via Superplastic-like Approach. - . . |
| Azman Bin Jalar @ Jalil;norinsan Kamil Bin Othman;maria Binti Abu Bakar. (2022). Wedge Bond Corrosion Of Copper Wire Bonding. - . . |
| Azman Bin Jalar @ Jalil;norinsan Kamil Bin Othman;maria Binti Abu Bakar. (2022). Microstructural Characterization Of Copper Wire Bonding In Semiconductor Packaging. - . . |
| Maria Binti Abu Bakar;azman Bin Jalar @ Jalil. (2022). Pencirian Mikrostruktur Dan Sifat Mekanik Sambungan Pateri Pic Halus Dalam Pakej Elektronik. - . . |
| Azman Bin Jalar @ Jalil;mohd Zulhakimi Bin Ab Razak @ Mamat;maria Binti Abu Bakar. (2021). Mikrostruktur Dan Sifat Superplastik Aloi Pateri Bebas Plumbum. - . . |
| Azman Bin Jalar @ Jalil;mohd Zulhakimi Bin Ab Razak @ Mamat;maria Binti Abu Bakar. (2021). Penentuan Sifat Kesuperplastikan Bagi Bahan Aloi Pateri Hijau. - . . |
| Rabiah Al Adawiyah Ab Rahim, Azman Jalar, Maria Abu Bakar, Siow Kim Shyong. (2019). Effect Of Substrate Surface Roughness On The Growth Of Intermetallic Compound Layer Lead Free Solder Joint. - . 1-5. |
| Improvement of solder joint strength via grooving for fine-pitch interconnection in multi-chip module package , Ketua Projek , 01-11-2024 sehingga 31-10-2026 , Universiti |
| Copper-Graphene Interposer as Ballistic Thermal Cooling Mechanism for Die Heat Spreader and Highly Conductive Electrical Interconnect for Wide Band Gap (WBnG) and Ultra-wide Band Gap (UWBnG) Application , Penyelidik Bersama , 01-12-2024 sehingga 30-11-2026 , Kebangsaan |
| Kakisan insfrastruktur keluli karbon disebabkan oleh perubahan iklim dalam persekitaran marin , Penyelidik Bersama , 01-11-2024 sehingga 31-10-2026 , Universiti |
| Characterization of structure-properties-performance for semiconductor packaging and assembly , Penyelidik Bersama , 01-12-2023 sehingga 30-11-2026 , Kebangsaan |
| The Detection of DNA based on Zinc Oxide doped with Aluminium Extended Gate Field Effect Transistors , Penyelidik Bersama , 01-12-2022 sehingga 31-03-2025 , Universiti |
| Fabrikasi dan Pencirian Konduktor berasaskan Karbon Teraktif dengan Substrat Kanji untuk Edibel Elektronik , Penyelidik Bersama , 01-10-2022 sehingga 31-03-2025 , Kebangsaan |
| Pencirian mikrostruktur dan sifat mekanik sambungan pateri pic halus dalam pakej elektronik , Ketua Projek , 01-10-2019 sehingga 31-03-2022 , Kebangsaan |
| Development of high ductility metallurgical interconnection in Sn-based lead-free solder joint via superplastic-like approach , Ketua Projek , 01-09-2019 sehingga 30-11-2022 , Kebangsaan |
| Study of Droplet-based Support Structure for 3D Printed Scaffold Fabrication , Penyelidik Bersama , 01-11-2023 sehingga 30-10-2024 , Kebangsaan |
| Microstructural characterization of copper wire bonding in semiconductor packaging , Penyelidik Bersama , 01-12-2020 sehingga 31-12-2021 , Kebangsaan |
| Mechanism of high performance of UV curable anti-corrosion coating from palm oil-based urethane acrylate with the addition of structured carbon , Penyelidik Bersama , 01-11-2020 sehingga 31-10-2023 , Kebangsaan |
| Corrosion Prevention Mechanism for Automotive Semiconductor Devices Packaging via De-sulphuring Process , Penyelidik Bersama , 01-11-2020 sehingga 30-04-2023 , Kebangsaan |
