|
azman bin jalar @ jalil;maria binti abu bakar. (2024). development of high reliability and high performance of interconnection technology and materials in electronic packaging. - . . |
|
azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar. (2023). corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process. - . . |
|
maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail. (2023). development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach. - . . |
|
maria abu bakar, mohamad solehin mohamed sunar, azman jalar, a atiqah, fakhrozi che ani, ibrahym ahmad, zol effendi zolkefli. (2023). effect of sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications. - sains malaysiana. 3247-3258. |
|
sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, maria abu bakar, wan nursheila wan jusoh, hassan basher, michael daenen. (2023). effect of ultrasonic process parameter on resistance and plastic deformation of the aluminum ribbon bond on molybdenum layer. - 8th ieee region 10 conference, tencon 2023. 1288-1292. |
|
saraswathy supramaniam, maria abu bakar, a. atiqah, azman jalar, mohd zulhakimi ab. razak. (2023). moisture content and early corrosion detection of cu wire bonding in a semiconductor package. - journal of failure analysis and prevention. 2362-2369. |
|
saraswathy supramaniam, subashini periasamy, muhammad nurhisham, maria abu bakar, azman jalar. (2023). measurement of aluminium remnant thickness on copper wire bonding using 3d laser scanning microscope. - ieee international symposium on the physical and failure analysis of integrated circuits (ipfa). 1-6. |
|
maria abu bakar, azman jalar, fakhrozi che ani. (2023). pematerian gelombang pin menerusi lubang. - . 191. |
|
fateh amera mohd yusoff, maria abu bakar, azman jalar. (2023). effect of thermomechanical treatment on microstructural and localized micromechanical properties of sn0.7cu solder alloy. - green materials and electronic packaging interconnect technology symposium (epits 2022). 133-144. |
|
adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, zol effendi zolkefli, erwan basiron. (2023). thermal management on the solder joints of adjacent ball grid array (bga) rework components using laser soldering. - green materials and electronic packaging interconnect technology symposium (epits 2022). 103-113. |