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copper-graphene interposer as ballistic thermal cooling mechanism for die heat spreader and highly conductive electrical interconnect for wide band gap (wbng) and ultra-wide band gap (uwbng) application
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01-12-202430-11-2026
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Penyelidik Bersama
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ultra-high through-plane nanocarbon/polymer based tim based thermal interface materials for high power devices
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01-01-202630-09-2026
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Ketua Projek
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interface adhesion and structure modification of functionalized graphene and carbon nanotubes composite as thermal interface materials for efficient heat dissipation process
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01-10-202331-03-2026
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Ketua Projek
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fabrication and analysis of piezoelectric nanogenerator using pvdf and zero-dimensional material via electrospinning for smart textile applications
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01-07-202430-09-2025
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Penyelidik Bersama
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ganjaran penerbitan : k025601
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11-02-2026
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Ketua Projek
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