| Study on Fiber Treatment Process of Oil-Palm Based Nanocellulose Reinforced Thermoplastic Polyurethane for Plastic Encapsulation of Biomedical Sensor Devices , Penyelidik Bersama , 01-10-2020 sehingga 30-09-2023 , Antarabangsa |
| Development of High Reliability and High Performance of Interconnection Technology and Materials in Electronic Packaging , Penyelidik Bersama , 10-07-2020 sehingga 31-12-2023 , Kebangsaan |
| Perencat kakisan hijau daripada ekstrak Etlingera elatior untuk aplikasi sistem perpaipan minyak dan gas , Penyelidik Bersama , 01-10-2019 sehingga 30-09-2022 , Universiti |
| WEDGE BOND CORROSION OF COPPER WIRE BONDING , Penyelidik Bersama , 18-02-2019 sehingga 31-12-2021 , Kebangsaan |
| Penentuan sifat Kesuperplastikan bagi bahan aloi pateri hijau , Penyelidik Bersama , 15-11-2018 sehingga 30-09-2020 , Kebangsaan |
| Mikrostruktur dan sifat superplastik aloi pateri bebas plumbum , Penyelidik Bersama , 15-08-2018 sehingga 14-02-2021 , Kebangsaan |
| Kromatositi Antarasambungan Pasca Pematerian Komposit Hijau Pes Aloi Pateri , Penyelidik Bersama , 15-08-2017 sehingga 14-08-2019 , Kebangsaan |
| Anugerah Perkhidmatan Cemerlang / Anugerah Perkhidmatan Cemerlang , 2022 |
| Anugerah Pingat Emas , 2024 |
| Best Paper Award in Encapsulation Materials and echnology , 2022 |
| Best Research Book Award , 2022 |
| Best Paper Award in Solder and Soldering , 2022 |
| Industry-Academia Paper Collaboration Paper Award , 2022 |
| Best Student Paper Award , 2021 |
| Best Student Paper Award , 2021 |
| PENYAHWARNAAN DAN KEMEROSOTAN STRUKTUR SAMBUNGAN BAJI PADA RANGKA KAKI PAKEJ SEMIKONDUKTOR, ABDUL AZIZ BIN OMAR, Sarjana |
| KESAN PERMUKAAN DAN BENTUK BUKAAN TERHADAP PRESTASI PERCETAKAN STENSIL BAGI PEMATERIAN KOMPONEN PIC HALUS, MOHAMAD SOLEHIN BIN MOHAMED SUNAR, Sarjana |
| AHMAD SYAZILI MD DIN, Sarjana |
| MUHAMMAD FIRDAUS BIN SUHAIMI, Sarjana |
| NURHANANI BINTI AHMAD, Sarjana |
| MOHD HATTA BIN MOHD SOPIAN, Sarjana |
| UJIAN KELEMBAPAN DAN KEWUJUDAN RETAK PADA EPOKSI PEMPAKEJAN TATASUNAN GRID BEBOLA, SYED MOHAMAD MARDZUKEY BIN SYED MOHAMED ZAIN, Sarjana |
| LIM EE MAY, Sarjana |
| Kesan Pelindung Haba Terhadap Kewujudan Retak Semasa Kerja Semula Sambungan, ADLIL AIZAT BIN ISMAIL, Sarjana |
| EFFECT OF PROCESS HEAT TEMPERATURE AND TIME ON BONDABILITY BETWEEN, AHMAD ZARIF BIN AZAHAR, Sarjana |
| PENGAWALAN MIKROTRUKTUR DAN SIFAT KEKERASAN ALOI PATERI SN-0.7CU, FATEH AMERA BINTI MOHD YUSOFF, Sarjana |
| KAKISAN DAN DEGRADASI STRUKTUR PEMPAKEJAN PERANTI SEMIKONDUKTOR AUTOMOTIF, NURUL SYAFIQAH AFIQ BINTI ROSLI, Sarjana |
| DEVELOPMENT OF ACCELERATED MODELING FOR RELIABILITY CHARACTERIZATION, MOHD ERWAN BIN BASIRON, Sarjana |
| MUHAMMAD NIZAM BIN ILIAS, Sarjana |
| Reliability Assessment for Corrosion on Cu-Al and Cu-Ag system, SARASWATHY SUPRAMANIAM, Doktor Falsafah |
| SAZAN ALI KAMAL MOHAMMED, Doktor Falsafah |
| WANG LINGHAO, Doktor Falsafah |
| Perincian dan kebolehpercayaan pada sambungan pateri komponen BGA dengan Penggunaan Pelbagai Jenis Pemindahan Haba untuk Kaedah Proses Kerjasemula, ADLIL AIZAT BIN ISMAIL, Doktor Falsafah |
| RAIMI ADEPOJU MUFUTAU, Doktor Falsafah |
| Synthetic-switching Energy Storage Devise Based on Green Polymeric Material, BALOGUN BASHIR TEMITOPE, Doktor Falsafah |
| Defect Minimization and Process Improvement in SMT Lead-Free Solder Paste Printing: A Comparative Study , 10-06-2019 sehingga 01-01-1970 , Antarabangsa |
| Defect Minimization and Process Improvement in SMT Lead-Free Solder Paste Printing: A Comparative Study , 10-06-2019 sehingga 01-01-1970 , Antarabangsa |
| Defect Minimization and Process Improvement in SMT Lead-Free Solder Paste Printing: A Comparative Study , 10-06-2019 sehingga 01-01-1970 , Antarabangsa |
| Persatuan Penyelidikan Pempakejan Elektronik (EPRS) , 22-05-2017 sehingga 21-05-2019 , Kebangsaan |
| Influence of tin multilayer on Sn-3.0Ag-0.5Cu (SAC305) based solder joint interface , 08-11-2019 sehingga 22-11-2019 , Antarabangsa |
| Penyeliaan Sangkutan Pelajar dari Universitas Pendidikan Indonesia (UPI) , 17-06-2019 sehingga 12-07-2019 , Antarabangsa |
| Retardation effect of tin multilayer on Sn-3.0Ag-0.5Cu (SAC305) based solder joint interface , 08-01-2020 sehingga 22-01-2020 , Antarabangsa |
| Feasibility Study on Microwave Welding of Thermoplastic using Multiwalled Carbon Nanotubes as Susceptor , 09-04-2020 sehingga 27-04-2020 , Antarabangsa |
| The Malaysian Solid State Science and Technology Society , 21-10-2020 sehingga 21-10-2050 , Kebangsaan |
| ADLIL AIZAT BIN ISMAIL , 14-10-2020 sehingga 14-10-2020 , Kebangsaan |
| SITI NORBILAH BINTI ABDUL MANAFF , 02-10-2019 sehingga 02-10-2019 , Kebangsaan |
| SYED MOHAMAD MARDZUKEY BIN SYED MOHAMED ZAIN , 06-09-2019 sehingga 06-09-2019 , Kebangsaan |
| AHMAD SYAZILI MD DIN , 03-09-2019 sehingga 03-09-2019 , Kebangsaan |
| MOHAMAD SOLEHIN BIN MOHAMED SUNAR , 22-08-2019 sehingga 22-08-2019 , Kebangsaan |
| MOHD HATTA BIN MOHD SOPIAN , 22-07-2019 sehingga 22-07-2019 , Kebangsaan |
| PERSATUAN PENYELIDIKAN PEMPAKEJAN ELEKTRONIK , 18-06-2019 sehingga 17-06-2021 , Kebangsaan |
| Western Digital Malaysia Sdn Bhd , 10-07-2020 sehingga 09-07-2023 , Kebangsaan |
| Project review for Postgraduate Program with UKM , 25-11-2020 sehingga 25-11-2020 , Kebangsaan |
| NEXPERIA (ATSN TECHNICAL FORUM 2020) , 25-09-2020 sehingga 25-09-2020 , Kebangsaan |
| Training on Scientific Paper Writing , 10-06-2020 sehingga 11-06-2020 , Kebangsaan |
| Workshop on application of scientific paper writing for engineer , 16-06-2020 sehingga 16-06-2020 , Kebangsaan |
| Workshop on application of scientific paper writing for engineer , 23-06-2020 sehingga 23-06-2020 , Kebangsaan |
| Workshop on application of scientific paper writing for engineer , 30-06-2020 sehingga 30-06-2020 , Kebangsaan |
| Technical Committee Member NANOSYM2021 , 11-10-2021 sehingga 13-10-2021 , Antarabangsa |
| PERSATUAN PENYELIDIKAN PEMPAKEJAN ELEKTRONIK , 26-04-2021 sehingga 25-04-2023 , Kebangsaan |
| 7th INTERNATIONAL CORROSION PREVENTION VIRTUAL SYMPOSIUM FOR RESEARCH SCHOLARS , 17-11-2021 sehingga 17-11-2021 , Antarabangsa |
| EPRS SYMPOSIUM 2021 , 23-10-2021 sehingga 23-10-2021 , Kebangsaan |
| Effect of Water Content on Chromium Electrodeposition using Choline Chloride based Deep Eutectic Solvent , 17-11-2021 sehingga 17-11-2021 , Antarabangsa |
| MECHANICAL AND CORROSION PROPERTIES INVESTIGATION OF Sn-9Zn SOLDER WITH THE ADDITIONS OF NICKEL-COATED PRECIPITATED CALCIUM CARBONATE , 17-11-2021 sehingga 17-11-2021 , Antarabangsa |
| Effectiveness of Sodium Dodecylbenzene Sulfonate: Zinc Sulfate as Corrosion Inhibitors for Mild Steel in Sodium Chloride Solution , 17-11-2021 sehingga 17-11-2021 , Antarabangsa |
| PERSATUAN PENYELIDIKAN PEMPAKEJAN ELEKTRONIK , 26-04-2021 sehingga 25-04-2023 , Kebangsaan |
| JUDGE FOR ELECTRONIC PACKAGING AND ASSEMBLY SCIENTIFIC DISCOURSE AND COMPETITION 2021 , 15-03-2022 sehingga 31-03-2022 , Kebangsaan |
| Industry-Academia Paper Collaboration Paper Award , 25-04-2022 sehingga 01-01-1970 , Kebangsaan |
| Best Paper Award in Solder and Soldering , 25-04-2022 sehingga 01-01-1970 , Kebangsaan |
| Best Paper Award in Encapsulation Materials and echnology , 25-04-2022 sehingga 01-01-1970 , Kebangsaan |
| Best Research Book Award , 25-04-2022 sehingga 01-01-1970 , Kebangsaan |
| Best Student Paper Award , 02-11-2021 sehingga 01-01-1970 , Antarabangsa |
| Bonding mechanism in ultrasonic-assisted soldering of ZrO2 and stainless steel using Mg and Al as microalloying active elements , 17-05-2022 sehingga 27-06-2022 , Antarabangsa |
| Vol. 84 No. 6-2: Sciences & Engineering (Nanotechnology Malaysia Biennial Symposium 2021, NanoSym 2021) , 01-01-2022 sehingga 31-10-2022 , Kebangsaan |
| Taklimat Kerjaya Industri Pembuatan Anjuran Jabatan Fizik Gunaan, FST , 26-11-2022 sehingga 26-11-2022 , Kebangsaan |
| Microstructural and mechanical evolution of sintered nano-silver joints on bare copper substrates during high-temperature storage , 16-12-2022 sehingga 16-01-2023 , Antarabangsa |
| Microstructure effects on the thermal fatigue of solder joints: coupling damage measurements with multi-scale modelling , 21-11-2023 sehingga 05-12-2023 , Antarabangsa |
| Technical Committee of 2024 11th International Conference on Electrical and Electronics Engineering (ICEEE 2024) , 07-07-2023 sehingga 24-04-2024 , Antarabangsa |
| Thermal deformationbehavior and microstructural evolution mechanism of TC4 titanium alloy based on hot processing map , 26-02-2024 sehingga 21-03-2024 , Antarabangsa |
| Persatuan Penyelidikan Pempakejan Elektronik (EPRS) , 17-06-2023 sehingga 16-06-2025 , Kebangsaan |
| Anugerah Pingat Emas , 25-04-2024 sehingga 01-01-1970 , Kebangsaan |
| Anugerah Pingat Emas , 25-04-2024 sehingga 01-01-1970 , Kebangsaan |
| Anugerah Pingat Emas , 25-04-2024 sehingga 01-01-1970 , Kebangsaan |
| Effect of minor Sb addition on microstructure, interfacial behavior and mechanical properties of Sn 15Bi solder joints , 21-03-2024 sehingga 10-04-2024 , Antarabangsa |
| Simplifying Finite Elements Analysis of Four-Point Bending Tests for Flip Chip microcomponents , 06-12-2023 sehingga 05-01-2025 , Antarabangsa |
| Unveiling the influence of aluminum incorporation on the structural, optical, and magnetic characteristics of Gd-doped ZnO , 10-05-2024 sehingga 19-05-2024 , Antarabangsa |
| Best Student Paper Award , 02-11-2021 sehingga 01-01-1970 , Kebangsaan |
| TIN SOLDER TECHNOLOGY RESEARCHERS GROUP (TSTRG) , 03-04-2023 sehingga 31-12-2025 , Kebangsaan |
| AHLI JAWATANKUASA JAMINAN KUALITI IMEN , 18-07-2021 sehingga 19-07-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| AHLI JAWATANKUASA MAJLIS SAMBUTAN 20 TAHUN IMEN , 19-05-2023 sehingga 19-05-2023 , Fakulti / Institut / Pusat Perkhidmatan |
| AHLI PENGURUSAN IMEN , 13-10-2022 sehingga 12-10-2023 , Fakulti / Institut / Pusat Perkhidmatan |
| AKREDITASI PROGRAM PENGAJIAN INSTITUT KEJURUTERAAN MIKRO DAN NANOELEKTRONIK (IMEN) , 01-12-2021 sehingga 30-04-2023 , Fakulti / Institut / Pusat Perkhidmatan |
| ASM SCIENCE JOURNAL SPECIAL ISSUE ON MICROENGINEERING AND NANOELECTRONICS , 22-03-2019 sehingga 01-01-1970 , Fakulti / Institut / Pusat Perkhidmatan |
| Ahli Jawatankuasa Pengurus-PTj UKMFolio , 11-09-2020 sehingga 01-01-1970 , Universiti |
| BENGKEL SEMAKAN KURSUS IMEN , 04-07-2024 sehingga 04-07-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| BENGKEL STRATEGIK IMEN SIRI 1 , 03-11-2022 sehingga 03-11-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA MAJLIS MENANDATANGANI MEMORANDUM PERSEFAHAMAN ANTARA INFINEON TECHNOLOGIES DAN IMEN UKM , 01-06-2023 sehingga 23-06-2023 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA PATEN NYCU – GaN (FAST CHARGING) , 16-10-2023 sehingga 15-10-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA SEMAKAN PROGRAM IMEN , 01-01-2023 sehingga 31-12-2025 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA TASKFORCE PENUBUHAN PUSAT KECEMERLANGAN BERKAITAN INDUSTRI SEMIKONDUKTOR ELEKTRONIK , 30-10-2023 sehingga 29-10-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA TEXAS INSTRUMENT MELAKA-MIDA- INSTITUT KEJURUTERAAN MIKRO DAN NANOELEKTRONIK (IMEN) , 02-01-2024 sehingga 31-12-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Akreditasi Program Pengajian IMEN , 01-03-2019 sehingga 28-02-2021 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Jaminan Kualiti IMEN , 01-01-2019 sehingga 31-12-2020 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Jaminan Kualiti IMEN , 01-01-2019 sehingga 31-12-2020 , Fakulti / Institut / Pusat Perkhidmatan |
| Kolokium Siswazah IMEN 2020 , 01-01-2020 sehingga 31-12-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| Kolokium Siswazah IMEN 2022 , 21-07-2022 sehingga 21-07-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| LAWATAN PROFESOR DR. MUNAWAR IQBAL KE IMEN , 01-08-2024 sehingga 07-08-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| MAJLIS MENANDATANGANI MEMORANDUM PERSEFAHAMAN ANTARA PROVIDENCE GREENTECH PTE LTD DAN INFINEON TECHNOLOGIES (M) SDN BHD DENGAN IMEN , 29-11-2024 sehingga 01-12-2025 , Fakulti / Institut / Pusat Perkhidmatan |
| NANOTECHNOLOGY MALAYSIA ANNUAL SYMPOSIUM (NANOSYM 2021) , 05-08-2021 sehingga 31-10-2021 , Fakulti / Institut / Pusat Perkhidmatan |
| NANOTECHNOLOGY MALAYSIA ANNUAL SYMPOSIUM (NANOSYM 2021) , 11-10-2021 sehingga 13-10-2021 , Universiti |
| PENILAI BEBAS KOLOKIUM SISWAZAH IMEN 2021 , 31-05-2021 sehingga 14-07-2021 , Fakulti / Institut / Pusat Perkhidmatan |
| PENILAI BEBAS KOLOKIUM SISWAZAH IMEN 2022 , 21-07-2022 sehingga 21-07-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| PROGRAM SEMICONDUCTOR INDUSTRY SYMPOSIUM & SHOWCASE 2024 , 08-04-2024 sehingga 28-05-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| Pengurusan IMEN 2024 , 13-10-2023 sehingga 12-10-2025 , Fakulti / Institut / Pusat Perkhidmatan |
| Penyelia Pelajar Latihan Industri FST , 22-03-2021 sehingga 30-07-2021 , Fakulti / Institut / Pusat Perkhidmatan |